초록 ▼

The present invention is an absorbent structure to be used in absorbent articles, having at least a first region for acquisition/distribution of fluid and a second region for storage of fluid. The first region can contain materials which have a relatively high capillary desorption pressure, as the m

The present invention is an absorbent structure to be used in absorbent articles, having at least a first region for acquisition/distribution of fluid and a second region for storage of fluid. The first region can contain materials which have a relatively high capillary desorption pressure, as the materials in the second region exhibit a sufficiently high capillary absorption pressure so as to still efficiently drain the first region. The first region material has a Capillary Sorption Desorption Height (CSDH 90) of more than 40 cm and the second region material satisfies at least one of following requirements: (a) an absorption capacity of at least 15 g/g at 35 cm in the capsorption test; (b) an absorption capacity of at least 15 g/g at 0 cm in the capsorption test and an absorption efficiency of at least 55% at 40 cm; (c) a Capillary Sorption Absorption height at 50% of its capacity at 0 cm absorption height (CSAH 50) of at least 35 cm in the capsorption test.

대표청구항 ▼

The present invention is an absorbent structure to be used in absorbent articles, having at least a first region for acquisition/distribution of fluid and a second region for storage of fluid. The first region can contain materials which have a relatively high capillary desorption pressure, as the m

The present invention is an absorbent structure to be used in absorbent articles, having at least a first region for acquisition/distribution of fluid and a second region for storage of fluid. The first region can contain materials which have a relatively high capillary desorption pressure, as the materials in the second region exhibit a sufficiently high capillary absorption pressure so as to still efficiently drain the first region. The first region material has a Capillary Sorption Desorption Height (CSDH 90) of more than 40 cm and the second region material satisfies at least one of following requirements: (a) an absorption capacity of at least 15 g/g at 35 cm in the capsorption test; (b) an absorption capacity of at least 15 g/g at 0 cm in the capsorption test and an absorption efficiency of at least 55% at 40 cm; (c) a Capillary Sorption Absorption height at 50% of its capacity at 0 cm absorption height (CSAH 50) of at least 35 cm in the capsorption test. device (6) from the same measurement location. 6. Device according to claim 1, wherein an optical display unit (10) is connected to the evaluation unit (9). perpendicular to the transverse axis of the brake head, each bushing facing and separated from each other, and the plaque bushing being received between both brake head bushings; and a bolt, passing through the plaque bushing and both brake head bushings, thus pivotally linking the brake head to the metal plaques. 4. The joint according to claim 1, wherein the first longitudinal side of each metal plaque is welded to an end of the brake beam. rate processing apparatus according to claim 8, wherein said reaction product is a polymer generated by dry etching a thin film existing on the surface of the substrate by using said resist film as a mask. 10. A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising: an indexer for loading the substrate; a spin processing unit comprising a rotary holding unit for holding the substrate so as to be rotatable, a removal liquid supplying mechanism for supplying said removal liquid toward a surface of the substrate held by said rotary holding unit, and a de-ionized water supplying mechanism for supplying de-ionized water toward the surface of the substrate held by said rotary holding unit; a heating unit comprising a heating plate for heating the entire substrate with the substrate placed thereon; and a transporting unit for transporting the substrate among said indexer, said spin processing unit, and said heating unit. 11. The substrate processing apparatus according to claim 10, wherein after a removal liquid is supplied by said removal liquid supplying mechanism and de-ionized water is supplied by said de-ionized water supplying mechanism, said heating unit heats the substrate transported by said transporting unit from said spin processing unit to said heating unit. 12. The substrate processing apparatus according to claim 10, wherein said heating unit heats the substrate transported by said transporting unit from said indexer to said heating unit before the removal liquid is supplied to the substrate by said removal liquid supplying mechanism. 13. The substrate processing apparatus according to claim 12, wherein after the removal liquid is supplied by said removal liquid supplying mechanism and de-ionized water is supplied by said de-ionized water supplying mechanism, said heating unit also heats the substrate transported by said transporting unit from said spin processing unit to said heating unit. 14. The substrate processing apparatus according to claim 13, further comprising a cooling unit for cooling the substrate heated after de-ionized water is supplied by said de-ionized water supplying mechanism. 15. The substrate processing apparatus according to claim 14, wherein said removal liquid supplying mechanism supplies a heated removal liquid to the substrate. 16. The substrate processing apparatus according to claim 15, wherein said heating unit heats the substrate to a temperature of the removal liquid or higher before the removal liquid is supplied to the substrate by said removal liquid supplying mechanism. 17. The substrate processing apparatus according to claim 16, wherein said organic matter adhered to the substrate is a reaction product generated by conversion of a resist film formed on the substrate. 18. The substrate processing apparatus according to claim 17, wherein said reaction product is a polymer generated by dry etching a thin film existing on the surface of the substrate by using said resist film as a mask. 19. A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising: a substrate holding unit for holding the substrate; a removal liquid supplying mechanism for supplying said removal liquid toward the substrate held by said substrate holding unit; a de-ionized water supplying mechanism for supplying de-ionized water toward the substrate held by said substrate holding unit; a chamber for housing the substrate held by said substrate holding unit; and a pressure reducing unit for reducing pressure in said chamber. 20. The substrate processing apparatus according to claim 19, further comprising a solvent liquid supplying unit for supplying a liquid organic solvent to the substrate. 21. The substrate processing apparatus according to claim 19, further comprising a solvent steam supplying