초록 ▼

A remote power switching system capable of detecting the emission of infrared thermal energy from a human body or other objects and automatically controlling a supply of power to electric equipment is provided. A controller unit having a switching unit capable of connecting to a source of power and

A remote power switching system capable of detecting the emission of infrared thermal energy from a human body or other objects and automatically controlling a supply of power to electric equipment is provided. A controller unit having a switching unit capable of connecting to a source of power and controlling the output of power to a device that utilizes the power, incorporates a wireless receiver unit for receiving control signals to operate the switching unit. The controller unit can further include electronic prongs and electrical receptacles for providing a plug in connection for the device to be controlled. A remote controller that can be portable and of hand size has a first sensor unit for determining the presence of an object that intrudes within the predetermined zone. A transmitter unit can transmit a wireless signal when a control unit receives a signal from the first sensor unit. A second sensor unit can determine ambient light conditions which can also be considered by the control unit in determining the appropriateness of sending a wireless signal. Finally, control members can be used to delay the activation of the remote controller for a predetermined time period.

대표청구항 ▼

A remote power switching system capable of detecting the emission of infrared thermal energy from a human body or other objects and automatically controlling a supply of power to electric equipment is provided. A controller unit having a switching unit capable of connecting to a source of power and

A remote power switching system capable of detecting the emission of infrared thermal energy from a human body or other objects and automatically controlling a supply of power to electric equipment is provided. A controller unit having a switching unit capable of connecting to a source of power and controlling the output of power to a device that utilizes the power, incorporates a wireless receiver unit for receiving control signals to operate the switching unit. The controller unit can further include electronic prongs and electrical receptacles for providing a plug in connection for the device to be controlled. A remote controller that can be portable and of hand size has a first sensor unit for determining the presence of an object that intrudes within the predetermined zone. A transmitter unit can transmit a wireless signal when a control unit receives a signal from the first sensor unit. A second sensor unit can determine ambient light conditions which can also be considered by the control unit in determining the appropriateness of sending a wireless signal. Finally, control members can be used to delay the activation of the remote controller for a predetermined time period. method of constructing the at least one ball grid array semiconductor package of claim 27, wherein providing the plurality of connective elements comprises providing at least one connective element of the plurality of connective elements with a solder ball accommodating contact pad. 29. The method of constructing the at least one ball grid array semiconductor package of claim 25, wherein providing the plurality substrate bond pads, providing the substrate with the first plurality of circuit traces, providing the substrate with the second plurality of circuit traces, and providing the plurality of test pads comprises attaching at least a portion of a tape to the substrate having at least the plurality of substrate bond pads, the first plurality of circuit traces, the second plurality of circuit traces, and the plurality of test pads preformed thereon. 30. The method of constructing the at least one ball grid array semiconductor package of claim 29, wherein providing the plurality of connective elements comprises providing at least one connective element of the plurality of connective elements with a solder ball contact pad having a concave surface for accommodating a solder ball. 31. The method of constructing the at least one ball grid array semiconductor package of claim 30, further comprising burning-in and testing the at least one semiconductor device by applying electrical energy to selec