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Compartmentalized oven 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F27B-009/06
출원번호 US-0062355 (2002-02-01)
발명자 / 주소
  • Anderson, Bradley C.
  • Carlson, Stephen P.
  • Chezick, Travis R.
  • Leone, John T.
  • Menard, Jean Pierre
  • Pierson, Bruce J.
  • Rieck, James A.
출원인 / 주소
  • CVD Equipment Corporation
대리인 / 주소
    Kinney & Lange, P.A.
인용정보 피인용 횟수 : 7  인용 특허 : 27

초록

An oven compartment in an oven for subjecting items to a selected heating sequence having a compartment container with a transport opening therein to permit selectively entering such items adjacent to first plenum structure at a perforated surface to allow providing heating fluid thereon. The first

대표청구항

An oven compartment in an oven for subjecting items to a selected heating sequence having a compartment container with a transport opening therein to permit selectively entering such items adjacent to first plenum structure at a perforated surface to allow providing heating fluid thereon. The first

이 특허에 인용된 특허 (27)

  1. Hartmann Horst-Joachim (Stuttgart DEX) Saile Peter (Stuttgart DEX), Apparatus and process for soldering component onto boards.
  2. Pekol Robert (3102 Aspen Ct. Eau Claire WI 54703), Automatic reflow soldering system.
  3. Rehm Johannes,DEX, Circuit board heating apparatus.
  4. Seeley William R. (DePere WI) Fontaine Edwin S. (Appleton WI), Combination infrared and air flotation dryer.
  5. Cox Norman R. (Eden Prairie MN) Menard Jean P. (Hastings MN) Baer Wayne W. (Minnetonka MN) Anderson Bradley C. (Shakopee MN), Continuous oven with a plurality of heating zones.
  6. Melgaard Hans L. (North Oaks MN), Convection/radiation material treatment oven.
  7. Petersen Paul S. (Minnetonka MN), Conveyor guide arrangement.
  8. Yatsuharu Yokota JP, Device for heating printed-circuit board.
  9. Smith Robert C. (Vergennes VT) Cox ; II A. Benns (North Ferrisburg VT), Dual flow heating apparatus.
  10. Kendziora Heinz (Bonn DT) Nenner Johannes (Bornheim-Merten DT) Schoer Heinz (Alfter DT) Schultze Werner (Bonn DT), Flux-free soldering of aluminum-containing workpieces in a controlled atmosphere.
  11. Van Denend Herbert (270 Goffle Hill Rd. Hawthorne NJ 07506), Hybrid high-velocity heated air/infra-red drying oven.
  12. Meyen Robert H. (Salt Point NY) Puttlitz Karl J. (Wappingers Falls NY) Schink Karl (Wappingers Falls NY) Wenskus Herbert (Hopewell Junction NY), Individual chip joining machine.
  13. Deambrosio Carlos (1 Place de Guise ; Apt. 12 Candiac CAX), Inerted IR soldering system.
  14. Marcantonio Angelo R. (Princeton NJ), Method an apparatus for obtaining reflow oven settings for soldering a PCB.
  15. Dahne Scott E. (Columbia MD) Hira Govind L. (Columbia MD), Method and apparatus for selective infrared soldering using shielding fixtures.
  16. Naka Hiroyuki (Osaka JPX) Hirono Tomohide (Hirakata JPX) Suzuki Naoki (Sakai JPX) Ichiyanagi Takashi (Hirakata JPX), Method for heating a patterned substrate.
  17. Wandke Ernst (Geretsried DEX), Method for soldering printed-circuit boards under low pressure.
  18. Abe Nobuhide (Iruma JPX) Adachi Minoru (Niiza JPX) Ito Makoto (Hoya JPX) Uchida Toshiya (Tokyo JPX), Method of and apparatus for controlling automatic soldering system.
  19. Orbeck Gary A. (Windham NH), Multi-zone furnace system.
  20. Liedke Volker (Elsenfeld/Eichelsbach) Grasmann Karl H. (Stadprozelten) Albrecht Hans-Jurgen (Berlin) Wittrich Harald (Berlin) John Wilfred (Berlin) Scheel Wolfgang (Berlin DEX), Procedure for processing joints to be soldered.
  21. Yokota Yatsuharu (Hachioji JPX), Reflow soldering method and the apparatus thereof.
  22. Yokota Yatsuharu (Hachioji JPX), Reflow soldering method and the apparatus thereof.
  23. Kondo Kenshi (Tokyo JPX), Soldering apparatus.
  24. Kondo Kenshi (Tokyo JPX), Soldering apparatus of a reflow type.
  25. Kondo Kenshi (Tokyo JPX), Soldering apparatus of a reflow type.
  26. Gieskes Koen A. (Ulvenhout NLX), Soldering machine operating with a protective gas and provided with automatically operating lock doors.
  27. Spigarelli Donald J. (99 Indian Hill Rd. Groton MA 01450), Soldering system.

이 특허를 인용한 특허 (7)

  1. Yanes, Felipe J., Apparatus and method for the uniform drying of board materials.
  2. Agnello, Frank; Veltrop, Loren; Serena, Thomas; Howard, Nathaniel, Conveyor oven with adjustable air vents.
  3. Weber, Stefan, Method and device for heat treatment, especially connection by soldering.
  4. Nagasawa, Kanji; Nakatani, Rintaro, Thermal analysis apparatus.
  5. Atkinson, Hayden; Riggs, Paul; Gibson, John; Warren, Tim; Dover, Ronnie; Williams, Arthur; Cowden, Jennifer; Gunner, Michael, Thermal curing methods and systems for forming contact lenses.
  6. Atkinson, Hayden; Riggs, Paul; Gibson, John; Warren, Tim; Dover, Ronnie; Williams, Arthur; Cowden, Jennifer; Gunner, Michael, Thermal curing methods and systems for forming contact lenses.
  7. Atkinson, Hayden; Riggs, Paul; Gibson, John; Warren, Tim; Dover, Ronnie; Williams, Arthur; Cowden, Jennifer; Gunner, Michael, Thermal curing methods and systems for forming contact lenses.
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