초록 ▼

The present invention relates to an electromagnetic valve of a cartridge-type construction comprised of a magnetic core, a magnetic armature (12) with valve closure member (4), and a valve seat member which form an operative unit in a valve housing, the said valve housing including a closed sleeve p

The present invention relates to an electromagnetic valve of a cartridge-type construction comprised of a magnetic core, a magnetic armature (12) with valve closure member (4), and a valve seat member which form an operative unit in a valve housing, the said valve housing including a closed sleeve portion (1) which has a collar (17) on the opposite open end area for attachment in the valve housing. Inserted telescopically into the open end area of the sleeve portion (1) is a sleeve-shaped annular part (2) which carries the valve seat member (3) and aligns the latter concentrically in relation to the valve closure member (4) to form an operative unit.

대표청구항 ▼

The present invention relates to an electromagnetic valve of a cartridge-type construction comprised of a magnetic core, a magnetic armature (12) with valve closure member (4), and a valve seat member which form an operative unit in a valve housing, the said valve housing including a closed sleeve p

The present invention relates to an electromagnetic valve of a cartridge-type construction comprised of a magnetic core, a magnetic armature (12) with valve closure member (4), and a valve seat member which form an operative unit in a valve housing, the said valve housing including a closed sleeve portion (1) which has a collar (17) on the opposite open end area for attachment in the valve housing. Inserted telescopically into the open end area of the sleeve portion (1) is a sleeve-shaped annular part (2) which carries the valve seat member (3) and aligns the latter concentrically in relation to the valve closure member (4) to form an operative unit. zones to the ground plane of the respective microstrip elements, wherein the conducting line of the first microstrip element is connected to the conducting line of the second microstrip element, and the continuous bonding zones of the first microstrip element are connected to the continuous bonding zones of the second microstrip element. 9. The circuit board of claim 8, wherein said continuous bonding zones of each microstrip element have a length along said edge between about two and about five times the width of the conducting lines. 10. The circuit board of claim 9, wherein each of said bonding, zones of each microstrip element extends to lateral edges of said substrate. 11. The circuit board of claim 9, further comprising gold wires configured to connect said first and second microstrip elements. 12. The circuit board of claim 9, further comprising soldered wires configured to connect said first and second microstrip elements. 13. The circuit board of claim 9, further comprising a lead frame configured to connect said first and second microstrip elements. 14. The circuit board of claim 9, further comprising a coplanar line configured to connect said first and second microstrip elements. 15. The microstrip element of claim 8, wherein said rim is positioned on said edge of said substrate. 16. The microstrip element of claim 15, wherein said rim has a width along said edge equal to said length of said continuous bonding zones. 17. A method of bonding a first microstrip element having a first substrate, to a second microstrip element, having a second substrate, comprising: forming a first conducting line on an upper face of the first substrate and perpendicular to an edge of said first substrate; forming a second conducting line on an upper face of the second substrate and perpendicular to an edge of said second substrate; forming a first ground plane on a lower face of said first substrate; forming a second ground plane on a lower face of said second substrate; forming two continuous bonding zones on said upper face of said first microstrip element and along said edge of said first substrate, each continuous bonding zone being electrically grounded, and having a length along said edge of at least about two times the width of said conductive line formed on the first substrate; forming two continuous bonding zones on said upper face of said second microstrip element and along said edge of said second substrate, each continuous bonding zones being electrically grounded, and having a length along said edge of at least about two times the width of said conductive line formed on the second substrate; connecting the conducting line of the first microstrip element to the conducting line of the second microstrip element; and connecting the continuous bonding zones of the first microstrip element to the continuous bonding zones of the second microstrip element. 18. A method of bonding a first microstrip element having a first substrate, to a second microstrip element, having a second substrate, comprising: forming a first conducting line on an upper face of the first substrate and perpendicular to an edge of said first substrate; forming a second conducting line on an upper face of the second substrate and perpendicular to an edge of said second substrate; forming a first ground plane on a lower face of said first substrate; forming a second ground plane on a lower face of said second substrate; forming two continuous bonding zones on said upper face of said first microstrip element and along said edge of said first substrate, each continuous bonding zone being electrically grounded, and having a length along said edge of at least about two times the width of said conductive line formed on the first substrate; forming two continuous bonding zones on said upper face of said second microstrip element and along said edge of said second substrate, each continuous bonding zones being electrically grounded, and ha