초록 ▼

A tile roof ridge row vent and the method of its use and construction are disclosed. The ridge row vent is designed for use with either barrel tile or flat tile. The tile roof ridge row vent includes an elongate member having a vertical section and a side section connected to allow air flow therebet

A tile roof ridge row vent and the method of its use and construction are disclosed. The ridge row vent is designed for use with either barrel tile or flat tile. The tile roof ridge row vent includes an elongate member having a vertical section and a side section connected to allow air flow therebetween. The vertical section has a lower sealing skirt that extends under the top row of roof tiles and the side section includes plurality of ventilation openings angled downwardly and outwardly to allow air to exit the vent while preventing rain or other inclement weather from entering the vent. A second embodiment is shown for use with a single sided or mansard type roof. A third embodiment is shown for use in high wind and hurricane prone areas with an angled roof and includes an external baffle added to the ridge row vent. A fourth embodiment utilizing the ridge row vent with the external baffle is shown for use with a mansard type roof.

대표청구항 ▼

A tile roof ridge row vent and the method of its use and construction are disclosed. The ridge row vent is designed for use with either barrel tile or flat tile. The tile roof ridge row vent includes an elongate member having a vertical section and a side section connected to allow air flow therebet

A tile roof ridge row vent and the method of its use and construction are disclosed. The ridge row vent is designed for use with either barrel tile or flat tile. The tile roof ridge row vent includes an elongate member having a vertical section and a side section connected to allow air flow therebetween. The vertical section has a lower sealing skirt that extends under the top row of roof tiles and the side section includes plurality of ventilation openings angled downwardly and outwardly to allow air to exit the vent while preventing rain or other inclement weather from entering the vent. A second embodiment is shown for use with a single sided or mansard type roof. A third embodiment is shown for use in high wind and hurricane prone areas with an angled roof and includes an external baffle added to the ridge row vent. A fourth embodiment utilizing the ridge row vent with the external baffle is shown for use with a mansard type roof. hod of claim 1 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.3, a compressibility of approximately 16%, and a hardness of approximately 55 Shore A. 7. The method of claim 1 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.34, a compressibility of approximately 12%, and a hardness of approximately 65 Shore A. 8. The method of claim 1 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.7, a compressibility of approximately 5%, and a hardness of approximately 52-60 Shore D. 9. The method of claim 1 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.6-0.8, a compressibility of approximately 2-7%, and a hardness of approximately 52-60 Shore D. 10. A method of planarizing a microelectronic substrate assembly, comprising: cutting a cylindrical body of pad material to form a seamless web having a desired thickness, wherein cutting further comprises slicing the cylindrical body of pad material along a cutting line by positioning an edge of a cutting element along the cutting line at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body toward the centerline; rotating the cylindrical body against the cutting edge, the cutting edge peeling the seamless web from the body; pressing the substrate assembly against a planarizing surface of the seamless web by supporting the web with a table defining a planarizing zone and applying a downforce against the substrate; moving at least one of the substrate assembly with respect to the web for removing material from the substrate; and sliding the web across the table to move one portion of the web out of the planarizing zone and to move another portion of the web into the planarizing zone without removing the web from the table. 11. The method of claim 10 wherein positioning the edge of the cutting element along the cutting line comprises moving the cutting member radially inward toward the centerline as the cylindrical body rotates. 12. The method of claim 11 wherein moving the cutting member comprises controlling the movement of the cutting element to maintain a desired radial depth inward from an exterior surface of the body as the cutting element slices the seamless web from the body. 13. The method of claim 11 wherein moving the cutting element comprises controlling the movement of the cutting element to maintain a constant radial depth inward from an exterior surface of the body as the cutting element slices the seamless web from the body. 14. The method of claim 10 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.3, a compressibility of approximately 16%, and a hardness of approximately 55 Shore A. 15. The method of claim 10 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.34, a compressibility of approximately 12%, and a hardness of approximately 65 Shore A. 16. The method of claim 10 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.7, a compressibility of approximately 5%, and a hardness of approximately 52-60 Shore D. 17. The method of claim 10 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity o f approximately 0.6-0.8, a compressibility of approximately 2-7%, and a hardness of approximately 52-60 Shore D. 18. A method of planarizing a microelectronic substrate assembly, comprising: cutting a cylindrical body of pad material to form a seamless web having a desired thickness, wherein cutting further comprises slicing the cylindrical body of pad material along a cutting line by positioning an edge of a cutting element along the cutting line at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body toward the centerline; rotating the cylindrical body against the cutting edge while moving the cutting element radially inward toward the centerline as the cylindrical body rotates, the cutting edge peeling the seamless web from the body; pressing the substrate assembly against a planarizing surface of the seamless web by supporting the web with a table defining a planarizing zone and applying a downforce against the substrate; moving at least one of the substrate assembly with respect to the web for removing material from the substrate; and sliding the web across the table to move one portion of the web out of the planarizing zone and to move another portion of the web into the planarizing zone without removing the web from the table. 19. The method of claim 18 wherein moving the cutting element comprises controlling the movement of the cutting element to maintain a desired radial depth inward from an exterior surface of the body as the cutting element slices the seamless web from the body. 20. The method of claim 18 wherein moving the cutting element comprises controlling the movement of the cutting element to maintain a constant radial depth inward from an exterior surface of the body as the cutting element slices the seamless web from the body. 21. The method of claim 18 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.3, a compressibility of approximately 16%, and a hardness of approximately 55 Shore A. 22. The method of claim 18 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.34, a compressibility of approximately 12%, and a hardness of approximately 65 Shore A. 23. The method of claim 18 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.7, a compressibility of approximately 5%, and a hardness of approximately 52-60 Shore D. 24. The method of claim 18 wherein cutting the cylindrical body comprises peeling the seamless web from a cylindrical body of polymeric pad material having a specific gravity of approximately 0.6-0.8, a compressibility of approximately 2-7%, and a hardness of approximately 52-60 Shore D. 25. A method of planarizing a microelectronic substrate assembly, comprising: cutting a cylindrical body of pad material to form a seamless web having a desired thickness, wherein cutting further comprises slicing the cylindrical body of pad material along a cutting line by positioning an edge of a cutting element along the cutting line at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body toward the centerline; rotating the cylindrical body against the cutting edge while moving the cutting element radially inward toward the centerline as the cylindrical body rotates, the cutting edge peeling the seamless web from the body; controlling the movement of the cutting element to maintain a desired radial depth inward from an exterior surface of the body as the cutting element slices the seamless web from the body; pressing the substrate assembly against a planarizing surface of the seamless web by