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Integrated circuit cooling apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25D-023/12
  • H05K-007/20
출원번호 US-0911865 (2001-07-24)
발명자 / 주소
  • Wayburn, Lewis S.
  • Gage, Derek E.
  • Hayes, Andrew M.
  • Barker, R. Walton
  • Niles, David W.
출원인 / 주소
  • Kryotech, Inc.
대리인 / 주소
    Nelson Mullins Riley & Scarborough
인용정보 피인용 횟수 : 26  인용 특허 : 10

초록

An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will be in thermal contact with the mi

대표청구항

An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will be in thermal contact with the mi

이 특허에 인용된 특허 (10)

  1. Susan A. Yeager ; Rakesh Bhatia, Apparatus and method for mounting a heat generating component in a computer system.
  2. Porter Warren W. (Escondido CA), Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices.
  3. Scaringe Robert Peter, Compact avionics-pod-cooling unit thermal control method and apparatus.
  4. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  5. Porter Warren W. (Escondido CA), Electrically-operated heat exchanger release mechanism.
  6. Ashiwake Noriyuki,JPX ; Otaguro Toshio,JPX ; Nishihara Atsuo,JPX ; Honma Mitsuru,JPX, Electronic apparatus.
  7. Hsiao Chieh-Jen,TWX, Heat-dissipating apparatus for an integrated circuit device.
  8. Vader David T. (Mechanicsburg PA) Vasile Vincent C. (Marlboro NY), High performance thermal interface for low temperature electronic modules.
  9. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
  10. Chu Richard C. ; Chrysler Gregory M. ; Simons Robert E., Sub-dew point cooling of electronic systems.

이 특허를 인용한 특허 (26)

  1. Wayburn,Lewis S.; Spearing,Ian G.; Schmidt, Jr.,Charles R., Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test.
  2. Gravell, Anthony R.; Barlow, Richard J., Balanced flow cooling.
  3. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution.
  4. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having very agile wafer temperature control.
  5. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.
  6. Wei, Jie, Cooling system and electronic apparatus having the same.
  7. Cohen, Alan Mark, Heat dissipation assembly for computing devices.
  8. Cohen,Alan Mark, Heat dissipation assembly for computing devices.
  9. Kramer, Gary W.; Frankel, Richard S., High flux heat removal system using liquid ice.
  10. Tilton,Donald E.; Knight,Paul A.; Knaggs,David H., Liquid thermal management socket system.
  11. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, Williams W.; Zubillaga, Glenn W.; Millian, Isaac, Method for agile workpiece temperature control in a plasma reactor using a thermal model.
  12. Kidwell, John E.; Fraim, Michael L., Method of and apparatus for transferring heat energy between a heat exchanging subsystem above the surface of the earth and material therebeneath using one or more coaxial-flow heat exchanging structures producing turbulence in aqueous-based heat-transfering fluid flowing along helically-extending outer flow channels formed therein.
  13. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  14. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  15. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of operating a capacitively coupled plasma reactor with dual temperature control loops.
  16. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using feed forward thermal control.
  17. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control.
  18. Baar, James C; Blazier, Michael W, Moisture-sensitive device protection system.
  19. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  20. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  21. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  22. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  23. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops.
  24. Wayburn, Lewis S.; Mahaffey, Charles M.; Spearing, Ian G.; Gage, Derek E.; Sharpley, Todd C.; Barnes, Cynthia M., Thermal apparatus for engaging electronic device.
  25. Atkinson, Robert R., Thermoelectrically cooling electronic devices.
  26. Wang,Jack; Cheng,Cheng Hua; Lin,Michael; Ma,Charles, Water-cooling heat dissipation system.
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