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특허 상세정보

Heat sink unit and electronic apparatus using the same

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/697; 165/121; 252/722; 361/719
출원번호 US-0978767 (2001-10-18)
우선권정보 JP-0319027 (2000-10-19)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    McDermott, Will & Emery
인용정보 피인용 횟수 : 22  인용 특허 : 9
초록

A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. ...

대표
청구항

A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. ...

이 특허를 인용한 특허 피인용횟수: 22

  1. Ruud, Alan J.; Wilcox, Kurt S.; Walczak, Steven R.. Aerodynamic LED light fixture. USP2017019541246.
  2. Lee, Kueir. Computer heat dissipating structure. USP2003116654247.
  3. Pauser, Donald George. Cooling assembly for a heat producing assembly. USP2003126667882.
  4. Hsu, Sheng-Chieh. Electric device. USP2016029261927.
  5. Takasou, Kazuo. Electronic apparatus cooling structure. USP2009107606027.
  6. Wang, Cheng-Yu. Heat dissipating device and portable electronic device using the same. USP2014068760862.
  7. Liu, Chien Hsiang; Yeh, Fun Son; Chang, Brian. Heat dissipation structure for electronic devices. USP2009067554805.
  8. Aoki, Michimasa; Suzuki, Masumi. Heat sink with non-uniform fins and transverse protrusion. USP2010037684190.
  9. Zhang, Heng Yun; Pinjala, Damaruganath; Hayashi, Hidetaka; Chan, Poh Keong. Heat transfer apparatus. USP2005036873527.
  10. Lin, Chiao-Hsin; Chu, Kuo-Cheng; Chou, Chih-Kuo. Heat-radiating structure co-usable with heat-radiating window of a housing of an electronic appliance. USP2004066751097.
  11. Nakamura, Fusanobu. Housing temperature suppressing structure in electronic device and portable computer. USP2010017643284.
  12. Wilcox, Kurt S.; Kinnune, Brian; Snell, Nathan; Sorenson, Jeremy; Goldstein, Corey; Medendorp, Jr., Nicholas W.. LED light fixture. USP2015059028087.
  13. Wilcox, Kurt S.; Kinnune, Brian; Sorenson, Jeremy; Goldstein, Corey. LED light fixture. USP2017019534775.
  14. Wilcox, Kurt S.; Kinnune, Brian; Snell, Nathan. LED light fixture with fluid flow to and from the heat sink. USP2016019243794.
  15. Rudd, Alan J.; Wilcox, Kurt S.; Walczak, Steven R.; Guilllien, Wayne. LED lighting fixture. USP2015059039223.
  16. Ruud, Alan J.; Wilcox, Kurt S.; Walczak, Steven R.; Guillien, Wayne. LED lighting fixture. USP2016029261270.
  17. Pond,Gregory R.; Roller,Philip C.; Suckow,Chris A.; Madison,Ronald D.; DiPenti,Timothy; Kolstee,Todd. Light emitting diode headlamp. USP2006077070310.
  18. Patkus, Steven; Sieberth, Bernd; Kinnune, Brian. Lighting fixture with flow-through cooling. USP2014018632213.
  19. Patkus, Steven; Sieberth, Bernd; Kinnune, Brian. Lighting fixture with flow-through cooling. USP2015129212811.
  20. MacDonald, Mark. Method and apparatus for enhanced cooling of mobile computing device surfaces. USP2015028953313.
  21. Yeh, Chia Ching; Huang, Lo Chi. Radiating module. USP2004016681845.
  22. Senatori, Mark David. Thermal management systems and methods. USP2012058189331.