Method for lowering fuel consumption and nitrogen oxide emissions in two-stroke diesel engines
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0682221
(2001-08-08)
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발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
6 인용 특허 :
6 |
초록
▼
A method of lowering fuel consumption and NOxlevels in a two-stroke diesel engine having at least one piston disposed in at least one combustion chamber comprises the steps of providing a compression ratio within the combustion chamber between about 16.5:1 to about 19:1, providing a ratio of peak pr
A method of lowering fuel consumption and NOxlevels in a two-stroke diesel engine having at least one piston disposed in at least one combustion chamber comprises the steps of providing a compression ratio within the combustion chamber between about 16.5:1 to about 19:1, providing a ratio of peak pressure to compressed pressure within the combustion chamber below about 1.4; and providing a trapped air charge density within the combustion chamber of at least 2.77 kg/m3. Combustion within the diesel engine results in NOxlevels in exhaust gases below a predetermined amount and fuel consumption below a predetermined amount.
대표청구항
▼
A method of lowering fuel consumption and NOxlevels in a two-stroke diesel engine having at least one piston disposed in at least one combustion chamber comprises the steps of providing a compression ratio within the combustion chamber between about 16.5:1 to about 19:1, providing a ratio of peak pr
A method of lowering fuel consumption and NOxlevels in a two-stroke diesel engine having at least one piston disposed in at least one combustion chamber comprises the steps of providing a compression ratio within the combustion chamber between about 16.5:1 to about 19:1, providing a ratio of peak pressure to compressed pressure within the combustion chamber below about 1.4; and providing a trapped air charge density within the combustion chamber of at least 2.77 kg/m3. Combustion within the diesel engine results in NOxlevels in exhaust gases below a predetermined amount and fuel consumption below a predetermined amount. A) includes the step of forming a short-circuit wiring for short-circuiting between a signal terminal side and a ground terminal side of the at least one interdigital transducer, the method further comprising a step of cutting the short-circuit wiring between the step (B) and the step (C). 4. A method of producing a surface acoustic wave device according to claim 3, wherein the bumps are made of a material that is the same as that of metal pads which receive the bumps. 5. A method of producing a surface acoustic wave device according to claim 3, wherein the piezoelectric substrate is substantially rectangular-plate shaped and is made of piezoelectric ceramics. 6. A method of producing a surface acoustic wave device according to claim 3, wherein the at least one interdigital transducer includes a pair of interdigital electrodes and reflectors arranged on both sides of the interdigital transducer. 7. A method of producing a surface acoustic wave device according to claim 6, wherein a short circuit wiring connects the electrode pads to the reflectors. 8. A method of producing a surface acoustic wave device according to claim 3, further comprising the step of forming wiring electrodes so as to electrically connect the electrode pads to at least one IDT. 9. A method of producing a surface acoustic wave device according to claim 3, further comprising the step of removing a portion of the insulation film via one of a wet etching process and a dry etching process. 10. A method of producing a surface acoustic wave device according to claim 3, further comprising a second electroconductive film on the whole surface of the piezoelectric substrate. 11. A method of producing a surface acoustic wave device according to claim 3, further comprising the step of forming bus bars, input-output pads, and wiring electrodes. 12. A method of producing a surface acoustic wave device according to claim 3, wherein each of the bus bars, the input-output pads and the wiring electrodes has a two layer structure. 13. A method of producing a surface acoustic wave device according to claim 3, wherein each of the electrode pads have a two layer structure. 14. A method of producing a surface acoustic wave device by use of a flip chip process, comprising the steps of: (A) forming on a piezoelectric substrate, at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigital transducer; (B) forming bumps on the respective electrode pads; and (C) providing an insulating film at a region other than a region where the bumps are formed; further comprising, between the step (A) and the step (B) the steps of: forming a conductive film on a back surface of the piezoelectric substrate which is opposite to a surface where the interdigital transducer is formed; and short-circuiting the electrodes on a front surface of the piezoelectric substrate to the conductive film on the back surface. 15. A method of producing a surface acoustic wave device according to claim 14, wherein in the step (A), a plurality of interdigital transducers and a plurality of electrode pads electrically connected to the interdigital transducer are formed on the piezoelectric substrate so as to form a filter circuit, a conductive pattern substantially surrounding the filter circuit is formed on the piezoelectric substrate. 16. A method of producing a surface acoustic wave device by use of a flip chip process, comprising the steps of: (A) forming on a piezoelectric substrate, at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigital transducer; (B) forming bumps on the respective electrode pads; and (C) providing an insulating film at a region other than a region where the bumps are formed; wherein a thickness of the insulating film formed in the step (C) is selected so as to adjust a frequency of the surface acoustic wave device. 17. A method of producing a surface acoustic wave device according to claim 16, wherein step (C) includes the steps of: forming an insulating film on an entire surface of the piezoelectric substrate, and reducing a thickness of the insulating film so as to adjust a frequency of the surface acoustic wave device. 18. A method of producing a surface acoustic wave device according to claim 16, further comprising the step of measuring the frequency of the surface acoustic wave device, before the step of adjusting the frequency of the surface acoustic wave device.
이 특허에 인용된 특허 (6)
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Chmela Franz,ATX ; Meurer Peter,ATX, Combustion engine.
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Patel Sagar Arvindbhai ; Volpe ; Jr. Rocco, Diesel engine cylinder skip firing system.
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Kimura Shuji,JPX ; Aiyoshizawa Eiji,JPX, Direct injection diesel engine.
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Hsu Bertrand Dahung ; Chen Gong, Increased compression ratio diesel engine assembly for retarded fuel injection timing.
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Collin Lars T. (Mlndal SEX), Method of operating a diesel engine, and diesel engine.
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Slee Roger H. (Warwick GB2), Pistons for internal combustion engines.
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