초록 ▼

A cover is provided for a control switch in a vehicle that is movable between open and closed positions. In the cover open position, the switch paddle is freely accessible. In the cover closed position, the switch paddle is partially covered to limit access to the paddle and alert the operator to th

A cover is provided for a control switch in a vehicle that is movable between open and closed positions. In the cover open position, the switch paddle is freely accessible. In the cover closed position, the switch paddle is partially covered to limit access to the paddle and alert the operator to thereby avoid unintended actuation of the switch. In the closed position, the paddle is still accessible if needed to actuate the switch in an emergency without first opening the cover.

대표청구항 ▼

A cover is provided for a control switch in a vehicle that is movable between open and closed positions. In the cover open position, the switch paddle is freely accessible. In the cover closed position, the switch paddle is partially covered to limit access to the paddle and alert the operator to th

A cover is provided for a control switch in a vehicle that is movable between open and closed positions. In the cover open position, the switch paddle is freely accessible. In the cover closed position, the switch paddle is partially covered to limit access to the paddle and alert the operator to thereby avoid unintended actuation of the switch. In the closed position, the paddle is still accessible if needed to actuate the switch in an emergency without first opening the cover. The multi-layer circuit board of claim 5, wherein said fiber aggregate includes at least one of woven and non-woven cloth using aromatic polyamide as main material; and said resin contains thermosetting epoxy resin. 9. The multi-layer circuit board of claim 5, wherein said fiber aggregate includes fiber mainly based on at least one of glass fiber and ceramic fiber, and said resin contains thermosetting epoxy resin. 10. The multi-layer circuit board of claim 1, wherein said laminated circuit pattern is electrically connected to the inner layer circuit pattern by said through conductors. 11. The multi-layer circuit board of claim 10, wherein said through conductor is made from conductive paste filled in through-holes formed in said laminated substrate. 12. The multi-layer circuit board of claim 1, wherein said inner layer circuit board includes a plurality of inner layer circuit boards; each inner layer circuit board of said plurality of inner layer circuit boards is a double-side circuit board having said inner layer circuit pattern; each of said inner layer circuit patterns includes a first circuit pattern disposed on one side of the inner layer substrate, and a second circuit pattern disposed on the other side of the inner substrate; said smoothing layer is disposed on concave portions of inner layer circuit patterns of both the first circuit pattern and the second circuit pattern; said laminated substrate includes a plurality of laminated substrates; and each of said laminated substrates is arranged between the respective double-side circuit boards. 13. The multi-layer circuit board of claim 1, wherein said inner layer circuit boards include a first inner layer circuit board and a second inner layer circuit board; each inner layer circuit board of the first inner layer circuit board and the second inner layer circuit board is a double-side circuit board having the inner layer circuit pattern; each of said inner layer circuit patterns includes a first circuit pattern disposed on one side of the inner layer substrate and a second circuit pattern disposed on the other side of the inner layer substrate; said smoothing layer is disposed on concave portions of inner layer circuit patterns of both the first circuit pattern and the second circuit pattern; said laminated substrates include a second laminated substrate, a third laminated substrate and a fourth laminated substrate; said third laminated substrate is arranged between the first inner layer circuit board and the second inner layer circuit board; said second laminated substrate is laminated to the first circuit pattern; said fourth laminated substrate is laminated to the second circuit pattern; and said laminated circuit patterns include a third circuit pattern disposed on the surface of said second laminated substrate, and a fourth circuit pattern disposed on the surface of said fourth laminated substrate. 14. The multi-layer circuit board of claim 1, wherein at least one of the inner layer substrate and the laminated substrate is formed of a prepreg sheet feasible to be compressed under pressures. 15. The multi-layer circuit board of claim 1, wherein said laminated circuit pattern includes a plurality of through conductors electrically connected to said inner layer circuit pattern, and all of said through conductors are identical with each other in length and connection resistance. 16. A method of manufacturing a multi-layer circuit board, comprising the steps of: (a) preparing an inner layer circuit board, wherein said inner layer circuit board includes an inner circuit pattern disposed on the surface of an inner layer substrate, and said inner layer circuit pattern is convex in shape, having a predetermined thickness; (b) forming a smoothing layer on a concave portion of said inner layer substrate except the inner layer circuit pattern; (c) preparing a prepreg sheet; (d) preparing a metallic foil; (e) la