IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
|
출원번호 |
US-0825666
(2001-04-03)
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발명자
/ 주소 |
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인용정보 |
피인용 횟수 :
25 인용 특허 :
10 |
초록
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A waist-mounted evaporative personal cooling device designed to cool the back of a user, comprises a blower (25), a liquid reservoir (29), a means to deliver liquid from the reservoir a mist of droplets into blower-forced air (33) or directly onto the skin area to which the forced air will be direct
A waist-mounted evaporative personal cooling device designed to cool the back of a user, comprises a blower (25), a liquid reservoir (29), a means to deliver liquid from the reservoir a mist of droplets into blower-forced air (33) or directly onto the skin area to which the forced air will be directed (45), and a duct (27) to guide forced air under the user's shirt or blouse and directly onto or across the skin of the user's back. The device improves on prior art coolers by delivering a powerful evaporative cooling effect directly to a user's back, while being compact, comfortably wearable, and requiring the user to do little or nothing to get its benefit.
대표청구항
▼
A waist-mounted evaporative personal cooling device designed to cool the back of a user, comprises a blower (25), a liquid reservoir (29), a means to deliver liquid from the reservoir a mist of droplets into blower-forced air (33) or directly onto the skin area to which the forced air will be direct
A waist-mounted evaporative personal cooling device designed to cool the back of a user, comprises a blower (25), a liquid reservoir (29), a means to deliver liquid from the reservoir a mist of droplets into blower-forced air (33) or directly onto the skin area to which the forced air will be directed (45), and a duct (27) to guide forced air under the user's shirt or blouse and directly onto or across the skin of the user's back. The device improves on prior art coolers by delivering a powerful evaporative cooling effect directly to a user's back, while being compact, comfortably wearable, and requiring the user to do little or nothing to get its benefit. t said cooled surface; a clamping arrangement attached to said mounting structure to removably secure said thermal head in operative position with respect to said mounting structure, said clamping arrangement including a clamping flange movable with respect to said thermal head but fixed with respect to said mounting structure when attached thereto, said clamping arrangement further including a clamping collar movable with respect to said clamping flange and said thermal head; and a refrigeration system in fluid communication with said flow channel of said thermal head to supply refrigerant fluid thereto. 13. An apparatus as set forth in claim 12, wherein said clamping arrangement further comprises a spring element to urge said thermal head into engagement with said electronic device, said spring element being located between said clamping collar and said thermal head. 14. An apparatus as set forth in claim 1, wherein said refrigerant fluid is respectively conducted to and from said thermal head via an inlet and an outlet tube, said inlet tube being located inside of said outlet tube. 15. An apparatus as set forth in claim 14, wherein said inlet tube and said outlet tube are sufficiently flexible to provide mechanical isolation to said thermal head. 16. An apparatus as set forth in claim 15, wherein said outlet tube is a corrugated metal tube. 17. An apparatus as set forth in claim 15, wherein said inlet tube is a capillary tube. 18. An apparatus as set forth in claim 1, wherein said flow channel of said thermal head has a configuration generally characterized by a plurality of arcuate and concentric passage segments. 19. A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising: a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located so as to define an air pocket surrounding said electronic device; a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween; at least said first housing member being formed substantially entirely of a thermally conductive material, said electronic device being thermally insulated from said first housing member by said air pocket; and a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon. 20. A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising: a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located; a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween; at least said first housing member being formed of a thermally conductive material; a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon; and said first housing member defining a first groove on said outer surface, said first heater element being located in said groove. 21. A thermal housing as set forth in claim 19, wherein said second housing member is formed of a thermally conductive material. 22. A thermal housing as set forth in claim 21, further comprising a second heater element associated with said second housing member to heat an outer surface thereof so as to prevent condensation from forming thereon. 23. A thermal housing as set forth in claim 21, wherein said first and second housing members are formed of aluminum. 24. A thermal housing as set forth in claim 19, further co
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