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An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively

An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively configured tray carrier. The input shuttle assembly is adapted to load a tray carrying unmarked IC packages onto the tray carrier from a stack of trays on the input shuttle assembly. A tray bearing unmarked IC packages may travel on the tray carrier borne by the tray transport to a laser marking station positioned above the transport actuator and having a single laser marking head traversing one mark field disposed within an enclosure. A first portion of the IC packages disposed in the tray that are positioned in the mark field may be laser marked after the tray is lifted into the enclosure by a rotational lift mechanism located proximate the laser marking station.

대표청구항 ▼

An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively

An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively configured tray carrier. The input shuttle assembly is adapted to load a tray carrying unmarked IC packages onto the tray carrier from a stack of trays on the input shuttle assembly. A tray bearing unmarked IC packages may travel on the tray carrier borne by the tray transport to a laser marking station positioned above the transport actuator and having a single laser marking head traversing one mark field disposed within an enclosure. A first portion of the IC packages disposed in the tray that are positioned in the mark field may be laser marked after the tray is lifted into the enclosure by a rotational lift mechanism located proximate the laser marking station. n and said second circuit pattern are electrically connected to each other by said inner layer through conductors; said smoothing layer is disposed on concave surfaces of inner layer circuit patterns of both the first circuit pattern and the second circuit pattern; said laminated substrate includes a second substrate laminated to the first circuit pattern, and a third substrate laminated to the second circuit pattern; said laminated circuit pattern includes a third circuit pattern disposed on the surface of said second substrate, and a fourth circuit pattern disposed on the surface of said third substrate; and each of said laminated circuit patterns are electrically connected to the inner layer circuit patterns respectively by said plurality of through conductors. 3. The multi-layer circuit board of claim 2, wherein said laminated substrate includes a second through conductor penetrating the second substrate and a third through conductor penetrating the third substrate; said first circuit pattern is electrically connected to the second circuit pattern by said inner layer through conductor; said third circuit pattern is electrically connected to the first circuit pattern by said second through conductor; and said fourth circuit pattern is electrically connected to the second circuit pattern by said third through conductor. 4. The multi-layer circuit board of claim 1, wherein said smoothing layer has a thickness equivalent to the predetermined thickness of said inner layer circuit pattern. 5. The multi-layer circuit board of claim 1, wherein said inner layer substrate is formed by heating and compressing a prepreg sheet having fiber aggregate and resin impregnated to said fiber aggregate. 6. The multi-layer circuit board of claim 5, wherein said smoothing layer contains resin, and the resin contained in the smoothing layer is same material as the resin contained in said inner layer substrate. 7. The multi-layer circuit board of claim 6, wherein said resin contains thermosetting resin. 8. The multi-layer circuit board of claim 5, wherein said fiber aggregate includes at least one of woven and non-woven cloth using aromatic polyamide as main material; and said resin contains thermosetting epoxy resin. 9. The multi-layer circuit board of claim 5, wherein said fiber aggregate includes fiber mainly based on at least one of glass fiber and ceramic fiber, and said resin contains thermosetting epoxy resin. 10. The multi-layer circuit board of claim 1, wherein said laminated circuit pattern is electrically connected to the inner layer circuit pattern by said through conductors. 11. The multi-layer circuit board of claim 10, wherein said through conductor is made from conductive paste filled in through-holes formed in said laminated substrate. 12. The multi-layer circuit board of claim 1, wherein said inner layer circuit board includes a plurality of inner layer circuit boards; each inner layer circuit board of said plurality of inner layer circuit boards is a double-side circuit board having said inner layer circuit pattern; each of said inner layer circuit patterns includes a first circuit pattern disposed on one side of the inner layer substrate, and a second circuit pattern disposed on the other side of the inner substrate; said smoothing layer is disposed on concave portions of inner layer circuit patterns of both the first circuit pattern and the second circuit pattern; said laminated substrate includes a plurality of laminated substrates; and each of said laminated substrates is arranged between the respective double-side circuit boards. 13. The multi-layer circuit board of claim 1, wherein said inner layer circuit boards include a first inner layer circuit board and a second inner layer circuit board; each inner layer circuit board of the first inner layer circuit board and the second inner layer circuit board is a double-side circuit board having the inner lay er circuit pattern; each of said inner layer circuit patterns includes a first circuit pattern disposed on one side of the inner layer substrate and a second circuit pattern disposed on the other side of the inner layer substrate; said smoothing layer is disposed on concave portions of inner layer circuit patterns of both the first circuit pattern and the second circuit pattern; said laminated substrates include a second laminated substrate, a third laminated substrate and a fourth laminated substrate; said third laminated substrate is arranged between the first inner layer circuit board and the second inner layer circuit board; said second laminated substrate is laminated to the first circuit pattern; said fourth laminated substrate is laminated to the second circuit pattern; and said laminated circuit patterns include a third circuit pattern disposed on the surface of said second laminated substrate, and a fourth circuit pattern disposed on the surface of said fourth laminated substrate. 14. The multi-layer circuit board of claim 1, wherein at least one of the inner layer substrate and the laminated substrate is formed of a prepreg sheet feasible to be compressed under pressures. 15. The multi-layer circuit board of claim 1, wherein said laminated circuit pattern includes a plurality of through conductors electrically connected to said inner layer circuit pattern, and all of said through conductors are identical with each other in length and connection resistance. 16. A method of manufacturing a multi-layer circuit board, comprising the steps of: (a) preparing an inner layer circuit board, wherein said inner layer circuit board includes an inner circuit pattern disposed on the surface of an inner layer substrate, and said inner layer circuit pattern is convex in shape, having a predetermined thickness; (b) forming a smoothing layer on a concave portion of said inner layer substrate except the inner layer circuit pattern; (c) preparing a prepreg sheet; (d) preparing a metallic foil; (e) laminating said prepreg sheet to the surface of said smoothing layer and said inner layer circuit pattern disposed on the inner layer circuit board and laminating said metallic foil to the surface of said prepreg sheet, where the prepreg sheet includes a conductive material disposed in through-holes; (f) heating under pressures the laminated inner layer circuit board, the prepreg sheet and the metallic foil, whereby the conductive material forms through conductors; and (g) forming a laminated circuit pattern by machining said metallic foil. 17. The method of manufacturing a multi-layer circuit board of claim 16, wherein the step of forming said smoothing layer includes the steps of: (1) applying thermosetting resin to the concave portion, and (2) half-curing the thermosetting resin applied. 18. The method of manufacturing a multi-layer circuit board of claim 16, wherein the step of forming said smoothing layer includes the steps of: (1) covering the inner layer circuit pattern and applying thermosetting resin to the concave portion; (2) curing the thermosetting resin; and (3) polishing the surface of the cured thermosetting resin to expose the surface of the inner layer circuit pattern. 19. The method of manufacturing a multi-layer circuit board of claim 16, wherein said smoothing layer is formed in a manner such that the smoothing layer is same in height as the thickness of the inner layer circuit pattern. 20. The method of manufacturing a multi-layer circuit board of claim 16, wherein the step of forming said inner layer circuit board includes the steps of: (1) forming through-holes in said inner layer substrate; (2) filling conductive paste into said through-holes; (3) laminating a metallic foil to either side of the inner layer substrate; (4) heating under pressures the laminated metallic foil and the inner layer substrate; and (5) forming said inner layer circuit patte rn by machining the metallic foil. 21. The method of manufacturing a multi-layer circuit board of claim 16, wherein the step of preparing said prepreg sheet includes the steps of: (1) forming through-holes in said prepreg sheet, and (2) filling conductive paste into said through-holes. 22. The method of manufacturing a multi-layer circuit board of claim 16, wherein the step oflaminating said prepreg sheet and metallic foil to the surface of said smoothing layer and inner layer circuit pattern disposed on said inner layer circuit board includes the steps of: (3) alternately arranging a plurality of inner layer circuit boards and a plurality of prepreg sheets, and (4) holding said inner layer circuit boards and prepreg sheets while adjusting the relative positions of said inner layer circuit boards and prepreg sheets to predetermined positions. 23. The method of manufacturing a multi-layer circuit board of claim 16, wherein said inner layer substrate and said prepreg sheet are feasible to be compressed. 24. The method of manufacturing a multi-layer circuit board of claim 16, wherein said prepreg sheet includes fiber aggregate and resin impregnated to the fiber aggregate, and the prepreg sheet is feasible to be compressed under pressures, and in the aforementioned step (f) of heating under pressures the laminated inner layer circuit board, prepreg sheet and metallic foil, said prepreg sheet is compressed, then the resin is cured, thereby, said inner layer circuit board, prepreg sheet and metallic foil are integrally bonded together. 25. The method of manufacturing a multi-layer circuit board of claim 24, wherein said fiber aggregate includes at least one of non-woven cloth and woven cloth. 26. The method of manufacturing a multi-layer circuit board of claim 24, wherein said fiber aggregate is made from at least one selected from the group consisting of aromatic polyamide, glass and ceramic. 27. The method of manufacturing a multi-layer circuit board of claim 16, wherein said smoothing layer contains resin. 28. The method of manufacturing a multi-layer circuit board of claim 16, wherein the aforementioned process (c) of preparing a prepreg sheet, said prepreg sheet includes a plurality of through-holes and conductive material disposed in said through-holes; in the aforementioned process (f) of heating under pressures said laminated inner layer circuit board, prepreg sheet and metallic foil, said prepreg sheet forms a laminated substrate, and said conductive materials form a plurality of through conductors; and all of said through conductors are identical with each other in penetration length. 29. The method of manufacturing a multi-layer circuit board of claim 16, wherein in the aforementioned process (c) of preparing a prepreg sheet, said prepreg sheet is feasible to be compressed under pressures, and said prepreg sheet includes a plurality of through-holes and conductive material disposed in said through-holes; in the aforementioned process (f) of heating under pressures said laminated inner layer circuit board, prepreg sheet and metallic foil, said prepreg sheet forms a compressed laminated substrate, and said conductive materials form a plurality of compressed through conductors; and all of said through conductors are identical with each other in penetration length.