초록 ▼

A method and apparatus for forming a planar layer on a surface of a microelectronic substrate. The method comprises controlling a temperature of a liquid support material to be at least an annealing temperature of material comprising the planar layer. In one embodiment, the planar layer material has

A method and apparatus for forming a planar layer on a surface of a microelectronic substrate. The method comprises controlling a temperature of a liquid support material to be at least an annealing temperature of material comprising the planar layer. In one embodiment, the planar layer material has a lower density than the liquid support material and the method further comprises floating the planar layer material upon the liquid support material so that the planar layer material attains a temperature of at least its annealing temperature. The planar layer material forms a planar surface at an interface with the support material and is adhered at an opposite surface to the substrate to form a planar layer thereon. In another embodiment, the planar layer material is adhered to a surface of the substrate. The planar layer material is then engaged with the liquid support material so that the planar layer material attains a temperature of at least its annealing temperature, forming a planar surface at an interface with the liquid support material.

대표청구항 ▼

A method and apparatus for forming a planar layer on a surface of a microelectronic substrate. The method comprises controlling a temperature of a liquid support material to be at least an annealing temperature of material comprising the planar layer. In one embodiment, the planar layer material has

A method and apparatus for forming a planar layer on a surface of a microelectronic substrate. The method comprises controlling a temperature of a liquid support material to be at least an annealing temperature of material comprising the planar layer. In one embodiment, the planar layer material has a lower density than the liquid support material and the method further comprises floating the planar layer material upon the liquid support material so that the planar layer material attains a temperature of at least its annealing temperature. The planar layer material forms a planar surface at an interface with the support material and is adhered at an opposite surface to the substrate to form a planar layer thereon. In another embodiment, the planar layer material is adhered to a surface of the substrate. The planar layer material is then engaged with the liquid support material so that the planar layer material attains a temperature of at least its annealing temperature, forming a planar surface at an interface with the liquid support material. America, p. 1, Earring Items; ETR.014; ETR.022; ETLB.001. Jaha Jewelry, Inc., Item Nos. J2-1, J3-15, J6-9, J6-13, J6-16, J10-1, J10-2, J13-19 (640 S. Hill St., #748, Los Angeles, CA 90014). "Rio Grande: Gems & Findings", Gold earrings: 14K yellow back-set French wire earrings Die Struck, Item "M", p. 90. All Karats International; Edizioni, Primavera-Estate/Spring-Summer, Sixth Edition; "Diamond Necklace "; 2 pages including cover (1998). Variety Gem Co., Inc.; JCK Catalog 05-97; Items N5526, N5520A, N5520B; one page (May 1997). Wards, Gold Hoop (Earring) with Diamond Cut Ovals, Item #459312000; 4 pages.