초록 ▼

The invention provides systems and methods for the deposition of an improved diamond-like carbon material, particularly for the production of magnetic recording media. The diamond-like carbon material of the present invention is highly tetrahedral, that is, it features a large number of the sp3carbo

The invention provides systems and methods for the deposition of an improved diamond-like carbon material, particularly for the production of magnetic recording media. The diamond-like carbon material of the present invention is highly tetrahedral, that is, it features a large number of the sp3carbon-carbon bonds which are found within a diamond crystal lattice. The material is also amorphous, providing a combination of short-range order with long-range disorder, and can be deposited as films which are ultrasmooth and continuous at thicknesses substantially lower than known amorphous carbon coating materials. The carbon protective coatings of the present invention will often be hydrogenated. In a preferred method for depositing of these materials, capacitive coupling forms a highly uniform, selectively energized stream of ions from a dense, inductively ionized plasma. Such inductive ionization is enhanced by a relatively slow moving (or "quasi-static") magnetic field, which promotes resonant ionization and ion beam homogenization.

대표청구항 ▼

1. A thin film comprising: a continuous highly tetahedral amorphous carbon having a surface that has a roughness characterized by a root mean square (RMS) deviation that is less than 10% of a thickness of the highly tetrahedral amorphous carbon, wherein the thickness of the highly tetrahedral amo

1. A thin film comprising: a continuous highly tetahedral amorphous carbon having a surface that has a roughness characterized by a root mean square (RMS) deviation that is less than 10% of a thickness of the highly tetrahedral amorphous carbon, wherein the thickness of the highly tetrahedral amorphous carbon is less than 75 .ANG.. 2. A thin film as in claim 1, wherein the highly tetrahedral amorphous carbon has more than 15% sp3carbon-carbon bonds. 3. A thin film as in claim 1, wherein the highly tetrahedral amorphous carbon has more than 35% sp3carbon-carbon bonds. 4. A thin film as in claim 1, wherein the highly tetrahedral amorphous carbon has more than 70% sp3carbon-carbon bonds. 5. A thin film as in claim 1, further comprising nitrogen between 4 and 30 atomic percent. 6. A thin film as in claim 1, further comprising hydrogen between 8 and 18 atomic percent. 7. A thin film as in claim 1, wherein the highly tetrahedral amorphous carbon has a hards of over 50 GPa. 8. A thin film as in claim 1, wherein the highly tetahedral amorphous carbon has a hardness of about 80 GPa. 9. A thin film as in claim 1, wherein the roughness of the highly tetrahedral amorphous carbon characterized by the RMS deviation is less than 6 .ANG.. 10. A thin film as in claim 1, wherein the thickness of the highly tetrahedral amorphous carbon is less than 50 .ANG.. 11. A thin film as in claim 10, wherein the roughness of the highly tetahedral amorphous carbon characterized by the RMS deviation is less than 4 .ANG.. 12. A thin film comprising: a continuous highly tetahedral amorphous carbon having a percentage of sp3carbon-carbon bonds which varies as a function of a thickness of the highly tetahedral amorphous carbon; wherein the percentage of sp3carbon-carbon bonds increases as the thickness decreases; wherein the thickness of the highly tetrahedral amorphous carbon is less than 75 .ANG.. 13. An apparatus comprising: a substrate comprising at least one of glass, optics, machine tools, and integrated circuits; and a protective coating disposed over the substrate, the protective coating comprising a continuous highly tetrahedral amorphous carbon having a surface that has a roughness characterized by a root mean square (RMS) deviation that is less than 10% of a thickness of the highly tetrahedral amorphous carbon, wherein the thickness of the highly tetahedral amorphous carbon is less than 75 .ANG.. 14. An integrated circuit having a protective coating comprising; a continuous highly tetahedral amorphous carbon having a surface that has a roughness characterized by a root mean square (RMS) deviation that is less than 10% of a thickness of one highly tetrahedral amorphous carbon, wherein the thickness of the highly tetrahedral amorphous carbon is less than 75 .ANG.; and nitrogen between 4 and 30 atomic percent. 15. An integrated circuit as in claim 14, wherein electrical conductivity of the protective coating varies by 5 orders of magnitude.