IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0710438
(2000-11-10)
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발명자
/ 주소 |
- Callari, Francesco
- Zwern, Arthur
- Fejes, Sandor
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출원인 / 주소 |
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
47 인용 특허 :
12 |
초록
▼
A 3D modeling system employing a commercially available structured light source is disclosed. The light source projecting a light stripe is swung manually across an object or a particular area of interest on the surface of the object. Under the illumination of the swinging light stripe, the object i
A 3D modeling system employing a commercially available structured light source is disclosed. The light source projecting a light stripe is swung manually across an object or a particular area of interest on the surface of the object. Under the illumination of the swinging light stripe, the object is imaged to produce a sequence of images. For each of the images, the position and orientation of the structured light source are independently and dynamically derived. From each of the images, a set of curvilinear points from the (deformed) projected line falling on the object or the area of interest are calculated in conjunction with a calibration model of the imager. The curvilinear points from all the images are merged to provide accurate and complete 3D data about the object or the area of interest.
대표청구항
▼
A 3D modeling system employing a commercially available structured light source is disclosed. The light source projecting a light stripe is swung manually across an object or a particular area of interest on the surface of the object. Under the illumination of the swinging light stripe, the object i
A 3D modeling system employing a commercially available structured light source is disclosed. The light source projecting a light stripe is swung manually across an object or a particular area of interest on the surface of the object. Under the illumination of the swinging light stripe, the object is imaged to produce a sequence of images. For each of the images, the position and orientation of the structured light source are independently and dynamically derived. From each of the images, a set of curvilinear points from the (deformed) projected line falling on the object or the area of interest are calculated in conjunction with a calibration model of the imager. The curvilinear points from all the images are merged to provide accurate and complete 3D data about the object or the area of interest. first and second objects. 5. A device according to claim 3, wherein the first and second alignment marks are arranged in accordance with an intended distance between the first and second objects. 6. A device according to claim 3, wherein said image taking system includes a first image pickup device for detecting optical images of the first position detecting mark and the first alignment mark, and a second image pickup device for detecting optical images of the second position detecting mark and the second alignment mark. 7. A device according to claim 6, wherein said first image pickup device is separate from said second image pickup device. 8. A device according to claim 3, wherein said image taking system performs the detection of optical images of the first position detecting mark and the first alignment mark and the detection of optical images of the second position detecting mark and the second alignment mark under different optical conditions. 9. A device according to claim 8, wherein said different optical conditions are obtained by switching between a first optical path for detecting the optical images of the first position detecting mark and the first alignment mark and a second optical path for detecting the optical images of the second position detecting mark and the second alignment mark. 10. A device according to claim 9, wherein said image taking system has only one image pickup device for detecting the optical images of the first position detecting mark and the first alignment mark and the second position detecting mark and the second alignment mark. 11. A device according to claim 9, wherein when the first optical path is used, the optical images of the first position detecting mark and the first alignment mark, and not those of the second position detecting mark and the second alignment mark, are formed on an image pickup device of said image taking system, and wherein when the second optical path is used, the optical images of the second position detecting mark and the second alignment mark, and not those of the first position detecting mark and the first alignment mark, are formed on an image pickup device of said image taking system. 12. A device according to claim 8, wherein said first and second illumination and projection systems are configured so that the different optical conditions are obtained by making the wavelength of the light for detecting the optical images of the first position detecting mark and the first alignment mark different from the wavelength of the light for detecting the optical images of the second position detecting mark and the second alignment mark. 13. A device according to claim 1, wherein said reference member is separate from the first and second objects, and said first illumination system is separate from said second illumination system. 14. An exposure device for transferring a pattern of a first object through exposure onto a second object after performing alignment of the first and second objects, which objects are arranged opposite to each other, by detecting a positional relationship between the first and second objects by using a first position detecting mark arranged on the first object and a second position detecting mark arranged on the second object, said exposure device comprising: a first illumination and projection system for illuminating the first position detecting mark and the second position detecting mark and for projecting a first projected image of the first position detecting mark and the second position detecting mark; a reference member having alignment reference marks respectively corresponding to the first and second position detecting marks; a second illumination and projection system for illuminating the alignment reference marks and for projecting a second projected image of the alignment reference marks; and an image taking system for receiving the first projected image of the first and second position detecting marks and the second projec ted image of the alignment reference marks, wherein a positional relationship between the first projected image of the first position detecting mark and the second projected image of the alignment reference marks is detected by using said image taking system, and wherein a positional relationship between the first projected image of the second position detecting mark and the second projected image of the alignment reference marks is detected by using said image taking system, whereby the detection of relative positions of the first and second objects is executed. 15. A device according to claim 14, wherein said reference member is arranged within said exposure device. 16. A device according to claim 15, wherein the alignment reference marks include a first alignment mark for alignment with the first position detecting mark, and a second alignment mark for alignment with the second position detecting mark. 17. A device according to claim 16, wherein the first and second alignment marks are arranged in correspondence with the distance between the first and second objects. 18. A device according to claim 16, wherein said image taking system performs the detection of optical images of the first position detecting mark and the first alignment mark and the detection of optical images of the second position detecting mark and the second alignment mark under different optical conditions. 19. A device according to claim 18, wherein the different optical conditions are obtained by switching between a first optical path for detecting the optical images of the first position detecting mark and the first alignment mark and a second optical path for detecting the optical images of the second position detecting mark and the second alignment mark. 20. A device according to claim 19, further comprising means for switching between the first optical path and the second optical path by using optical path switching shutters. 21. A device according to claim 18, wherein said first and second illumination and projection systems are configured so that the different optical conditions are obtained by making the wavelength of the light for detecting the optical images of the first position detecting mark and the first alignment mark different from the wavelength of the light for detecting the optical images of the second position detecting mark and the second alignment mark. 22. A device according to claim 16, wherein said image taking system includes a first image pickup device for detecting optical images of the first position detecting mark and the first alignment mark, and a second image pickup device for detecting optical images of the second position detecting mark and the second alignment mark. 23. A device for detecting alignment, in an optical axis direction, of a mask having a mask alignment mark and a wafer having a wafer alignment mark, the mask and the wafer being arranged along the optical axis spaced apart from and facing one another, said device comprising: a plate separate from the mask and the wafer and having a mask reference mark and a wafer reference mark; an optical system for illuminating the mask alignment mark of the mask and the wafer alignment mark of the wafer with a first light source and for illuminating the mask reference mark of said plate and the wafer reference mark of said plate with a second light source separate from the first light source, and for forming images of the mask alignment mark and the mask reference mark on a first image pickup device and for forming images of the wafer alignment mark and the wafer reference mark on a second image pickup device separate from the first image pickup device; and a detector for detecting a first positional deviation between the mask alignment mark and the mask reference mark on the basis of a signal from the first image pickup device corresponding to the images thereof, for detecting a second positional deviation between the wafer alignment mark and the wafer referen
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