IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0092216
(2002-03-05)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
13 인용 특허 :
55 |
초록
▼
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery. A method for fabricating the semiconductor card is also included.
대표청구항
▼
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery. A method for fabricating the semiconductor card is also included. US-5864944, 19990200, Kashiwagi et al., 029/833; US-5878484, 19990300, Araya et al., 029/740; US-5999266, 19991200, Takahashi et al., 356/376; US-5999640, 19991200, Hatase et al., 382/151; US-6018865, 20000200, Michael, 029/740; US-6031242, 20000200, Hudson, 250/548; US-6118538, 20000900, Haugan et al., 356/375; US-6195165, 20010200, Sayegh, 356/376; US-6232724, 20010500, Onimoto et al., 315/161; US-6243164, 20010600, Baldwin et al., 356/375; US-6291816, 20010900, Liu, 250/234; US-6292261, 20010900, Fishbaine et al., 356/375; US-6342916, 20020100, Kashiwagi et al., 348/087
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