초록 ▼

A thuster control unit which in general comprises a base plate 100, a switch panel 200 mounted on said base plate, and a boat shaped, or navicular, control knob 500 mounted on the base plate such that it is displaceable over the switch panel. The panel is equipped with switches, such as embedded swi

A thuster control unit which in general comprises a base plate 100, a switch panel 200 mounted on said base plate, and a boat shaped, or navicular, control knob 500 mounted on the base plate such that it is displaceable over the switch panel. The panel is equipped with switches, such as embedded switches, for controlling bow and stem thrusters, and/or any other propulsion unit. The control knob is equipped actuator pegs 425, biased downwards, each thus transmitting a force to the switch panel. In a non-actuated state, the navicular control knob remains in a neutral position in which position no one of the embedded boat manoeuvring control switches are operated. The forward and aft actuator pegs thus activate the forward and aft boat manoeuvring control switches respectively in a manner corresponding with a selective displacement of the navicular control knob. The boat shaped control knob provides a novel, efficient and reliable means for a combined control of any boat propulsion system.

대표청구항 ▼

A thuster control unit which in general comprises a base plate 100, a switch panel 200 mounted on said base plate, and a boat shaped, or navicular, control knob 500 mounted on the base plate such that it is displaceable over the switch panel. The panel is equipped with switches, such as embedded swi

A thuster control unit which in general comprises a base plate 100, a switch panel 200 mounted on said base plate, and a boat shaped, or navicular, control knob 500 mounted on the base plate such that it is displaceable over the switch panel. The panel is equipped with switches, such as embedded switches, for controlling bow and stem thrusters, and/or any other propulsion unit. The control knob is equipped actuator pegs 425, biased downwards, each thus transmitting a force to the switch panel. In a non-actuated state, the navicular control knob remains in a neutral position in which position no one of the embedded boat manoeuvring control switches are operated. The forward and aft actuator pegs thus activate the forward and aft boat manoeuvring control switches respectively in a manner corresponding with a selective displacement of the navicular control knob. The boat shaped control knob provides a novel, efficient and reliable means for a combined control of any boat propulsion system. d contact members, wherein said first distance does not equal said second distance. 8. The integrated circuit carrier structure of claim 1, wherein: said first two dimensional array of contact pads includes a first axis and a second axis, said first axis defined by a first centerline extending along a row of said contact pads, said second axis defined by a second centerline along one of said conductive elements; and said first axis and said second axis form an angle of about 90 degrees. 9. The integrated circuit carrier structure of claim 1, wherein: said first two dimensional array of contact pads includes a first axis and a second axis, said first axis defined by a first centerline extending along a row of said contact pads, said second axis defined by a second centerline along one of said conductive elements; and said first axis and said second axis form an acute angle. 10. The integrated circuit carrier structure of claim 1, wherein: said first two dimensional array of contact pads including a first axis, a second axis, and a third axis, said first axis defined by a first centerline extending along a row of said contact pads, said second axis defined by a second centerline along a first one of said conductive elements, said third axis defined by a third centerline along a second one of said conductive elements; said first axis and said second axis forming a first angle; said first axis and said third axis forming a second angle; and wherein said first angle and said second angle are not approximately equal. 11. The integrated circuit carrier structure of claim 1, wherein two conductive elements from a two dimensional array are connected to the same through-via. 12. The integrated circuit carrier structure of claim 1, wherein one conductive element is connected to at least two different through-vias. 13. A printed circuit board assembly comprising: a semiconductor integrated circuit; a printed circuit board; an integrated circuit carrier for mounting the semiconductor integrated circuit to the printed circuit board comprising: a layered structure having a first surface and a second surface substantially parallel to said first surface; a first two-dimensional array of contact pads arranged in a first grid on said first surface, said first two-dimensional array of contact pads corresponding to an array of first contact members for contacting a first substrate; a second two-dimensional array of contact pads arranged in a second grid on said second surface, said second two-dimensional array of contact pads corresponding to an array of second contact members for contacting a second substrate; through-vias within said structure for connecting respective contact pads on the first and second surfaces, wherein said through-vias are positioned horizontally off-grid relative to contact members selected from the group consisting of said first contact members, said second contact members, and a combination of said first and second contact members, for the purpose of maximizing available wiring channel volume, and further wherein each of said through-vias extends along a straight line from said first surface to said second surface; and conductive elements which connect the corresponding contact pads with the through-vias. 14. The printed circuit board assembly of claim 13, further comprising: volumes within said structure which are maximized to form the largest wiring channels possible between sets of through-vias, wherein the volumes are located between the through-vias. 15. A method of constructing an integrated circuit carrier structure with a laminated assembly, wherein the laminated assembly includes first and second substantially parallel surfaces, comprising: arranging a two-dimensional array of contact pads in a first grid on said first surface, said first two-dimensional array of contact pads corresponding to an array of first contact members for contacting a first substrate; arranging a two-dimensional array of contact pads in a second grid on said second surface, said second two-dimensional array of contact pads corresponding to an array of second contact members for contacting a second substrate; forming through-vias within said structure for connecting respective contact pads on the first and second surfaces, wherein said through-vias are positioned horizontally off-grid relative to contact members selected from the group consisting of said first contact members, said second contact members, and a combination of said first and second contact members, and further wherein each of said through-vias extends along a straight line from said first surface to said second surface; and incorporating conductive elements to connect the corresponding contact pads with the through-vias. 16. The method of claim 15, further comprising the steps of: creating volumes for maximum wiring channel volume within said structure, between said through-vias; and forming wiring channels within said volumes. 17. The method of claim 15, wherein the conductive elements are dog-bone shaped. 18. The method of claim 15, wherein the wiring channels contain a plurality of electrical signal lines. 19. The method of claim 15, wherein the contact pads arranged on said second surface are blind vias. 20. The method of claim 19, wherein said blind vias are formed from one of the following processes: laser ablating, photo-imaging, plasma etching, or mechanical drilling. 21. The method of claim 15, wherein the structure is formed from a material selected from the group consisting of a ceramic material and an organic material. 22. The method of claim 15, further comprising: determining a first axis and a second axis of said first two dimensional array of contact pads, said first axis defined by a first centerline extending along a row of said contact pads, said second axis defined by a second centerline along one of said conductive elements; and forming an angle of about 90 degrees between said first axis and said second axis. 23. The method of claim 15, further comprising: determining a first axis and a second axis of said first two dimensional array of contact pads, said first axis defined by a first centerline extending along a row of said contact pads, said second axis defined by a second centerline along one of said conductive elements; and forming an acute angle between said first axis and said second axis. 24. The method of claim 15, further comprising: determining a first axis, a second axis, and a third axis of said first two dimensional array of contact pads, said first axis defined by a first centerline extending along a row of said contact pads, said second axis defined by a second centerline along a first one of said conductive elements, said third axis defined by a third centerline along a second one of said conductive elements; wherein said first axis and said second axis form a first angle; wherein said first axis and said third axis form a second angle; and wherein said first angle and said second angle are not approximately equal. 25. The method of claim 15, further comprising connecting two conductive elements, from the same two dimensional array, to the same through-via. 26. The method of claim 15, further comprising connecting one conductive element to at least two different through-vias. 27. A method of constructing an integrated circuit carrier structure with a laminated assembly, wherein the laminated assembly includes first and second substantially parallel surfaces, said method comprising: arranging a two-dimensional array of first contact pads in a first grid on said first surface; arranging a two-dimensional array of second contact pads in a second grid on said second surface; forming through-vias within said structure for connecting respective contact pads on the first and second surfaces, wherein said through-vias are positioned horizontally off-grid; and incorporating conductive ele ments to connect the respective contact pads with the through-vias, wherein the conductive elements are used to position the through-vias off-grid relative to selected contact pads comprising a subset of said first contact pads, a subset of said second contact pads, and a combination thereof.