초록 ▼

An ordinary pattern and a liquid repellent pattern are formed on the base paper. The base paper is then impregnated with a thermosetting resin having a characteristic of being repelled by the liquid repellent pattern. A covering layer of the impregnated resin is formed by the thermosetting resin whi

An ordinary pattern and a liquid repellent pattern are formed on the base paper. The base paper is then impregnated with a thermosetting resin having a characteristic of being repelled by the liquid repellent pattern. A covering layer of the impregnated resin is formed by the thermosetting resin which has not been impregnated into the base paper and remains on the surface of the base paper. As the thermosetting resin for impregnation is repelled by the liquid repellent pattern, the covering layer of the impregnated resin is not formed on the liquid repellent pattern. The covering layer of the impregnated resin is formed so as to be thicker than the liquid repellent pattern. Due to this, a recessed portion is created at the portion where the liquid repellent pattern is formed.

대표청구항 ▼

An ordinary pattern and a liquid repellent pattern are formed on the base paper. The base paper is then impregnated with a thermosetting resin having a characteristic of being repelled by the liquid repellent pattern. A covering layer of the impregnated resin is formed by the thermosetting resin whi

An ordinary pattern and a liquid repellent pattern are formed on the base paper. The base paper is then impregnated with a thermosetting resin having a characteristic of being repelled by the liquid repellent pattern. A covering layer of the impregnated resin is formed by the thermosetting resin which has not been impregnated into the base paper and remains on the surface of the base paper. As the thermosetting resin for impregnation is repelled by the liquid repellent pattern, the covering layer of the impregnated resin is not formed on the liquid repellent pattern. The covering layer of the impregnated resin is formed so as to be thicker than the liquid repellent pattern. Due to this, a recessed portion is created at the portion where the liquid repellent pattern is formed. ange of 2 to 6 wt %, and control Sb/Te in the range of 2.2 to 3.0. Composition of the AgPdCu alloy is adjusted to contain Cu not more than 1.5 wt %. Regarding groove conditions, groove depth is controlled in the range of 40 to 50 nm, groove width in the range of 0.40 to 0.65 μm, thickness of the first dielectric film in the range of 75 to 95 nm, thickness of the recording film in the range of 12 to 18 nm, thickness of the second dielectric film in the range of 20 to 28 nm, and thickness of the reflection film in the range of 60 to 140 nm.