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Mask on a polymer having an opening width less than that of the opening in the polymer

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
출원번호 US-0944984 (2001-08-30)
발명자 / 주소
  • Farrar, Paul A.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 13  인용 특허 : 65

초록

A typical integrated circuit interconnects millions of microscopic transistors and resistors with aluminum wires buried in silicon-dioxide insulation. Yet, aluminum wires and silicon-dioxide insulation are a less attractive combination than gold, silver, or copper wires combined with polymer-based i

대표청구항

1. An integrated-circuit assembly comprising: one or more transistor contact regions; an oxidation-resistant polymeric layer having one or more openings, with each opening exposing at least a portion of one of the transistor contact regions and having a respective width; and a mask layer overly

이 특허에 인용된 특허 (65)

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이 특허를 인용한 특허 (13)

  1. Farrar,Paul A., Electronic apparatus having a core conductive structure within an insulating layer.
  2. Farrar,Paul A., Hplasma treatment.
  3. Farrar, Paul A., Integrated circuit and seed layers.
  4. Farrar,Paul A., Integrated circuit and seed layers.
  5. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.
  6. Ahn,Kie Y.; Forbes,Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.
  7. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.
  8. Cohen, Guy A.; Cordes, Steven A.; Goma, Sherif A.; Rosner, Joanna; Trewhella, Jeannine M., Processing for overcoming extreme topography.
  9. Cohen, Guy M.; Cordes, Steven A.; Goma, Sherif A.; Rosner, Joanna; Trewhella, Jeannine M., Processing for overcoming extreme topography.
  10. Farrar, Paul A., Structures and methods to enhance copper metallization.
  11. Farrar, Paul A., Structures and methods to enhance copper metallization.
  12. Farrar,Paul A., Structures and methods to enhance copper metallization.
  13. Farrar,Paul A., Structures and methods to enhance copper metallization.
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