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Typically high-availability information storage product 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0103665 (1998-06-23)
발명자 / 주소
  • Strickler, Mike T.
출원인 / 주소
  • Hewlett-Packard Development Company, L.P.
인용정보 피인용 횟수 : 36  인용 특허 : 8

초록

A power supply module supplies power to a power bus. The module includes a module casing. Within the module casing is a power supply and a means for cooling the power supply. The power bus supplies power to the means for cooling the module as well as to other devices connected to the power bus. Mult

대표청구항

1. A power supply module for supplying power to a power bus, the power supply module comprising: (a) a module casing; (b) a power supply positioned within the module casing; (c) cooling means positioned within the module casing for providing cooling; (d) means for conducting power from the pow

이 특허에 인용된 특허 (8)

  1. Behl Sunny (San Jose CA) Friedman Jack (San Jose CA), Apparatus for cooling a memory storage device.
  2. Ferchau Joerg U. (Morgan Hill CA) Pham Hoa V. (San Jose CA) Diaz Randall J. (Gilroy CA), Electronic module interconnection system.
  3. Albertine ; Robert J. ; Blomstedt ; John W. ; Edfors ; John E. ; Quattr ini ; Victor L. ; Yoshida ; Paul S., Modular assembly for an electronic computer.
  4. Rabinovitz Josef, Modular disk drive assembly operatively mountable in industry standard expansion bays of personal desktop computers.
  5. Tracewell Larry L. ; Tracewell Matthew S., Modular power supply.
  6. Mullenbach Brian Scott ; Smid Jan Douglas, Multi-function power distribution system.
  7. Wang Joseph,TWX, Power supply assembly.
  8. Uno Hirosi (Kawasaki JPX) Hakamatani Takao (Kawasaki JPX), Storage disk module and storage disk device having a plurality of storage disk modules.

이 특허를 인용한 특허 (36)

  1. Hughes, Robert W., Airflow module and data storage device enclosure.
  2. Sucharczuk, Guy; Pradzynski, Krzysztof; Avlonitis, Artie; Salinas, Jose, Chassis for front and back inserted modules.
  3. Kolb, Michael W.; Pionke, Jeremey; Regimbal, Laurent A., Computer system cooling using temperature monitoring.
  4. Clidaras, Jimmy; Hamburgen, William; Carlson, Andrew; Chow, Steven T. Y.; Leung, Winnie; Sykora, Montgomery; Beaty, Donald L., Computing environments.
  5. Iwakiri, Yoshihisa, Cooling device for accommodated printed circuit board in a chassis.
  6. Carlson, Andrew; Hamburgen, William; Clidaras, Jimmy, Data center air circulation.
  7. Matsushima,Hitoshi; Fukuda,Hiroshi, Disk array apparatus.
  8. Miyamoto,Kenichi; Morishita,Yasuji; Katakura,Yasuyuki; Tanaka,Shigeaki; Kasahara,Yoshikatsu, Disk array apparatus.
  9. Chikusa,Takashi; Hori,Masanori; Tachibana,Toshio; Maki,Takehiro; Honma,Hirotaka, Disk array device.
  10. Suzuki, Katsuyoshi; Sato, Masahiko; Tateyama, Kenichi; Matsunami, Naoto; Kimura, Koichi; Iwasaki, Hidehiko; Takamoto, Kenichi; Muraoka, Kenji; Ishikawa, Takamasa; Yokoyama, Nobuhiro; Takahashi, Kiyotaka; Nagaiwa, Yoshinori, Disk array device.
  11. Suzuki, Katsuyoshi; Sato, Masahiko; Tateyama, Kenichi; Matsunami, Naoto; Kimura, Koichi; Iwasaki, Hidehiko; Takamoto, Kenichi; Muraoka, Kenji; Ishikawa, Takamasa; Yokoyama, Nobuhiro; Takahashi, Kiyotaka; Nagaiwa, Yoshinori, Disk array device.
  12. Matsushima,Hitoshi; Fukuda,Hiroshi, Disk array system.
  13. Haworth, Stephen Paul, Electronics assembly.
  14. Vincent, William Hunt; Osborn, Jay Kevin, Electronics assembly.
  15. Yair, Andrew John; Schnabel, John David; Wrycraft, Sean Conor, Electronics assembly.
  16. Wrycraft,Sean Conor; Osborn,Jay Kevin, Electronics assembly with arrangement for air cooling.
  17. Christensen, Erik; Ross, Clay; Wang, Yifan, Electronics enclosure with airflow management.
  18. Dishman, C. Charles; Howard, Ted A.; Malik, Randhir S.; Nguyen, Trung M., Fault tolerant cooling in a redundant power system.
  19. Konshak, Michael V.; Eichel, Dale R.; Fechner, Jimmy R., Forced air system for cooling a high density array of disk drives.
  20. Hayashi, Toshiyuki, High-density server with redundant power source for server modules.
  21. Hanahan,Bruce A.; Lanus,Mark S.; Sayre,Edward P., Highly available power distribution system.
  22. Hartung,David, Method for electronics equipment cooling having improved EMI control and reduced weight.
  23. Aruga, Kazuhiko; Sato, Eisuke, Method for notifying abnormality in electro device, and electro device.
  24. Clidaras, Jimmy; Whitted, William; Hamburgen, William; Sykora, Montgomery; Leung, Winnie; Aigner, Gerald; Beaty, Donald L., Modular computing environments.
  25. Mueller,Torsten; Seitz,Birgit; Hausdorf,Reiner; Reckziegel,Rudolf, Modules for a measuring device and measuring device.
  26. Adducci, Samuel J; Doorhy, Brendan F; Walker, Jonathan D; Johnson, Rhonda; Calder, Andrew R, Network cabinet with thermal air flow management.
  27. Adducci, Samuel J.; Doorhy, Brendan F.; Walker, Jonathan D.; Johnson, Rhonda L.; Calder, Andrew R., Network cabinet with thermal air flow management system.
  28. Adducci, Samuel J.; Doorhy, Brendan F.; Walker, Jonathan D.; Johnson, Rhonda L.; Calder, Andrew R., Network cabinet with thermal airflow management system.
  29. Kondrat, Paul; Moser, James; Drennan, Scott; Bosloy, Jonathan; Mitchell, Charles; McAllister, Shawn, Serviceable networking appliance chassis.
  30. Shah, Haresh K.; Kotha, Saikrishna M., System and design of cost effective chassis design for networking products.
  31. Regimbal, Laurent A.; Masuyama, Jinsaku, System and method for detecting blank modules.
  32. Wise, Jeffrey L.; Vaananen, Pasi Jukka; Hauser, Stephen A.; Dorsey, James J., System and method for supplying power to electronics enclosures utilizing distributed DC power architectures.
  33. Frangioso, Jr.,Ralph C.; Connor, Jr.,Thomas J.; Wierzbicki,Robert P.; Schillinger,Michael L.; Cieluch,Steven R.; Johnson,Keith C., Techniques for redundant computing from within a 1U form factor with improved serviceability and high availability characteristics.
  34. Wierzbicki,Robert P.; Connor, Jr.,Thomas J.; Frangioso, Jr.,Ralph C.; Maier, Jr.,Paul H.; Borsini,Matthew; Haug,Darrin, Techniques for redundant computing within a 1U form factor with improved resource partitioning and management.
  35. Ong, Tony, Thermal control system.
  36. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
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