초록 ▼

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape.

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

대표청구항 ▼

1. A method, comprising: providing a flexible multi-layer tape including, a heat extraction region, a fluid ducting region, a fluid pumping region and a heat rejection region; circulating a liquid inside the flexible multi-layer tape; and transporting heat between a heat source that is coupled

1. A method, comprising: providing a flexible multi-layer tape including, a heat extraction region, a fluid ducting region, a fluid pumping region and a heat rejection region; circulating a liquid inside the flexible multi-layer tape; and transporting heat between a heat source that is coupled to the heat extraction region of the flexible multi-layer tape and a heat sink that is coupled to the heat rejection region of the flexible multi-layer tape. 2. The method of claim 1, wherein circulating the liquid inside the flexible multi-layer tape includes circulating the liquid inside the flexible multi-layer tape via a closed loop circuit. 3. The method of claim 1, wherein circulating the liquid inside the flexible multi-layer tape includes pumping the liquid inside the flexible multi-layer tape. 4. The method of claim 1, wherein circulating the liquid inside the flexible multi-layer tape includes circulating the liquid inside the flexible multi-layer tape in a preferred direction around the closed loop circuit via a plurality of valves. 5. The method of claim 1, wherein circulating the liquid includes circulating water. 6. The method of claim 1, wherein exchanging heat between the heat source and the heat sink includes flowing the liquid over a plurality of fins. 7. A method, comprising, installing a flexible multi-layer tape in an electrical system, the flexible multi-layer tape including, a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid, the flexible multi-layer tape having a heat extraction region, a fluid ducting region, a fluid pumping region and a heat rejection region; attaching the heat extraction region to an electronic component; attaching the heat rejection region to a heat sink; and coupling a pump to the pumping region. 8. The method of claim 7, further comprising providing a liquid within the closed loop circuit. 9. The method of claim 7, further comprising bending the multi-layer flexible tape. 10. An apparatus, comprising a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer and defining a plurality of internal cavities forming a closed-loop circuit for circulating fluid, the plurality of internal cavities including a plurality of heat exchange devices; and a bottom layer coupled to the intermediate layer. 11. The apparatus of claim 10, wherein the top layer includes a metal layer. 12. The apparatus of claim 10, wherein the intermediate layer includes a polymer layer. 13. The apparatus of claim 10, wherein the bottom layer includes a metal layer. 14. The apparatus of claim 10, wherein the plurality or heat exchange devices include at least one member selected from the group consisting of: a longitudinal fin, a pin fin, a folded metal fin, and a metal mesh. 15. The apparatus of claim 10, wherein the closed loop circuit includes a heat extraction region, a pumping region and a heat rejection region. 16. The apparatus of claim 15, further comprising a pump coupled to the pumping region. 17. The apparatus of claim 16, wherein the pump includes at least one member selected from the group consisting of: a bellows pump, a rotary pump, and a micro-mechanical gear pump. 18. The apparatus of claim 16, wherein the pump is located in a cavity defined by the intermediate layer. 19. The apparatus of claim 10, further comprising a heat source coupled to the flexible multi-layer tape. 20. The apparatus of claim 19, wherein the heat source includes a plurality of electronic components. 21. The apparatus of claim 10, further comprising a heat sink coupled to the flexible multi-layer tape. 22. The apparatus of claim 21, wherein the heat sink includes a heat exchange unit.