초록 ▼

Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily sep

Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.

대표청구항 ▼

1. A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of t

1. A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of the first layer, wherein said treating of said surface of said first layer comprises exposing said surface to a plasma. 2. The method of claim 1 wherein said plasma comprises oxygen plasma. 3. A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of the first layer, wherein said first layer comprises a dielectric layer, and wherein said treating of said surface of said first layer comprises exposing said surface to a plasma. 4. The method of claim 3 wherein said plasma comprises oxygen plasma. 5. The method of claim 4 wherein said second layer includes a conductive layer. 6. The method of claim 5 wherein said moving of the second layer comprises peeling the second layer from the treated surface, and additionally comprising exposing the first layer to a fluid selected from the group consisting of a liquid, a gas, and mixtures thereof. 7. The method of claim 6 wherein said fluid is selected from the group consisting of water, steam, and mixtures thereof. 8. The method of claim 7 additionally comprising cutting the second layer prior to exposing the first layer to said fluid.