IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0939746
(2001-08-28)
|
우선권정보 |
JP-0257227 (2000-08-28); JP-0184608 (2001-06-19) |
발명자
/ 주소 |
- Arai, Kiyoshi
- Honda, Nobuhisa
- Matsumoto, Hideo
|
출원인 / 주소 |
- Mitsubishi Denki Kabushiki Kaisha
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
5 |
초록
▼
A wiring pattern (26) or (27) and conductor wires (W1, W2) or (W3, W4) not relaying a wiring pattern (22) or (23) fed with an emitter current connect emitter electrodes of a plurality of IGBTs (3) connected in parallel with each other. Thus, oscillation appearing on the potential of a control electr
A wiring pattern (26) or (27) and conductor wires (W1, W2) or (W3, W4) not relaying a wiring pattern (22) or (23) fed with an emitter current connect emitter electrodes of a plurality of IGBTs (3) connected in parallel with each other. Thus, oscillation appearing on the potential of a control electrode of the plurality of IGBTs (3) is suppressed.
대표청구항
▼
A wiring pattern (26) or (27) and conductor wires (W1, W2) or (W3, W4) not relaying a wiring pattern (22) or (23) fed with an emitter current connect emitter electrodes of a plurality of IGBTs (3) connected in parallel with each other. Thus, oscillation appearing on the potential of a control electr
A wiring pattern (26) or (27) and conductor wires (W1, W2) or (W3, W4) not relaying a wiring pattern (22) or (23) fed with an emitter current connect emitter electrodes of a plurality of IGBTs (3) connected in parallel with each other. Thus, oscillation appearing on the potential of a control electrode of the plurality of IGBTs (3) is suppressed. a first die electrically coupled to the inner paddle area; and a second die electrically coupled to the first die through at least some of the inner lead frame fingers, wherein the first die is coupled to one side of the inner paddle area and the second die is coupled to an opposite side of the inner paddle area. 14. The semiconductor package of claim 1, wherein the first die is electrically coupled to the end of at least one of the outer leads and to the first end of at least one of the inner leads, the second die is electrically coupled to the first die through at least one of the inner leads, and the second die is electrically coupled to the end of at least one of the outer leads. 15. The package of claim 1, wherein at least one of the inner leads has a third end that extends toward the exterior of the package. 16. The package of claim 1, wherein a nonconductive layer couples the inner leads to each other, said nonconductive layer being located vertically between the inner leads and the first die. 17. The package of claim 1, wherein a nonconductive layer couples the inner leads to each other, and the inner leads are located vertically between the nonconductive layer and the first die. 18. The package of claim 1, wherein the first ends of the inner leads extend beyond and are interleaved with the ends of adjacent ones of the outer leads. 19. The semiconductor die package of claim 7, wherein the first die is electrically coupled to the second die through at least one of the inner leads. 20. The semiconductor package of claim 7, wherein the first die is electrically coupled to the end of at least one of the outer leads and to the first end of at least one of the inner leads, the second die is electrically coupled to the first die through at least one of the inner leads, and the second die is electrically coupled to the end of at least one of the outer leads. 21. The package of claim 7, wherein the first die and the second die each have a first surface with bond pads thereon and an opposite second surface, the second surface of the first die is coupled to the first side of the inner leads, and the second surface of the second die is coupled to the second side of the inner leads. 22. The semiconductor die package of claim 21, wherein the first die is electrically coupled to the second die through at least one of the inner leads. 23. The package of claim 7, wherein the first die and the second die each have a first surface with bond pads thereon, the first surface of the first die is coupled to the first side of the inner leads, and the first surface of the second die is coupled to the second side of the inner leads. 24. The package of claim 23, further comprising a means to electrically connect the first ends of at least two of the inner leads. 25. The package of claim 23, further comprising a means to electrically connect the second ends of at least two of the inner leads. 26. The package of claim 23, wherein at least some of the bond pads of the second die are centrally located on the first surface of the second die, and at least one of the centrally located bond pads is electrically coupled to a second end of one of the inner leads. 27. The package of claim 23, wherein at least some of the second ends are located over a central portion of the first surface of the second die. 28. The semiconductor die package of claim 7, wherein a nonconductive layer couples the inner leads to each other. 29. The package of claim 11, wherein the second die is coupled over the first die. 30. The package of claim 29, wherein a nonconductive layer couples the inner lead frame fingers to each other. 31. The package of claim 11, wherein the inner lead frame fingers are vertically between the first die and the second die. 32. The package of claim 31, wherein the second die includes bond pads on a first surface thereof, and the first surface faces and is coupled to the inner lead frame fingers. 33. The package of claim 32, wherein at least some o f the bond pads of the second die are centrally located on the first surface of the second die, and are electrically connected by bond wires to inner lead frame fingers. 34. The package of claim 31, wherein the first and second die include bond pads on a respective first surface thereof, and the first surfaces of the first and second dies face away from the inner lead frame fingers. 35. The package of claim 13, wherein the first and second dies are each electrically coupled to at least some of the inner lead frame fingers and to at least some of the outer lead frame fingers. 36. The package of claim 11, further comprising a plastic encapsulant covering the first and second dies and the inner leads, and a thermal pad or a heat slug exposed out of said plastic encapsulant. 37. The package of claim 11, further comprising a plastic encapsulant covering the first and second dies, wherein the inner leads are completely within the plastic encapsulant. 38. The package of claim 37, wherein the inner leads are coupled together by a layer of a nonconductive tape. 39. The package of claim 7, wherein the second die has center bond pads at a central area of a surface of the second die, said bond pads being oriented toward the inner leads. 40. The package of claim 39, wherein at least one said center bond pad is electrically coupled to a second end at least of one of the inner leads under the first die. 41. The package of claim 23, wherein the first die is electrically coupled to the second die through at least one of the inner leads.
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