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Method for removing organic contaminants from a semiconductor surface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/312
출원번호 US-0156437 (1998-09-18)
발명자 / 주소
  • DeGendt, Stefan
  • Knotter, Dirk
  • Heyns, Marc
  • Meuris, Marc
  • Mertens, Paul
출원인 / 주소
  • Interuniversitair Microelektronica Centrum, vzw, Nederlandse Philips Bedrijven B.V.
대리인 / 주소
    McDonnell Boehnen Hulbert & Berghoff
인용정보 피인용 횟수 : 27  인용 특허 : 13

초록

A method for removing organic contaminants from a semiconductor surface whereby the semiconductor is held in a tank and the tank is filled with a fluid such as a liquid or a gas. Organic contaminants, such as photoresist, photoresidue, and dry etched residue, occur in process steps of semiconductor

대표청구항

A method for removing organic contaminants from a semiconductor surface whereby the semiconductor is held in a tank and the tank is filled with a fluid such as a liquid or a gas. Organic contaminants, such as photoresist, photoresidue, and dry etched residue, occur in process steps of semiconductor

이 특허에 인용된 특허 (13)

  1. Schwartzkopf George (Franklin Township ; Warren County NJ), Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened r.
  2. Tsunekawa Sukeyoshi (Tokorozawa JPX) Funatsu Keisuke (Hamura JPX) Kawasumi Kenichi (Ome JPX) Inada Akio (Hinode JPX) Kaku Masaro (Samukawa JPX), Apparatus and method for surface treatment.
  3. Lyon Richard K. (Pittstown NJ), Apparatus and methods for incineration of toxic organic compounds.
  4. Clampitt Darwin A., Etching method for use in fabrication of semiconductor devices.
  5. Ohno, Reiko; Matsuoka, Terumi, Film removing method and film removing agent.
  6. Stanford Thomas B. (San Pedro CA) George ; Jr. Richard C. (Topanga CA) Shinno Jennifer I. (Canoga Park CA) Mehta Dhiren C. (Cypress CA) Rodine Gifford W. (El Segundo CA), Method and system for removing contaminants.
  7. Kashiwase Masaharu (Okayama JPX) Matsuoka Terumi (Okayama JPX), Method for removing organic film.
  8. Wong Man (Dallas TX), Method for vapor phase etching of silicon.
  9. Koizumi Kootaroo (Kodaira JPX) Tsunekawa Sukeyoshi (Tokorozawa JPX) Kawasumi Kenichi (Oume JPX) Kimura Takeshi (Higashimurayama JPX) Funatsu Keisuke (Hamura JPX), Method of and apparatus for removing an organic film.
  10. Matthews Robert R. (Richmond CA), Process and apparatus for the treatment of semiconductor wafers in a fluid.
  11. Lampert Ingolf (Burghausen DEX) Gratzl Christa (Neuotting DEX), Process for the wet-chemical surface treatment of semiconductor wafers.
  12. Holmer Arthur Edward ; Litwin Michael Mark ; Albaugh Kevin Bruce, Removal of carbon from substrate surfaces.
  13. Grebinski Thomas J. (Sunnyvale CA), Surface treatment to remove impurities in microrecesses.

이 특허를 인용한 특허 (27)

  1. Bergman, Eric J., Apparatus for treating a workpiece with steam and ozone.
  2. Kato,Yoshiaki; Yamaguchi,Tuneo; Tamura,Akiyoshi, Manufacturing method for compound semiconductor device.
  3. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Material for cleaning a substrate.
  4. Bergman, Eric J.; Hess, Mignon P., Method for processing the surface of a workpiece.
  5. Elliott, David J.; Millman, Jr., Ronald P.; Tardif, Murray; Aiello, Krista, Method for surface cleaning.
  6. Thomas, Ralph Wayne, Method of ozone conversion in semiconductor manufacturing.
  7. Berry, Ivan; Rounds, Stuart; Hallock, John; Owens, Michael; Dahimene, Mahmoud, Method of photoresist ash residue removal.
  8. Miura, Toshinori, Method of removing resist and apparatus therefor.
  9. Miura, Toshinori, Method of removing resist and apparatus therefor.
  10. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  11. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  12. Verhaverbeke, Steven, Methods for forming connective elements on integrated circuits for packaging applications.
  13. Bergman,Eric J., Methods of thinning a silicon wafer using HF and ozone.
  14. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
  15. Bergman, Eric J., Process and apparatus for treating a workpiece such as a semiconductor wafer.
  16. Gebhart,Thomas Maximilia; Bergman,Eric J., Process and apparatus for treating a workpiece using ozone.
  17. Bergman,Eric J., Process and apparatus for treating a workpiece with gases.
  18. Perng,Baw Ching; Huang,Yi Chen; Huang,Jun Lung; Chan,Bor Wen; Hsu,Peng Fu; Shih,Hsin Ching; Hsu,Lawrance; Tao,Hun Jan, Process for removing organic materials during formation of a metal interconnect.
  19. Bergman,Eric J., Processing a workpiece using water, a base, and ozone.
  20. Vepa, Krishna; Bhatnagar, Yashraj; Rayandayan, Ronald; Wang, Hong, Reclaiming substrates having defects and contaminants.
  21. Verhaverbeke,Steven, Stripping and removal of organic-containing materials from electronic device substrate surfaces.
  22. Chouno,Yasuhiro; Ito,Norihiro; Satake,Keigo; Iino,Tadashi, Substrate processing apparatus and substrate processing method.
  23. Toshima,Takayuki; Shindo,Naoki; Iino,Tadashi, Substrate processing method.
  24. Toshima, Takayuki; Shindo, Naoki; Iino, Tadashi, Substrate processing method and substrate processing apparatus.
  25. Bergman,Eric J.; Gebhart,Thomas Maximilian, System and methods for polishing a wafer.
  26. Kaneko, Kimihisa; Yoshioka, Kunihiko; Imaeda, Minoru, Ultrasonic cleaning method, and ultrasonic cleaning apparatus.
  27. Yates, Donald L., Wafer cleaning with immersed stream or spray nozzle.
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