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Polymer and ceramic composite electronic substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G02B-006/00
  • H05K-001/03
  • B32B-005/16
출원번호 US-0606359 (2000-06-29)
발명자 / 주소
  • Berger, Daniel George
  • Farooq, Shaji
  • Herron, Lester Wynn
  • Humenik, James N.
  • Knickerbocker, John Ulrich
  • Pasco, Robert William
  • Perry, Charles H.
  • Sachdev, Krishna G.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Blecker, Ira D.
인용정보 피인용 횟수 : 76  인용 특허 : 19

초록 ▼

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material

대표청구항 ▼

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material

이 특허에 인용된 특허 (19)

  1. Moh Kyung H. (Woodbury MN) Hoyle Charles D. (Stillwater MN) Boyer ; III Charles E. (Oakdlae MN), Ceramic composite for electronic applications.
    상세보기
  2. Horn ; III Allen F. (Danielson CT) Bush Robert L. (Phoenix AZ) St. Lawrence Michael E. (Thompson CT), Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coe.
    상세보기
  3. Arthur David J. (Norwood MA) Horn ; III Allen F. (Danielson CT), Ceramic filled fluoropolymeric composite material.
    상세보기
  4. Horn ; III Allen F. ; Traskos Richard R. ; Allen David A., Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates.
    상세보기
  5. Johnson Daniel D. (Yorklyn DE), Dielectric materials.
    상세보기
  6. Arthur David J. (Norwood MA) Mosko John C. (Wilmington DE) Jackson Connie S. (Thompson CT) Traut G. Robert (Killingly CT), Electrical substrate material.
    상세보기
  7. Sato Yasuyuki (Iwai JPX) Saito Shinji (Hashima JPX) Yamauchi Hidetoshi (Anpachi JPX), Electronic circuit substrates.
    상세보기
  8. Horiuchi Michio,JPX ; Takeuchi Yukiharu,JPX ; Harayama Yoichi,JPX, Fired body for manufacturing a substrate.
    상세보기
  9. Horn ; III Allen F. (Danielson CT), Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant.
    상세보기
  10. Hughes O. Richard (Chatham NJ) Kim Hongkyu (Oberursel DEX) Wingefeld Gerd (Hofheim DEX), Injection moldable ceramic and metallic compositions and method of preparing the same.
    상세보기
  11. Baise Arnold I. (Wappingers Falls NY) Bryant Ray M. (Poughquag NY) Casey Jon A. (Poughkeepsie NY) Dam Allen J. (Pine Plains NY) Dunkel Werner E. (LaGrangeville NY) Humenik James N. (LaGrangeville NY), Low dielectric composite substrate.
    상세보기
  12. Arthur David J. (Norwood MA) Swei Gwo S. (Northboro MA) Horn ; III Allen F. (Danielson CT) Kilhenny Brett (Storrs CT), Low volume fraction ceramic filled fluoropolymeric composite material.
    상세보기
  13. Smith W. David (Abington CT) Olenick John A. (Thompson CT) Barton Carlos L. (Brooklyn CT) Cercena Jane L. (Ashford CT) Navarro Daniel J. (Putnam CT) Olenick Kathleen R. (Thompson CT) Kneeland Angela , Method of manufacture multichip module substrate.
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  14. St. Lawrence Michael E. (Thompson CT) Landi Vincent R. (Danielson CT) Hand Doris I. (Dayville CT) Walker Robert H. (Phoenix AZ) Gazit Samuel (Bet Lechem HaGlilit ILX) Miskiavitch Raymond R. (Putnam C, Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof.
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  15. Walpita Lakshaman M. ; Ahern Michael R., Polymeric compositions having a temperature-stable dielectric constant.
    상세보기
  16. Horiuchi Michio,JPX ; Takeuchi Yukiharu,JPX, Porous ceramic impregnated wiring body.
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  17. Dalman David A. (Midland MI), Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof.
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  18. Acocella John (Hopewell Junction NY) Agostino Peter A. (Canaan NY) Baise Arnold I. (Wappingers Falls NY) Bates Richard A. (Wappingers Falls NY) Bryant Ray M. (Poughquag NY) Casey Jon A. (Poughkeepsie, Process for fabricating a low dielectric composite substrate.
    상세보기
  19. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Thermally conductive, electrically insulative laminate.
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  3. Bellman, Robert Alan; Bookbinder, Dana Craig; Manley, Robert George; Mazumder, Prantik; Chang, Theresa; Domey, Jeffrey John; Stephens, II, Alan Thomas, Bulk annealing of glass sheets.
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  4. Kimura,Masahiro, Ceramic structure and nonreciprocal circuit device.
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  5. Kimura,Masahiro, Ceramic structure, method for manufacturing ceramic structure, and nonreciprocal circuit device.
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  6. Sung, Je Hong; Kim, Jin Waun; Chang, Myung Whun, Ceramic substrate and manufacturing method thereof.
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  7. Tang, John, Ceramic/organic hybrid substrate.
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  8. Murai, Makoto; Usui, Ryosuke, Circuit board.
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  9. Nakasato, Mayumi; Mizuhara, Hideki; Usui, Ryosuke, Circuit device, a method for manufacturing a circuit device, and a semiconductor module.
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  10. Paul, Sankar K.; Caisse, Christopher J.; Baars, Dirk M.; Horn, III, Allen F., Circuit materials, circuits laminates, and method of manufacture thereof.
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  11. Quantrille, Thomas E.; Rogers, William M., Composite materials and devices comprising single crystal silicon carbide heated by electromagnetic radiation.
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  12. Quantrille, Thomas E.; Rogers, William M., Composite materials and devices comprising single crystal silicon carbide heated by electromagnetic radiation.
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  13. Cermignani, William; Panalone, III, Joseph; Doolin, Leonard J., Composite pre-preg ply having tailored dielectrical properties and method of fabrication thereof.
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  18. Hamren,Steven L.; Cram,Daniel P., Electronic component assemblies with electrically conductive bonds.
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  19. Redfern, Sean Matthew; Miller, James Joseph; St. John, Paul Ronald, Entry sheet for drilling holes in printed circuit boards.
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  21. Modi, Mitul B.; Brusso, Patricia A.; Cadena, Ruben; McCormick, Carolyn R.; Subramanian, Sankara J., Flexible core for enhancement of package interconnect reliability.
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  23. Kitahara, Takahiro; Kino, Tomohiro; Sato, Megumi; Fujita, Eiji, Fluoropolymer and composition thereof.
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  25. Japp,Robert M.; Markovich,Voya R.; Papathomas,Kostas I., Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same.
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  46. Japp,Robert M.; Memis,Irving; Papathomas,Kostas I., Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion.
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  48. Hamren,Steven L.; Cram,Daniel P., Methods for processing semiconductor devices in a singulated form.
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  54. Maljkovic, Nikica, Neck polymeric ammunition casing geometry.
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  55. Hashim, Amid; Pharney, Julian Robert, Next high frequency improvement by using frequency dependent effective capacitance.
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