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An image sensor of a quad flat non-leaded package (QFN). The image sensor of a quad flat non-leaded package includes a lead frame having a plurality of leads and a die pad, and the leads are located around a periphery of the die pad. A molding structure is formed around an outer boundary of the lead

An image sensor of a quad flat non-leaded package (QFN). The image sensor of a quad flat non-leaded package includes a lead frame having a plurality of leads and a die pad, and the leads are located around a periphery of the die pad. A molding structure is formed around an outer boundary of the leads and located on a first surface of the lead frame. A plurality of bonding pads is formed on the active surface of a chip. A plurality of wires is utilized to electrically connect the bonding pads respectively to bonding portions of the leads on a first surface of the lead frame. A liquid compound is filled in between the chip and the molding structure and covering portions of the leads, A transmittance lid is allocated over the active surface, sealing the space between the molding structure and the lead frame.

대표청구항 ▼

1. An image sensor of a quad flat non-leaded package (QFN), comprising: a lead frame having a plurality of leads and a die pad, wherein the leads are located around a periphery of the die pad, and the lead frame has a first surface and a corresponding second surface, each lead having a bonding po

1. An image sensor of a quad flat non-leaded package (QFN), comprising: a lead frame having a plurality of leads and a die pad, wherein the leads are located around a periphery of the die pad, and the lead frame has a first surface and a corresponding second surface, each lead having a bonding portion; a molding structure formed around an outer boundary of the leads and located on the first surface of the lead frame, wherein gaps between the die pad and the leads are covered by the molding structure, a first surface of the die pad and the bonding portions of the leads are exposed, wherein the molding structure and the lead frame are arranged in such a way that a space is formed; a chip having an active surface and a corresponding back surface, wherein a plurality of bonding pads is formed on the active surface, and the chip is located in the space and the back surface of the chip is adhered onto the first surface of the die pad; a plurality of wires utilized to electrically connect the bonding pads respectively to the bonding portions of the leads on the first surface of the lead frame; a liquid compound filled in between the chip and the molding structure and covering portions of the wires, wherein a surface of the liquid compound is approximately coplanar to the active surface of the chip; and a transmittance lid allocated over the active surface and sealing the space between the molding structure and the lead frame. 2. The package of claim 1, wherein the bonding portions of the leads and the periphery of the die pad are formed into step structures, which are covered by the molding structure. 3. The package of claim 1, wherein a material of the molding structure includes epoxy. 4. The package of claim 1, wherein the transmittance lid comprises a transmittance glass placed over the top of the space and fixed onto the mold structure. 5. The package of claim 1, wherein the transmittance lid further comprises a transmittance plastic placed over the top of the space and fixed on the molding structure. 6. An image sensor package, comprising: a carrier having an insulating body and a plurality of leads, wherein the leads are fixed in the insulating body and a cavity is formed in the insulating body; an image sensor chip having an active surface and a corresponding back surface, wherein a plurality of bonding pads is formed on the active surface, and the back surface of the chip is adhered onto a bottom surface of the cavity; a plurality of wires, which electrically connect the bonding pads respectively to the leads; a liquid compound filled in between the chip and the insulating body and covering portions of the wires, wherein a top surface of the liquid compound is approximately coplanar to the active surface of the chip; and a lid located over the active surface and sealing the cavity. 7. The package of claim 6, wherein a material of the insulating body includes a plastic, and a package structure of the image sensor package includes a plastic quad flat package (PQFP). 8. The package of claim 6, wherein a material of the insulating body includes ceramic, and a package structure of the image sensor package includes a ceramic leadless chip carrier (LCC). 9. The package of claim 6, wherein the lid is a transmittance glass placed over the top of the cavity and fixed on the insulating body. 10. The package of claim 6, wherein the lid is a transmittance plastic placed over the top of the cavity and fixed on the insulating body.