IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0726909
(2000-11-30)
|
발명자
/ 주소 |
- Chu, Richard C.
- Ellsworth, Jr., Michael J.
- Simons, Robert E.
|
출원인 / 주소 |
- International Business Machines Corporation
|
대리인 / 주소 |
Wojnicki, Jr., Esq., Andrew J.Radigan, Esq., Kevin P.Heslin Rothenberg Farley & Mesiti P.C.
|
인용정보 |
피인용 횟수 :
46 인용 특허 :
11 |
초록
▼
An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable
An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.
대표청구항
▼
An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable
An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly. hibib, 257/339; US-5548133, 19960800, Kinzer, 257/155; US-5563436, 19961000, Barret et al., 257/328; US-5621234, 19970400, Kato, 257/339; US-5631483, 19970500, Ferla et al., 257/341; US-5633521, 19970500, Koishikawa, 257/336; US-5670392, 19970900, Ferla et al., 437/029; US-5710455, 19980100, Bhatnagar et al., 257/472; US-5731604, 19980300, Kinzer, 257/153; US-5753942, 19980500, Seok, 257/133; US-5795793, 19980800, Kinzer, 437/041.DM; US-5798554, 19980800, Grimaldi et al., 257/401; US-5841167, 19981100, Grimaldi et al., 257/341; US-5900662, 19990500, Frisina et al., 257/341; US-5981343, 19991100, Magri et al., 438/268; US-5981998, 19991100, Frisina et al., 257/339; US-5985721, 19991100, Frisina, 438/268; US-6030870, 20000200, Magri' et al., 438/268; US-6051862, 20000400, Grimaldi et al., 257/341; US-6054737, 20000400, Magri' et al., 257/341; US-6064087, 20000500, Magri' et al., 257/341; US-6090669, 20000700, Franco et al., 438/273; US-6111297, 20000800, Grimaldi et al., 257/401; US-6228719, 20010500, Frisina et al., 438/268
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