초록 ▼

A vertical takeoff and landing aircraft is disclosed that includes a support structure having a motor mounted vertically thereto, with the motor having a propeller for rotation in a horizontal plane. A power supply for the motor is mounted to the support structure below the motor and electrical coup

A vertical takeoff and landing aircraft is disclosed that includes a support structure having a motor mounted vertically thereto, with the motor having a propeller for rotation in a horizontal plane. A power supply for the motor is mounted to the support structure below the motor and electrical coupled thereto. A plurality of fins are attached by their first end to the power and extending radially outward therefrom. Vertical posts have there first ends attached to the second end of the fins and extend upward to the plane of rotation of the propeller. A ring is mounted horizontally to the second ends of the plurality of vertical posts surrounding the propeller. The torque produced by the drag of fins as the aircraft rotates in the opposite direction reacting the torque of the propeller equal to the torque of the propeller necessary to achieve hover. The rotational inertia of aircraft is made equal to the rotational inertia of the propeller.

대표청구항 ▼

A vertical takeoff and landing aircraft is disclosed that includes a support structure having a motor mounted vertically thereto, with the motor having a propeller for rotation in a horizontal plane. A power supply for the motor is mounted to the support structure below the motor and electrical coup

A vertical takeoff and landing aircraft is disclosed that includes a support structure having a motor mounted vertically thereto, with the motor having a propeller for rotation in a horizontal plane. A power supply for the motor is mounted to the support structure below the motor and electrical coupled thereto. A plurality of fins are attached by their first end to the power and extending radially outward therefrom. Vertical posts have there first ends attached to the second end of the fins and extend upward to the plane of rotation of the propeller. A ring is mounted horizontally to the second ends of the plurality of vertical posts surrounding the propeller. The torque produced by the drag of fins as the aircraft rotates in the opposite direction reacting the torque of the propeller equal to the torque of the propeller necessary to achieve hover. The rotational inertia of aircraft is made equal to the rotational inertia of the propeller. 6, which further comprises at least one decoupling capacitor mounted on said at least one IC package unit. 9. The electronic module of claim 1, wherein each carrier lead includes a laminar extension which is parallel to and contiguous with said lower major planar surface. 10. The electronic module of claim 9, wherein only those carrier leads which are designed to be at either ground potential or at supply voltage potential during operation of said first set IC package have laminar extensions which function as heat sinks. 11. The electronic module of claim 6, wherein said dielectric body is formed from fiberglass-reinforced plastic material. 12. The electronic module of claim 1, wherein a single surface-mount pad array is employed for bonding both said at least one IC package unit and said nested second-set IC package. 13. The electronic module of claim 12, wherein at least one pad of said surface-mount pad array is split so that corresponding connection elements of said first-set packages and second-set packages may receive unique signals. 14. The electronic module of claim 6, wherein a single surface-mount pad array is employed for bonding both said at least one IC package unit and said nested second-set IC package, and wherein unique signals are fed to corresponding connection elements of a first-set IC package and a second-set IC package nested within said at least one IC package unit to which said first-set IC package is bonded by routing at least one of the signals to an unused connection element position on said second-set IC package, and then rerouting the signal within the carrier body to the appropriate bonding location for a desired connection element on said first-set IC package. 15. The electronic module of claim 1, wherein said first-set and second-set IC packages are of the same size and functionally identical. 16. An electronic module comprising: first and second sets of IC packages, each set comprising at least one package, and each package having a package body containing an integrated circuit chip and a plurality of connection elements coupled to said chip; at least one IC package unit having a carrier with a bonding location for each connection element of said at least one package of said first-set IC package, all bonding locations residing in a common plane, said carrier also having a set of carrier leads, each of which is electrically coupled to a bonding location, said leads extending downwardly from said plane, thereby forming a recess within which said second-set IC package may be nested; a printed circuit board having at least one surface-mount pad array thereon, each surface-mount pad array having conductively bonded thereto both said leads of said carrier of said at least one IC package unit and the connection elements of said at least one package of said nested second-set IC package. 17. The electronic circuit module of claim 16, wherein said carrier comprises only a set of leads to which the connection elements of said at least one package of said first-set IC package are conductively bonded. 18. The electronic module of claim 17, which further comprises an adhesive dielectric film strip bonded to all the leads beneath said mounting location. 19. The electronic module of claim 18, wherein said. adhesive film strip is a thermo-conductive material. 20. The electronic module of claim 19, wherein said adhesive film strip is in contact with said nested second-set IC package. 21. The electronic module of claim 16, wherein said carrier comprises a dielectric carrier body having upper and lower parallel major planar surfaces, said bonding locations are positioned on said upper major planar surface, said carrier leads are affixed to said lower major planar surface, and electrical connection between said carrier leads and said bonding locations is effected by conductively plated apertures which extend between said upper and lower major planar surfaces. 22. The electronic module of claim 16, wherein e