$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/34
출원번호 US-0726909 (2000-11-30)
발명자 / 주소
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Simons, Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Wojnicki, Jr., Esq., Andrew J.Radigan, Esq., Kevin P.Heslin Rothenberg Farley & Mesiti P.C.
인용정보 피인용 횟수 : 46  인용 특허 : 11

초록

An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable

대표청구항

An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable

이 특허에 인용된 특허 (11)

  1. Vandersande Ian W. ; Ewell Richard ; Fleurial Jean-Pierre ; Lyon Hylan B., Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices.
  2. Shiu Shou-Yi,TWX ; Fang Yu-Ping,TWX ; Lui Hon-Hung,TWX, Integrated thermoelectric cooler formed on the backside of a substrate.
  3. Xi Xiaomei ; Matijasevic Goran S. ; Brandt Lutz ; Ha Linh, Process for producing high performance thermoelectric modules.
  4. Rowe David M. (Mid Glamorgan GBX), Process of manufacturing miniature thermoelectric converters.
  5. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  6. Deacutis James J. (Hanover NH) Henning Albert K. (Norwich VT), Switchable thermoelectric element and array.
  7. Doke Michael J. (Dallas TX), Thermoelectric apparatus for use with multiple power sources and method of operation.
  8. Ghoshal Uttam Shyamalindu, Thermoelectric cooling system.
  9. Satomura Masafumi,JPX ; Yamasaki Ichiro,JPX ; Yamanaka Ryousuke,JPX, Thermoelectric device and thermoelectric module.
  10. Pence ; IV William E. (Tarrytown NY), Thermoelectric piezoelectric temperature control.
  11. Ghoshal Uttam Shyamalindu, Two dimensional thermoelectric cooler configuration.

이 특허를 인용한 특허 (46)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  2. Lofy, John, Climate controlled seating assembly with sensors.
  3. Lofy, John, Condensation and humidity sensors for thermoelectric devices.
  4. Lofy, John D., Condensation and humidity sensors for thermoelectric devices.
  5. Sosso, Peter F., Cook top.
  6. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  7. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  8. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  9. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  10. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  11. Langenbach, Gerhart S.; Huber, John J.; Punzel, William; Bohlman, Conrad G., Downdraft that is telescoping.
  12. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  13. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  14. Kim,Sarah E.; List,R. Scott; Maveety,James G.; Myers,Alan M.; Vu,Quat T., Electroosmotic pumps using porous frits for cooling integrated circuit stacks.
  15. Kasichainula, Sridhar, Energy harvesting for wearable technology through a thin flexible thermoelectric device.
  16. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  17. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  18. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  19. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  20. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  21. Petrovski, Dusko, Heating and cooling systems for seating assemblies.
  22. Larson,Ralph I., Heatsink assembly and method of manufacturing the same.
  23. Gagas, John M.; Jonovic, Scott A.; Hochschild, Jr., Richard C., Induction cook top with heat management system.
  24. Chen, Howard Hao; Chu, Richard C.; Hsu, Louis L., Integrated thermoelectric cooling devices and methods for fabricating same.
  25. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Method and system for controlling an operation of a thermoelectric device.
  26. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Method of fabricating a cooled electronic system.
  27. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.
  28. Askew,Gregory K., Personal portable environmental control system.
  29. Stolze, Thilo, Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sink.
  30. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  31. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  32. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  33. Keshavarzi, Ali; Segura, Jaume A.; Narendra, Siva G.; De, Vivek K., Selective cooling of an integrated circuit for minimizing power loss.
  34. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities.
  35. David, Milnes P.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Parida, Pritish R.; Schmidt, Roger R.; Steinke, Mark E., Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s).
  36. Hsu, Louis Lu-Chen; Wang, Ping-Chuan; Wei, Xiaojin; Zhu, Huilong, Thermoelectric 3D cooling.
  37. Hsu, Louis Lu-Chen; Wang, Ping-Chuan; Wei, Xiaojin; Zhu, Huilong, Thermoelectric 3D cooling.
  38. Petrovski, Dusko, Thermoelectric device.
  39. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.
  40. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.
  41. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  42. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  43. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  44. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  45. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
  46. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio, Vehicle headliner assembly for zonal comfort.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트