초록 ▼

An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example,

An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.

대표청구항 ▼

1. A package having an integral window for packaging at least one microelectronic device, comprising: a first electrically insulating plate comprising a multilayered material having a first surface, an opposing second surface, and a first aperture disposed through said first plate; an electrical

1. A package having an integral window for packaging at least one microelectronic device, comprising: a first electrically insulating plate comprising a multilayered material having a first surface, an opposing second surface, and a first aperture disposed through said first plate; an electrically conductive metallized trace disposed on the second surface of said first plate; a window bonded to said first plate and substantially filling the first aperture, for providing optical access to a microelectronic device disposed within said assembly; and a second electrically insulating plate having a third surface, an opposing fourth surface, and a second aperture disposed through said second plate; wherein the first plate is attached to the second plate by joining the second surface to the third surface; and wherein the second aqrure is larger than the first aperture. 2. The package of claim 1, wherein said window is formed by casting a castable window mal directly into the first aperture. 3. The package of claim 2, wherein the castable window material comprises molten glass. 4. The package of claim 2, wherein the castable window material comprises a liquid polymer the equently hardens after casting. 5. The package of claim 1, wherein the second plate comprises the same multilayered material as the first plate. 6. The package of claim 1, wherein said multilayered material comprises a high-temperature cofired ceramic multilayered material fired at a temperature in the roAe of 1300 C to 1800 C. 7. The package of claim 1, wherein said multilayered material comprises a low-temperature cofired ceramic multilayered material fired at a temperature in the a jev 600 C to 1000 C. 8. The package of claim 1, wherein said multilayered material comprises a laminated multilayered printed wiring board composition. 9. The package of claim 8, wherein said microelectronic device is a device selected from the group consisting of a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, and a IMEMS device. 10. The package of claim 8, wherein said microelectronic device is flip-chip mounted to the second surface. 11. The package of claim 8, wherein said microelectronic device comprises a light-sensitive side. 12. The package of claim 11, wherein said light-sensitive side is mounted facing said window. 13. The package of claim 8, further comprising a cover lid bonded to the package, for covering and sealing said package. 14. The package of claim 1, further comprising a microelectronic device