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Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/00
  • B23K-026/02
출원번호 US-0951439 (2001-09-14)
우선권정보 JP-0284896 (2000-09-20); JP-0265218 (2001-09-03)
발명자 / 주소
  • Terada, Shoichi
  • Yoshimura, Kazuto
  • Masuda, Kenji
  • Ito, Hidehiro
출원인 / 주소
  • Seiko Epson Corporation
대리인 / 주소
    Oliff & Berridge, PLC.
인용정보 피인용 횟수 : 38  인용 특허 : 6

초록

Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a prod

대표청구항

Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a prod

이 특허에 인용된 특허 (6)

  1. Lawson William E. (Somerset WI), Laser cutting apparatus.
  2. Dae-ho Choo KR; Byeong-ill Kim KR; Sung-uk Jung KR; Woo-shik Lee KR; Bum-soo Kim KR, Laser cutting apparatus and method.
  3. Iwai Yasuhiko (Aichi JPX) Hayashi Eikichi (Aichi JPX) Nagamori Satoshi (Osaka JPX), Laser cutting machine.
  4. Nishikawa Yukio (Ikeda JPX) Uesugi Yuji (Osaka JPX) Kuriyama Katsuhiro (Takarazuka JPX) Shioyama Tadao (Sakurai JPX), Laser cutting method and apparatus for effecting said method.
  5. Iso Keiji,JPX, Laser machining apparatus.
  6. Barnekov Vladmir (East Lansing MI) Huber Henry A. (DeWitt MI) Mukherjee Kalinath (Okemos MI), Method and apparatus for cutting boards using opposing convergent laser beams.

이 특허를 인용한 특허 (38)

  1. Veternik, Paul; Scheuch, Stefan; Exner, Ronald H.; Dagestad, Olav; Doll, Paul E.; Lyzenga, Deborah A., Food package having opening feature.
  2. Choo, Dae-Ho; Lee, Sang-Jun; Kwon, Yong-Joon, In-line system and method for manufacturing liquid crystal display.
  3. Abramov, Anatoli Anatolyevich; Sun, Yawei, Laser cutting of glass along a predetermined line.
  4. Alexander, Dennis R.; Bruce, III, John, Laser scribing and machining of materials.
  5. Abramov, Anatoli Anatolyevich; Kemmerer, Marvin William; Sun, Yawei; Zhou, Naiyue, Laser separation of glass sheets.
  6. Umetsu,Kazushige; Amako,Jun; Honda,Kenichi, Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device.
  7. Jeon, Baek-Kyun, Method and apparatus for cutting nonmetallic substrate.
  8. Perreault, Daniel; Flury, Kristi; McGowan, Roger, Method of applying one or more electromagnetic beams to form a fusion bond on a workpiece such as a medical device.
  9. Bruland, Kelly J.; Swaringen, Stephen N.; Baird, Brian W.; Lo, Ho Wai; Hemenway, David Martin; Nilsen, Brady; Vandergiessen, Clint, Methods and systems for semiconductor structure processing using multiple laser beam spots.
  10. Scott,Graeme; O'Brien,Seamue; Campbell Brown,Iain, Monitoring slot formation in substrates.
  11. Scott,Graeme; O'Brien,Seamus; Campbell Brown,Iain, Monitoring slot formation in substrates.
  12. Ito, Yusaku, Optical device and laser beam machining apparatus having optical device.
  13. Cole, Carole A.; Weber, Jeffrey Thomas, Package integrity indicating closure.
  14. Lyzenga, Deborah; Weber, Jeffrey Thomas; Huffer, Scott William; Davis, Benjamin Michael, Package integrity indicating closure.
  15. Vogt, Carole A.; Weber, Jeffrey Thomas, Package integrity indicating closure.
  16. Vogt, Carole A.; Weber, Jeffrey Thomas, Package integrity indicating closure.
  17. Vogt, Carole Anne; Moncayo, Gladys Odette; Weber, Jeffrey Thomas; McDermott, Elizabeth A.; Philipsen, Douglas H., Package integrity indicator for container closure.
  18. Vogt, Carole Anne; Moncayo, Gladys Odette; Weber, Jeffrey Thomas; McDermott, Elizabeth A.; Philipsen, Douglas H., Package integrity indicator for container closure.
  19. Vogt, Carole Anne; Moncayo, Gladys Odette; Weber, Jeffrey Thomas; McDermott, Elizabeth A.; Philipsen, Douglas H., Package integrity indicator for container closure.
  20. Vogt, Carole Anne; Sierra-Gomez, Gladys Odette; Weber, Jeffrey Thomas; McDermott, Elizabeth A.; Philipsen, Douglas H., Package integrity indicator for container closure.
  21. Willey, Jason Denis; Cheema, Parbinder, Packaging.
  22. Abramov, Anatoli Anatolyevich; Wu, Qi; Zhou, Naiyue, Precision laser scoring.
  23. Lyzenga, Deborah A.; Weber, Jeffrey T.; Glydon, James Anthony; Ziolkowski, Evan Michael, Reclosable flexible film packaging products and methods of manufacture.
  24. Lyzenga, Deborah A.; Weber, Jeffrey T.; Doll, Paul E.; Fenech, Louis P., Reclosable flexible packaging and methods for manufacturing same.
  25. Lyzenga, Deborah A.; Weber, Jeffrey Thomas; Fenech, III, Louis Peter; Scarola, Leonard; Leichte, Rachel; Golden, Marty; Doll, Paul E., Reclosable flexible packaging and methods for manufacturing same.
  26. Sierra-Gomez, Gladys Odette; Exner, Ron; Dagestad, Olav; Gracia-Lugo, Alexis Julian, Resealable closure with package integrity feature.
  27. Renders, Eddy; Looymans, Peter, Resealable packaging for food products and method of manufacturing.
  28. Renders, Eddy; Verhaegen, Rene; Looymans, Peter, Resealable packaging for food products and method of manufacturing.
  29. Sierra-Gomez, Gladys Odette; Peters, Eva Marie; Gracia-Lugo, Alexis Julian; Mankowski, Paul Anthony; Philipsen, Douglas; Feldmeier, Daniel Robert, Resealable tray container.
  30. Bruland,Kelly J.; Baird,Brian W.; Lo,Ho Wai; Swaringen,Stephen N., Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset.
  31. Bruland, Kelly J.; Baird, Brian W.; Lo, Ho Wai; Harris, Richard S.; Sun, Yunlong, Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure.
  32. Bruland, Kelly J.; Baird, Brian W.; Lo, Ho Wai; Swaringen, Stephen N.; Evans, Frank G., Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously.
  33. Bruland,Kelly J.; Baird,Brian W.; Lo,Ho Wai; Swaringen,Stephen N.; Evans,Frank G., Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset.
  34. Bruland, Kelly J.; Baird, Brian W.; Lo, Ho Wai, Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows.
  35. Bruland, Kelly J., Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling.
  36. Nagai,Yusuke; Kobayashi,Satoshi; Morishige,Yukio, Silicon wafer dividing method and apparatus.
  37. Dietrich, J?rn, Stripping of FFCs.
  38. Sierra-Gomez, Gladys O; Philipsen, Douglas; Cole, Carole, Tamper evident resealable closure.
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