IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0123279
(2002-04-17)
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발명자
/ 주소 |
- Horng, Alex
- Hong, Ching-Sheng
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출원인 / 주소 |
- Sunonwealth Electric Machine Industry Co., Ltd.
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
11 인용 특허 :
3 |
초록
▼
A heatsink device includes a plurality of heatsink plates (1, 4, 5, 6) each made of heat conductive material. Each of the heatsink plates (1, 4, 5, 6) is formed with at least one through hole (11, 41, 51, 61). A periphery of the through hole (11, 41, 51, 61) is formed by an annular wall (12, 52) or
A heatsink device includes a plurality of heatsink plates (1, 4, 5, 6) each made of heat conductive material. Each of the heatsink plates (1, 4, 5, 6) is formed with at least one through hole (11, 41, 51, 61). A periphery of the through hole (11, 41, 51, 61) is formed by an annular wall (12, 52) or sidewalls 62 which defining a opening(13, 53, 63). A heat conductive post (2, 7) formed as a rod and made of heat conductive material, the heat conductive post (2, 7) is forced to fittingly insert into the through hole (11, 41, 51, 61), so that the heat conductive post (2, 7) may be combined with the heatsink plates (1, 4, 5, 6) more rigidly and stably.
대표청구항
▼
1. A heatsink device, comprising: a plurality of heatsink plates, each made of heat conductive material and being formed with at least one through hole, the through hole consisting of at least three sidewalls, and the opening being defined by any two adjacent said sidewalls; and a heat conductiv
1. A heatsink device, comprising: a plurality of heatsink plates, each made of heat conductive material and being formed with at least one through hole, the through hole consisting of at least three sidewalls, and the opening being defined by any two adjacent said sidewalls; and a heat conductive post formed as a rod and made of heat conductive material, the heat conductive post being forced to be fittingly inserted into the through hole. 2. The heatsink device as claimed in claim 1, wherein the sidewalls are inclined to a center of the through hole. 3. The heatsink device as claimed in claim 1, wherein the heat conductive post has a cross-section identical with that of the through hole. 4. The heatsink device as claimed in claim 1, wherein the heat conductive post is further provided with a channel for fittingly receiving a fixing bar. 5. The heatsink device as claimed in claim 4, wherein the fixing bar is made of low temperature weld material. 6. The heatsink device as claimed in claim 1, wherein an inclined portion is provided on the bottom portion of the sidewall.
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