VAV airflow control for preventing processor overflow and underflow
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G05B-013/02
출원번호
US-0696122
(2000-10-25)
발명자
/ 주소
Pouchak, Michael A.
Roth, Roger R.
출원인 / 주소
Honeywell International Inc.
인용정보
피인용 횟수 :
23인용 특허 :
7
초록▼
A method for controlling a variable airflow apparatus to prevent processor overflow and underflow, with the variable airflow apparatus including an airflow sensor for providing an airflow sensor signal, a stored relationship between the airflow sensor signal and an airflow value, a damper for varyin
A method for controlling a variable airflow apparatus to prevent processor overflow and underflow, with the variable airflow apparatus including an airflow sensor for providing an airflow sensor signal, a stored relationship between the airflow sensor signal and an airflow value, a damper for varying airflow, and an actuator for positioning the damper. The method includes energizing the airflow controller, determining either a minimum allowed airflow value based on the stored relationship between the airflow signal and an airflow value, or determining a maximum allowed airflow value based on the stored relationship, and periodically positioning the damper to provide an airflow value within a range limited by the minimum allowed airflow value or the maximum allowed airflow value in response to a signal from the airflow controller.
대표청구항▼
A method for controlling a variable airflow apparatus to prevent processor overflow and underflow, with the variable airflow apparatus including an airflow sensor for providing an airflow sensor signal, a stored relationship between the airflow sensor signal and an airflow value, a damper for varyin
A method for controlling a variable airflow apparatus to prevent processor overflow and underflow, with the variable airflow apparatus including an airflow sensor for providing an airflow sensor signal, a stored relationship between the airflow sensor signal and an airflow value, a damper for varying airflow, and an actuator for positioning the damper. The method includes energizing the airflow controller, determining either a minimum allowed airflow value based on the stored relationship between the airflow signal and an airflow value, or determining a maximum allowed airflow value based on the stored relationship, and periodically positioning the damper to provide an airflow value within a range limited by the minimum allowed airflow value or the maximum allowed airflow value in response to a signal from the airflow controller. escribed in claim 4, wherein performing modification of control parameters further comprises: acquiring error data from said comparison of metrology data to said predetermined standards; determining if said error data is inside a deadband; and modifying at least one control input parameter based upon a determination that said error data is not inside said deadband. 7. The method described in claim 1, wherein performing a multi-wafer-cup process analysis upon the processed semiconductor devices further comprises: processing semiconductor wafers in a first wafer cup; acquiring identification data associated with said semiconductor wafers in said first wafer cup; acquiring metrology data associated with said processed semiconductor wafers in said first wafer cup; correlating said acquired metrology data relating to said semiconductor wafers in said first wafer cup with said identification data; processing semiconductor wafers in a second wafer cup; acquiring identification data associated with said semiconductor wafers in said second wafer cup; acquiring metrology data associated with said processed semiconductor wafers in said second wafer cup; correlating said acquired metrology data relating to said semiconductor wafers in said second wafer cup with said identification data; comparing said correlated metrology results of said semiconductor wafers from said first wafer cup to correlated metrology results of said semiconductor wafers from said second wafer cup; and performing modification of control parameters in response to the comparison of said metrology results. 8. The method described in claim 7, wherein comparing correlated metrology results of said semiconductor wafers from said first wafer cup to correlated metrology results of said semiconductor wafers from said second wafer cup further comprises comparing at least one critical dimension value from metrology data associated with said first wafer cup with metrology data associated with said second wafer cup. 9. The method described in claim 7, wherein performing modification of control parameters further comprises: acquiring error data from said comparison of correlated metrology results of said semiconductor wafers from said first wafer cup to correlated metrology results of said semiconductor wafers from said second wafer cup; determining if said error data is inside a deadband; and modifying at least one control input parameter based upon a determination that said error data is not inside said deadband. 10. An apparatus, comprising: a computer system; a manufacturing model coupled with said computer system, said manufacturing model being capable of generating at least one control parameter input signal; a machine interface coupled with said manufacturing model, said machine interface being capable of receiving process recipes from said manufacturing model; a first processing tool capable of processing semiconductor wafers and coupled with said machine interface, said first processing tool being capable of receiving at least one control input parameter signal from said machine interface; a first wafer cup coupled with said first processing tool for receiving semiconductor wafers, wherein said first wafer cup is capable of applying a photoresist material onto a semiconductor wafer; a second processing tool capable of processing semiconductor wafers and coupled with said machine interface, said second processing tool being capable of receiving at least one control input parameter signal from said machine interface; a second wafer cup coupled with said second processing tool for receiving semiconductor wafers, wherein said second wafer cup is capable of applying a photoresist material onto a semiconductor wafer; a metrology tool coupled with said first processing tool and said second processing tool, said metrology tool being capable of acquiring metrology data; a metrology data processing unit coupled with said metrology tool and sa
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이 특허에 인용된 특허 (7)
Federspiel Clifford C., Adaptive flow controller for use with a flow control system.
Juntunen Robert D. (Minnetonka MN) Roth Roger R. (Minnetonka MN), On-site calibration device and method for nonlinearity correction for flow sensor/transmitter.
Bahali, Sumanta K.; Kamath, Vinod; Foster, Sr., Jimmy G., Fan speed control of rack devices where sum of device airflows is greater than maximum airflow of rack.
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