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Apparatus and method for increasing throughput in fluid processing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F17D-001/04
출원번호 US-0840611 (2001-04-23)
발명자 / 주소
  • McCullough, Kenneth J.
  • Moreau, Wayne M.
  • Simons, John P.
  • Taft, Charles J.
  • Cotte, John M.
출원인 / 주소
  • International Business Machines, Corp.
대리인 / 주소
    Morris, Esq., Daniel P.Perman & Green, LLP
인용정보 피인용 횟수 : 37  인용 특허 : 5

초록

A method and an apparatus, the apparatus including appropriate valves and conduits, for increasing throughput in pressurized fluid processing including storing in a storage chamber of the apparatus a quantity of fluid at a pressure higher than a pressure at which an operation is to take place, while

대표청구항

1. An apparatus for processing an object with a fluid at high pressure, the fluid being from a fluid source, the apparatus comprising: a storage vessel for storing a quantity of the fluid supplied from the fluid source; a pump for pumping the fluid from the fluid source to the storage vessel, sa

이 특허에 인용된 특허 (5)

  1. Chao Sidney C. ; Purer Edna M. ; Sorbo Nelson W., Liquid carbon dioxide cleaning using jet edge sonic whistles at low temperature.
  2. Bergman Eric J. ; Sharp Ian ; Meuchel Craig P. ; Woods H. Frederick, Method and apparatus for high-pressure wafer processing and drying.
  3. Douglas Monte A. ; Templeton Allen C., Method for removing inorganic contamination by chemical derivitization and extraction.
  4. Hatano Tatsuo,JPX, Process-gas supply apparatus.
  5. Ohmi Tadahiro (1-17-301 ; Komegabukuro 2-chome Sendai-shi ; Miyagi-ken 980 JPX), System for supplying ultrahigh purity gas.

이 특허를 인용한 특허 (37)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  4. Wagner, Mark Ian, Composition and methods for forming metal films on semiconductor substrates using supercritical solvents.
  5. Wagner, Mark Ian, Composition and methods for forming metal films on semiconductor substrates using supercritical solvents.
  6. Wagner, Mark Ian, Compositions and methods for forming and depositing metal films on semiconductor substrates using supercritical solvents.
  7. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  8. Colburn, Matthew E.; Shneyder, Dmitriy; Siddiqui, Shahab, Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent.
  9. Colburn,Matthew E.; Shneyder,Dmitriy; Siddiqui,Shahab, Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent.
  10. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  11. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  12. Jones, William D., High pressure fourier transform infrared cell.
  13. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  14. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  15. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  16. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  17. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  18. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  19. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  20. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  21. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  22. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  23. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  24. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  25. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  26. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  27. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  28. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  29. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  30. Wuester,Christopher D., Process flow thermocouple.
  31. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  32. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  33. DeYoung, James, Repairing and restoring strength of etch-damaged low-k dielectric materials.
  34. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  35. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  36. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  37. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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