초록 ▼

A thermal protection system (TPM) for protecting a surface subject to high thermal load comprising a fiber substrate where the substrate is composed of woven or non-woven layers of fibers laminated together, or the substrate is formed by a process of three-dimensional weaving, wherein the fiber subs

A thermal protection system (TPM) for protecting a surface subject to high thermal load comprising a fiber substrate where the substrate is composed of woven or non-woven layers of fibers laminated together, or the substrate is formed by a process of three-dimensional weaving, wherein the fiber substrate has a variable density of fibers, with said density of fibers increasing across the thickness of the TPM, and further wherein the substrate is needled and coupled to an insulation backing.

대표청구항 ▼

1. A thermal protection system for protecting a surface subject to high thermal load, comprising: a fiber substrate having an external side and an opposite internal side wherein said external side faces the surface; wherein said internal side faces the surface; wherein said substrate has a variable

1. A thermal protection system for protecting a surface subject to high thermal load, comprising: a fiber substrate having an external side and an opposite internal side wherein said external side faces the surface; wherein said internal side faces the surface; wherein said substrate has a variable density of fibers with said density of fibers increasing in a direction going from the external side to the internal side. 2. The thermal protection system of claim 1, wherein said fibers are made of carbon, graphite, silicon carbide or ceramic. 3. The thermal protection system of claim 1, wherein said fiber substrate is composed of a plurality of layers of woven fabric. 4. The thermal protection system of claim 1, wherein said fiber substrate is composed of a plurality of layers of non-woven fabrics. 5. The thermal protection system of claim 1, wherein said fiber substrate is composed of plurality of layers of a combination of non-woven and woven fabrics. 6. The thermal protection system of claim 1, wherein said fiber substrate is formed by three-dimensional weaving process. 7. The thermal protection system of claim 1, wherein said fiber substrate is laminated together. 8. The thermal protection system of claim 1, 2, 3, 4, 5, 6 or 7, wherein said fiber substrate is needled in a vertical direction, said direction being from external side to internal side or vice versa. 9. The thermal protection system of claim 8, wherein said fiber substrate has an internal side and an external side which is disposed opposite to the internal side, and said fiber substrate is joined to a support element composed of fibers, wherein said support element has a first side, and a second side which is disposed opposite to the first side, wherein fibers of said support element are oriented in a direction which is parallel to the first and second sides, wherein said support element abuts internal side of the substrate and the first and second sides of the support element are disposed at an angle between 0° and 180° to the substrate, said support element being joined to the substrate by the insertion of individual reinforcement fibers, said reinforcement fibers being inserted first through the external side of the substrate, then exiting the substrate through the internal side, then into the supporting element. 10. The thermal protection system of claim 8, wherein said substrate is impregnated with an organic resin, said resin being of high carbon yield, and charred at least once to achieve conversion of resin to carbon. 11. The thermal protection system of claim 9, wherein said substrate is impregnated with an organic resin, said resin being of high carbon yield, and charred at least once to achieve conversion of resin to carbon. 12. The thermal protection system of claim 10, wherein the charred substrate is impregnated with a silicon based ablative resin and cured. 13. The thermal protection system of claim 11, wherein said charred substrate is impregnated with a silicon based ablative resin and cured. 14. The thermal protection system of claim 12, wherein said resin is an RTV type resin. 15. The thermal protection system of claim 13, wherein said resin is an RTV type resin.