초록 ▼

Compositions and methods for selectively binding specific metal ions, such as Ca2+and Cd2+,contained in a source solution are disclosed and described. This is accomplished by the use of a composition comprised of an EGTA ligand covalently bonded to a particulate solid supports through a hydrophilic

Compositions and methods for selectively binding specific metal ions, such as Ca2+and Cd2+,contained in a source solution are disclosed and described. This is accomplished by the use of a composition comprised of an EGTA ligand covalently bonded to a particulate solid supports through a hydrophilic spacer. The composition formula of the present invention is SS--A--X--L where SS is a particulate solid support such as silica or a polymeric bead, A is a covalent linkage mechanism, X is a hydrophilic spacer grouping, L is an EGTA ligand with the proviso that when SS is a particulate organic polymer, A--X may be combined as a single covalent linkage. The separation is accomplished by passing a source solution containing the ions to be separated through a column containing the particulate composition, causing the selected ions to be complexed to the EGTA ligand and subsequently removing the selected ions from the column or other separation device by passing an aqueous receiving solution through the separation device and quantitatively stripping the selected ions from the EGTA ligand.

대표청구항 ▼

Compositions and methods for selectively binding specific metal ions, such as Ca2+and Cd2+,contained in a source solution are disclosed and described. This is accomplished by the use of a composition comprised of an EGTA ligand covalently bonded to a particulate solid supports through a hydrophilic

Compositions and methods for selectively binding specific metal ions, such as Ca2+and Cd2+,contained in a source solution are disclosed and described. This is accomplished by the use of a composition comprised of an EGTA ligand covalently bonded to a particulate solid supports through a hydrophilic spacer. The composition formula of the present invention is SS--A--X--L where SS is a particulate solid support such as silica or a polymeric bead, A is a covalent linkage mechanism, X is a hydrophilic spacer grouping, L is an EGTA ligand with the proviso that when SS is a particulate organic polymer, A--X may be combined as a single covalent linkage. The separation is accomplished by passing a source solution containing the ions to be separated through a column containing the particulate composition, causing the selected ions to be complexed to the EGTA ligand and subsequently removing the selected ions from the column or other separation device by passing an aqueous receiving solution through the separation device and quantitatively stripping the selected ions from the EGTA ligand. erconnect", Semitool Products/Sales, Oct. 27, 1998, 4 pages. Laurell Technologies Corporation, Oct. 27, 1998, 6 pages. "VERTEQ" VERTEQ Online, 5 pages. (No Date). "Tantalum, Copper and Damascene: The Future of Interconnects", Singer, P., Semiconductor International, Jun. 1998, 6 pages. "Wafer Processing", Singer, P., Semiconductor International, Jun. 1998, p. 70. "Ney Contact Manual", Pitney, K., Electrical Contacts for Low Energy Uses, Oct. 8, 1974, 19 pages. "Electric Contacts Theory and Application", Holm, R., Springer-Verlag New York Inc, 1967, 27 pages. (No Month).