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Radial finned heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0847722 (2001-05-02)
발명자 / 주소
  • Smalc, Martin D.
출원인 / 주소
  • Graftech Inc.
대리인 / 주소
    Waddey & Patterson
인용정보 피인용 횟수 : 70  인용 특허 : 30

초록

A radial finned heat sink assembly for an electrical component is constructed from a graphite material, which may be resin impregnated. The assembly includes a base, and a plurality of spaced parallel planar fin members supported by the base. Each fin member includes a planar fin of an anisotropic g

대표청구항

A radial finned heat sink assembly for an electrical component is constructed from a graphite material, which may be resin impregnated. The assembly includes a base, and a plurality of spaced parallel planar fin members supported by the base. Each fin member includes a planar fin of an anisotropic g

이 특허에 인용된 특허 (30)

  1. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Directed air management system for cooling multiple heat sinks.
  2. Hughes Richard P. (Kanata CAX), Electronic devices with electromagnetic radiation interference shields and heat sinks.
  3. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.
  4. Mercuri Robert Angelo ; Capp Joseph Paul ; Gough Jeffrey John, Flexible graphite composite.
  5. Inoue Takao,JPX ; Ikeda Junji,JPX ; Watanabe Yasuyuki,JPX ; Izutani Noboru,JPX ; Mori Kazuhiro,JPX ; Nishiki Naomi,JPX ; Komyoji Daido,JPX ; Yamamoto Katsuhiko,JPX, Graphite cladding laminate structural material and a graphite device having said material.
  6. Larson Ralph I. (North Reading MA), Graphite heat-sink mountings.
  7. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  8. Terpstra Robert L. (Ames IA) Lograsso Barbara K. (Ames IA) Anderson Iver E. (Ames IA) Moore Jeffrey A. (Ames IA), Heat sink and method of fabricating.
  9. Tata Peter D. (Johnston RI) Rife William B. (Greenville RI), Heat sink assembly for solid state devices.
  10. Gabuzda Paul G. (Laguna Beach CA), Heat sink device assembly for encumbered IC package.
  11. Wakabayashi Tetsushi (Kawasaki JPX) Honda Norio (Aizuwakamatsu JPX) Sakuma Osamu (Yokohama JPX), Heat sink for a semiconductor device.
  12. Bellar Robert J. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip.
  13. Dickinson Richard C. (Arlington Heights IL), Heat transfer element having the thermally conductive fibers.
  14. Mariner John Thomas ; Sayir Haluk, High thermal conductivity composite and method.
  15. Fitch John S. ; Hamburgen William R., Independently mounted cooling fins for a low-stress semiconductor package.
  16. Hayward Tommie, Injection molding graphite material and thermoplastic material.
  17. Unger Scott M. ; Riddle Guy T., Integrated circuit heat transfer element and method.
  18. Chung Deborah D. L. (3812 Henley Dr. Pittsburgh PA 15235), Low-density graphite-polymer electrical conductors.
  19. Missele Carl (Elgin IL), Method for heatsinking a controlled collapse chip connection device.
  20. Hayward Tommie P. (Saugus CA), Method of making graphite foam material.
  21. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX), Mounting for printed circuits forming a heat sink with controlled expansion.
  22. McCullough Kevin Albert (Warwick RI), Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member.
  23. Schneider Mark R. (San Jose CA), Powder metal heat sink for integrated circuit devices.
  24. Rostoker Michael D. ; Schneider Mark, Powdered metal heat sink with increased surface area.
  25. Gabuzda Paul G. (Laguna Beach CA), Reduced-stress heat sink device.
  26. Plesinger Boris M. (Scottsdale AZ), Removable protective heat sink for electronic components.
  27. Schneider Mark (San Jose CA) Joroski Joseph (San Jose CA), Stackable heatsink structure for semiconductor devices.
  28. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Staggered radial-fin heat sink device for integrated circuit package.
  29. Pitasi Martin J. (Newbury MA), Surface-to-air heat exchanger for electronic devices.
  30. Yamada Katsunori,JPX ; Kamiya Nobuo,JPX ; Asai Mitsuru,JPX ; Hohjo Hiroshi,JPX, composite material and method for the manufacture.

이 특허를 인용한 특허 (70)

  1. McAlister, Roy Edward, Architectural construct having for example a plurality of architectural crystals.
  2. Yang, Wei; Zhang, Chunbo; Eickhoff, Steven J; Gu, Alex, Blowerless heat exchanger based on micro-jet entrainment.
  3. Spacie, Christopher John; Davies, Robert Kellson; Stirling, Christopher Anthony, Carbon materials.
  4. Sung,Chien Min, Carbonaceous composite heat spreader and associated methods.
  5. Lev, Jeffrey A.; Tracy, Mark S., Computer device heat dissipation system.
  6. Reis, Bradley E.; Smalc, Martin David; Laser, Brian J.; Kostyak, Gary Stephen; Skandakumaran, Prathib; Getz, Matthew G.; Frastaci, Michael, Cycling LED heat spreader.
  7. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Cycling LED heat spreader.
  8. Sung,Chien Min, Diamond composite heat spreader and associated methods.
  9. Sung,Chien Min, Diamond composite heat spreader having thermal conductivity gradients and associated methods.
  10. Sung,Chien Min, Diamond composite heat spreader having thermal conductivity gradients and associated methods.
  11. Sung, Chien-Min, Diamond particle mololayer heat spreaders and associated methods.
  12. Shives,Gary D.; Hoffert,Gerald; Varela,William, Display device.
  13. Shives, Gary D.; Hoffert, Gerald; Varela, William, Display device having improved properties.
  14. Shives, Gary D.; Hoffert, Gerald; Varela, William, Display device having improved properties.
  15. Rosenblatt, Sami; Hone, James; Chen, Changyao, Electromechanical devices and methods for fabrication of the same.
  16. Rosenblatt, Sami; Hone, James; Chen, Changyao, Electromechanical devices and methods for fabrication of the same.
  17. Yang, Wei; Hilton, Leonard; Gu, Yuandong; Park, Jong, Fin fabrication process for entrainment heat sink.
  18. Ellsworth, Jr., Michael J.; Marotta, Egidio; Singh, Prabjit, Finned heat sink.
  19. Hanin,Leonid; Campo,Antonio, Heat exchange device.
  20. Gu, Yuandong; Yang, Wei, Heat sink fin including angular dimples.
  21. Getz, Jr., George; Burkett, Thomas W., Heat sink made from longer and shorter graphite sheets.
  22. Capp,Joseph P.; Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Reis,Bradley E., Heat spreader for display device.
  23. Capp,Joseph P.; Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Reis,Bradley E., Heat spreader for display device.
  24. Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Capp,Joseph Paul, Heat spreader for display device.
  25. Clovesko, Timothy; Norley, Julian; Smalc, Martin David; Capp, Joseph Paul, Heat spreader for emissive display device.
  26. Norley, Julian; Smalc, Martin David; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for plasma display panel.
  27. Norley, Julian; Smalc, Martin David; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for plasma display panel.
  28. Sung, Chien-Min, Heat spreader having single layer of diamond particles and associated methods.
  29. Sung, Chien-Min, Heat spreader having single layer of diamond particles and associated methods.
  30. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Heat spreaders with vias.
  31. Reis, Bradley E.; Cartiglia, James R., Heat spreading circuit assembly.
  32. Kaslusky, Scott F.; St. Rock, Brian; Whiton, John H.; Nardone, Vincent C., Heat transfer device with fins defining air flow channels.
  33. Ford,Brian M.; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson, Integral heat spreader.
  34. Reis,Bradley E.; Cartiglia,James R., LED with integral via.
  35. Dassanayake, Mahendra; Fedele, Gennaro; Karchon, James A.; Hiranthini, Alles, Light assembly having light sources and adjacent light tubes.
  36. Dassanayake, Mahendra; Petku, Brian, Light bulb assembly having internal redirection element for improved directional light distribution.
  37. Öttinger, Oswin; Bacher, Jürgen, Material mixtures for heat storage systems and production method.
  38. Bhatti, Mohinder Singh; Griffin, Patrick Mitchell, Method of making high performance heat sinks.
  39. Ellsworth, Jr.,Michael J.; Marotta,Egidio; Singh,Prabjit, Method of manufacturing a finned heat sink.
  40. Akram, Salman; Hembree, David R., Methods and apparatuses for transferring heat from stacked microfeature devices.
  41. Akram, Salman; Hembree, David R., Methods and apparatuses for transferring heat from stacked microfeature devices.
  42. McAlister, Roy Edward, Methods for fuel tank recycling and net hydrogen fuel and carbon goods production along with associated apparatus and systems.
  43. McAlister, Roy Edward, Methods for manufacturing architectural constructs.
  44. Akram, Salman; Hembree, David R., Methods for transferring heat from stacked microfeature devices.
  45. McAlister, Roy Edward, Methods of manufacture of engineered materials and devices.
  46. Lin, Yi-jun; Zhamu, Aruna; Jang, Bor Z., Nano graphene platelet-reinforced composite heat sinks and process for producing same.
  47. Shives, Gary D.; Hoffert, Gerald; Varela, William, Optimized frame system for a display device.
  48. Shives, Gary D.; Hoffert, Gerald; Varela, William, Optimized frame system for a display device.
  49. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  50. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  51. Dassanayake, Mahendra; De Mel, Srini; Samarabandu, Jagath, Opto-thermal solution for multi-utility solid state lighting device using conic section geometries.
  52. Bae,Sung Won, Plasma display apparatus.
  53. Zhamu, Aruna; Jang, Bor Z, Process for producing unitary graphene matrix composites containing carbon or graphite fillers.
  54. Van Vlerken, Johannes J. L. M.; Spruit, Johannes H. M.; Drenten, Ronald R.; Nijboer, Jakob G.; Weyenbergh, Paulus G. P., Record carrier and apparatus for scanning the record carrier.
  55. Krassowski,Daniel Witold; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson, Sandwiched finstock.
  56. Fujiwara, Kikuo; Tozawa, Masaaki; Shives, Gary D.; Norley, Julian; Reynolds, III, Robert Anderson, Sandwiched thermal solution.
  57. Dassanayake, Mahendra; De Mel, Srini; Samarabandu, Jagath, Solid state light assembly having light redirection elements.
  58. Dassanayake, Mahendra; De Mel, Srini; Samarabandu, Jagath, Solid state light assembly having light sources in a ring.
  59. Dassanayake, Mahendra; Alles, Hiranthini, Solid state lighting device using heat channels in a housing.
  60. Dassanayake, Mahendra; De Mel, Srini; Samarabandu, Jagath, Solid state spot light assembly.
  61. Dassanayake, Mahendra; De Mel, Srini; Samarabandu, Jagath, Solid state tube light assembly.
  62. Sung, Chien-Min; Kan, Ming Chi; Hu, Shao Chung, Stress regulated semiconductor devices and associated methods.
  63. Sung, Chien-Min; Kan, Ming-Chi; Hu, Shao Chung, Stress regulated semiconductor devices and associated methods.
  64. Tzeng, Jing-Wen, Thermal management system.
  65. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for electronic devices.
  66. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for portable electronic devices.
  67. Zhamu, Aruna; Wang, Mingchao; Xiong, Wei; Jang, Bor Z.; Yi-jun, Lin, Unitary graphene material-based integrated finned heat sink.
  68. Chen, Ko-Chun; Lin, Chiu-Lang, Use of a graphite heat-dissipation device including a plating metal layer.
  69. Chen, Ko-Chun; Lin, Chiu-Lang, Use of a graphite heat-dissipation device including a plating metal layer.
  70. White, Joseph M.; Delano, Andrew D., Variable height thermal interface.
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