초록 ▼

A process for modifying the surface of a polymeric substrate is disclosed, wherein said process is comprised of contacting a surface of a polymeric substrate with a protic liquid or fluid containing a diazonium composition under such conditions that will effectively allow the reaction of the diazoni

A process for modifying the surface of a polymeric substrate is disclosed, wherein said process is comprised of contacting a surface of a polymeric substrate with a protic liquid or fluid containing a diazonium composition under such conditions that will effectively allow the reaction of the diazonium composition with the surface, resulting in the attachment of aromatic groups to the polymeric surface. The polymeric substrate contains aliphatic carbon-hydrogen bonds, while the protic composition is comprised of a diazonium complex formed by diazotizing an amino compound comprised of at least one amino group bonded to an aromatic group. Also disclosed are the products generated using the aforementioned surface modifications.

대표청구항 ▼

A process for modifying the surface of a polymeric substrate is disclosed, wherein said process is comprised of contacting a surface of a polymeric substrate with a protic liquid or fluid containing a diazonium composition under such conditions that will effectively allow the reaction of the diazoni

A process for modifying the surface of a polymeric substrate is disclosed, wherein said process is comprised of contacting a surface of a polymeric substrate with a protic liquid or fluid containing a diazonium composition under such conditions that will effectively allow the reaction of the diazonium composition with the surface, resulting in the attachment of aromatic groups to the polymeric surface. The polymeric substrate contains aliphatic carbon-hydrogen bonds, while the protic composition is comprised of a diazonium complex formed by diazotizing an amino compound comprised of at least one amino group bonded to an aromatic group. Also disclosed are the products generated using the aforementioned surface modifications. e first epoxy resin and the glass fiber substrate in the inner layer ((epoxy resin)/(glass fiber substrate)) is from 0.53 to 2.40. 12. A multiple layer circuit board comprising a prepreg formed by the process of claim 1. 13. The process of claim 1, wherein the solvent is impregnated in the glass fiber substrate for from 0.1 to 0.5 minutes. 14. The process of claim 1, wherein the solvent-impregnated glass fiber substrate is passed through an air stream at a temperature of at least 50° C. lower than the boiling point of the solvent. 15. The process of claim 1, wherein the glass fiber substrate having an inner layer is impregnated with a second epoxy resin for from 0.1 to 0.5 minutes. 16. The process according to claim 1, wherein the solvent-impregnated glass fiber substrate is passed through the air stream for from 1 to 5 minutes.