$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Air jet cooling arrangement for electronic systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0845545 (2001-04-30)
발명자 / 주소
  • Beitelmal, Abdlmonem H
  • Patel, Chandrakant D.
출원인 / 주소
  • Hewlett-Packard Company
인용정보 피인용 횟수 : 49  인용 특허 : 15

초록

An air cooled electronic system within an enclosure simultaneously provides different levels of cooling in response to the individual cooling needs of the various electronic components. In one embodiment, electronic system includes a plenum that has an inlet and a plurality of outlets with the inlet

대표청구항

An air cooled electronic system within an enclosure simultaneously provides different levels of cooling in response to the individual cooling needs of the various electronic components. In one embodiment, electronic system includes a plenum that has an inlet and a plurality of outlets with the inlet

이 특허에 인용된 특허 (15)

  1. Ester Charles E. (Glendale AZ), Air distribution system.
  2. Gee Arthur (Niagara Falls NY) Largo Edward J. (Phoenix AZ) Plesinger Boris M. (Phoenix AZ), Air distribution system.
  3. Bartilson, Bradley W.; Jirak, James J., Air distribution system and manifold for cooling electronic components.
  4. Stuckert Paul E. (Katonah NY), Air jet powered cooling system for electronic assemblies.
  5. Patel Chandrakant D. ; Wagner Guy ; Beitelmal Abdlmonem H. ; Chavez Gustavo A., Apparatus and method for air-cooling an electronic assembly.
  6. Criss-Puszkiewicz Cynthia Rae ; Beadel John Leagh ; Haefeli Paul Scott ; Parrott Gregory Hopkins ; Tedsen Kirk Arnim, Central forced air cooling of a gaming machine.
  7. Antonuccio Robert S. ; Stewart Thomas E. ; Spano Joseph M. ; Palazola Mathew J. ; Izzicupo William A. ; Carney James M. ; Gonsalves Daniel D. ; Pugliese Mark R., Computer with high airflow and low acoustic noise.
  8. Denneny ; Jr. James A. (Scottsdale AZ) Rowland Charles M. (Phoenix AZ), Cooling control system apparatus and method.
  9. Anderson Paul H. ; Geddes A. James ; Boyd Thomas A., Cooling duct for a computer cooling system with redundant air moving units.
  10. Suzuki Masahiro (Kawasaki JPX) Fujisaki Akihiko (Kawasaki JPX) Ishimine Junichi (Kawasaki JPX), Cooling structure for integrated circuit element modules, electronic device and heat sink block.
  11. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Directed air management system for cooling multiple heat sinks.
  12. Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
  13. Eberhardt Anthony N. ; Dailey William L. ; Harada John A., Hard disk drive assembly which has a plenum chamber and a fan assembly that is perpendicular to a rack chamber.
  14. Lee Richard (7F ; No. 152-1 ; Sec. 7 ; Chung Shan N. Rd. Taipei TWX), Heat dissipating apparatus.
  15. Smith Grant M. (Bryn Athyn PA) Romania Samuel R. (Phoenixville PA) Gibbs Ronald T. (King of Prussia PA), Parallel-flow air system for cooling electronic equipment.

이 특허를 인용한 특허 (49)

  1. Buvid, Daniel J.; Campbell, Eric J.; Jandt, Tyler; Kuczynski, Joseph, Active perforation for advanced server cooling.
  2. Buvid, Daniel J.; Campbell, Eric J.; Jandt, Tyler; Kuczynski, Joseph, Active perforation for advanced server cooling.
  3. Joshi,Shrikant Mukund; Bhatti,Mohinder Singh, Air cooled computer chip.
  4. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  5. Czamara, Michael P.; Morales, Osvaldo P., Compressed air cooling system for data center.
  6. Miyahira,Frank, Computer equipment temperature control system and methods for operating the same.
  7. Manahan, Joseph Michael; DeCarr, Graig E., Controlling airflow within an explosion-proof enclosure.
  8. Morales, Osvaldo P., Cooling air stack for computer equipment.
  9. Morales, Osvaldo P., Cooling air stack for computer equipment.
  10. Miyahara, Munetoshi; Sawai, Jun, Cooling duct and electronic apparatus.
  11. Czamara, Michael P.; Eichelberg, John W., Cooling electrical systems based on power measurements.
  12. Downing, Robert Scott, Efficient cooling duct.
  13. Pawar, Rahul; Karnbach, Rob S, Electrical switchgear system.
  14. Chen, Ming-Chih; Chuang, Chen-Hsien; Chou, Wei-Cheng, Electronic device.
  15. Dong, Yuan; Zhai, Liqian; Chi, Shanjiu; Zhao, Jun, Electronic equipment cooling system with auxiliary cooling device.
  16. Alvarado, Daniel; Shelnutt, Austin Michael, Embedded chassis ducting system for parallelizing airflow through components oriented in series.
  17. Kuo,Yi Lung, Fan for cooling a computer.
  18. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof.
  19. Bourgeois, Richard Scott; Gudlavalleti, Sauri; Quek, Shu Ching; Hasz, Wayne Charles; Powers, James Daniel, Fuel cell system with separating structure bonded to electrolyte.
  20. Cole,Joseph W., Gaming device cooling system.
  21. Chen,Yin Hung, Heat dissipating structure for computer casing.
  22. Wang, Yu-Hsuan; Hsu, Chung-Kai; Liu, Chia-Yang, Heat dissipation module.
  23. Chen, Yun Lung, Heat dissipation system.
  24. Yu, Zhihai Zack; Lee, Tommy C., Heat exchanger system and method for circulating external air about a chipset.
  25. Tsai, Chung Yen, High efficiency heat dissipated power supply.
  26. Hoffman, Christopher J.; O'Connor, Kevin, High velocity air cooling for electronic equipment.
  27. Dalheimer, Volker, Housing system for housing electronic components, especially flat desktop PC or multimedia housing.
  28. Dangler, John Richard; Doyle, Matthew Stephen; Kidd, Thomas Donald; Kuczynski, Joseph; Splittstoesser, Kevin Albert; Tofil, Timothy Jerome, Implementing impedance gradient connector for board-to-board applications.
  29. Booth, Dwight; Haynes, Joseph, Internally directed air jet cooling for a hydraulic pump.
  30. Craft, Jr.,Thomas Francis, Jet impingement cooling apparatus and method.
  31. Patel,Chandrakant D, Longitudinally cooled electronic assembly.
  32. Ong, Brett C.; Olesiewicz, Timothy W.; Willis, Clifford B., Low airflow impedance PCBA handling device.
  33. Manahan, Joseph Michael; DeCarr, Graig E., Manifold for controlling airflow within an explosion-proof enclosure.
  34. Beitelmal, Abdlmonem H.; Patel, Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  35. Beitelmal, Abdlmonem H.; Patel, Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  36. Hoffmann, Christopher J.; Barber, Jim; Snell, Rodney, Mobile broadband communications system, such as a deployable self-contained portable system.
  37. Anzai, Masato; Kanada, Yoshihisa; Noda, Shinsuke; Tanaka, Kenichi, Modular personal computer, connection device for modular personal computer, method of cooling modular personal computer, and personal computer system.
  38. Yi Lung,Kuo, Placement structure of an integrated motherboard for small form factor computer.
  39. Leigh, Kevin B; Megason, George D; Sherrod, David W, Plenums for removable modules.
  40. DeCarr, Graig E.; Barbuto, Samuel T.; Manahan, Joseph Michael, Programmable temperature controller for hazardous location enclosures.
  41. Czamara, Michael P., Rack-mounted air directing device with scoop.
  42. Schrempp, Michael W.; Corddry, Matthew T.; Frink, Darin Lee; Ross, Peter G.; Morales, Osvaldo P., Rack-mounted computer system with shock-absorbing chassis.
  43. Buchholz, Ampy; Barber, Jim; Forman, Bob; Hoffmann, Christopher J.; Frisbee, Robert; Kawasaki, Charlie; O'Connor, Kevin, Self-contained portable broadband communication system.
  44. Hoffmann, Christopher J.; Barber, Jim; Snell, Rodney, Self-contained portable broadband communications system.
  45. Beitelmal,Abdlmonem H.; Patel,Chandrakant D.; Bash,Cullen E., Small form factor air jet cooling system.
  46. Gordin, Myron; Crookham, Joe P., Solid state light fixture with cooling system with heat rejection management.
  47. Dey, Subhrajit; Moeleker, Petrus Joannes Joseph; Balan, Chellappa, System and method for cooling electronic systems.
  48. Dey,Subhrajit (nmn); Moeleker,Petrus Joannes Joseph; Balan,Chellappa (nmn), System and method for cooling electronic systems.
  49. Springs, Charles Nakia; Lindsay, Joseph James; Gregory, Shelton George, System for supplying cooling air from sub-floor space.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로