초록 ▼

A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate

A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. A thickness of a base of the fin is larger than a thickness of the heat sink substrate. Furthermore, an electronic apparatus of this invention has a heat sink unit of this invention disposed within the apparatus.

대표청구항 ▼

A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate

A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. A thickness of a base of the fin is larger than a thickness of the heat sink substrate. Furthermore, an electronic apparatus of this invention has a heat sink unit of this invention disposed within the apparatus. r is inwardly formed. 12. The bezel fastening structure in accordance with claim 11, wherein the at least one clasp of the bezel engages with the computer enclosure at the at least one void of the computer enclosure. 13. The bezel fastening structure in accordance with claim 12, wherein the at least one clasp of the bezel is outwardly formed.