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An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first po

An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

대표청구항 ▼

1. In an electronics module, an apparatus for removing heat from a component located on a surface of said electronics module, comprising; a host board; a front panel coupled to the host board, wherein the host board and the front panel define a physical space envelope of a mezzanine card; a hea

1. In an electronics module, an apparatus for removing heat from a component located on a surface of said electronics module, comprising; a host board; a front panel coupled to the host board, wherein the host board and the front panel define a physical space envelope of a mezzanine card; a heat removal device mounted to the electronics module, wherein the component is located a radial distance from the heat removal device, wherein the heat removal device fastens to a mezzanine card site on the electronics module, and wherein the heat removal device occupies the physical space envelope of the mezzanine card; and a heat conductor having a first portion coupled to the component and having a second portion coupled to the heat removal device. 2. The apparatus of claim 1, wherein the heat removal device fastens to a mezzanine card on the electronics module. 3. The apparatus of claim 1, wherein the heat removal device fastens to a CMC card site on the electronics module. 4. The apparatus of claim 1, wherein the heat removal device fastens to a PMC module site on the electronics module. 5. The apparatus of claim 1, wherein the heat removal device receives heat from the component. 6. The apparatus of claim 1, further comprising a heat rejection device coupled to the heat removal device. 7. An electronic device, comprising: an electronics module having a component located on a surface of said electronics module; a host board coupled to the electronics module; a front panel coupled to the host board, wherein the host board and the front panel define a physical space envelope of a mezzanine card; a heat removal device mounted to the electronics module, wherein the component is located a radial distance from the heat removal device, wherein the heat removal device fastens to a mezzanine card site on the electronics module, and wherein the heat removal device occupies the physical space envelope of the mezzanine card; and a heat conductor having a first end coupled to the component and having a second end coupled to the heat removal device. 8. The electronic device of claim 7, wherein the heat removal device fastens to a mezzanine card on the electronics module. 9. The electronic device of claim 7, wherein the heat removal device fastens to a CMC card site on the electronics module. 10. The electronic device of claim 7, wherein the heat removal device fastens to a PMC module site on the electronics module. 11. The electronic device of claim 7, wherein the heat removal device receives heat from the component. 12. The electronic device of claim 7, further comprising a heat rejection device coupled to the heat removal device. 13. In an electronics module, a method for removing heat from a component located on a surface of said electronics module, comprising: providing a host board; providing a front panel coupled to the host board, wherein the host board and the front panel define a physical space envelope of a mezzanine card; the component generating heat; conveying the heat from the component by way of a heat conductor; and depositing the heat to a heat removal device mounted to the electronics module, wherein the heat removal device fastens to a mezzanine card site on the electronics module, and wherein the heat removal device occupies the physical space envelope of the mezzanine card. 14. The method of claim 13, further comprising the heat removal device fastening to a mezzanine card on the electronics module. 15. The method of claim 13, further comprising the heat removal device fastening to a CMC card site on the electronics module. 16. The method of claim 13, further comprising the heat removal device fastening to a PMC module site on the electronics module. 17. The method of claim 13, wherein depositing the heat comprises the heat removal device receiving heat from the component. 18. The method of claim 13, further comprising removing heat from the heat removal device utilizing a heat rejection device.