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An unattended ground sensor for the monitoring of a remote area. The unattended ground sensor comprises a housing that supports a power source, a communications module, at least one sensor module and a mainframe module. Additionally, the unattended ground sensor includes a common electrical bus in e

An unattended ground sensor for the monitoring of a remote area. The unattended ground sensor comprises a housing that supports a power source, a communications module, at least one sensor module and a mainframe module. Additionally, the unattended ground sensor includes a common electrical bus in electrical communication with the power source, the communications module, the at least one sensor module, and the mainframe module. The common electrical bus is operative to provide a communications pathway between the power source, the communications module, the at least one sensor, and the mainframe module. Accordingly, the mainframe module is operative to control the operation of the unattended ground sensor through the common electrical bus.

대표청구항 ▼

An unattended ground sensor for the monitoring of a remote area. The unattended ground sensor comprises a housing that supports a power source, a communications module, at least one sensor module and a mainframe module. Additionally, the unattended ground sensor includes a common electrical bus in e

An unattended ground sensor for the monitoring of a remote area. The unattended ground sensor comprises a housing that supports a power source, a communications module, at least one sensor module and a mainframe module. Additionally, the unattended ground sensor includes a common electrical bus in electrical communication with the power source, the communications module, the at least one sensor module, and the mainframe module. The common electrical bus is operative to provide a communications pathway between the power source, the communications module, the at least one sensor, and the mainframe module. Accordingly, the mainframe module is operative to control the operation of the unattended ground sensor through the common electrical bus. conductor die to the substrate. 34. The semiconductor package of claim 32, wherein the electrically conductive path is a single electrical conductor extending from the terminal pad to the substrate. 35. The semiconductor package of claim 29, wherein the electrically conductive path is a single electrical conductor extending from the terminal pad to the substrate. 36. A semiconductor package comprising: a substrate; a first semiconductor die coupled to the substrate, said first semiconductor die including a first surface with an outer edge, and terminal pad at the first surface; an insulative spacer having a first surface, and an opposite second surface coupled to the first surface of the first semiconductor die between the terminal pad and the outer edge; an electrically conductive path passing across the first sur