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Logic module refrigeration system with condensation control 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0896610 (2001-06-29)
발명자 / 주소
  • Goth, Gary F.
  • Hickey, Jody A.
  • Kearney, Daniel J.
  • Makowicki, Robert
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Gonzalez, Floyd A.Cantor Colburn LLP
인용정보 피인용 횟수 : 21  인용 특허 : 15

초록

A refrigeration system for cooling a logic module includes an evaporator housing including an evaporator block in thermal communication with the logic module. The evaporator housing includes a humidity sensor for detecting a humidity within the evaporator housing. The system further comprises a cont

대표청구항

1. A method of controlling a refrigeration unit for cooling a logic module, comprising: periodically transmitting stuffage data to a controller of the refrigeration unit, the stuffage data comprising the current power drawn by the logic module, ambient temperature, and control codes. 2. The met

이 특허에 인용된 특허 (15)

  1. Tobey Richard (648 Sheraton Dr. Sunnyvale CA 94087), Computer element performance enhancer.
  2. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mecha, Convertible heat exchanger for air or water cooling of electronic circuit components and the like.
  3. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Cooled IC chip modules with an insulated circuit board.
  4. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Dehumidified cooling assembly for IC chip modules.
  5. Rostoker Michael D. ; Schneider Mark R. ; Pasch Nicholas F., Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices.
  6. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Heated PCB interconnect for cooled IC chip modules.
  7. Solomon Raymond (Penn Valley CA), Integrated refrigerated computer module.
  8. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
  9. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  10. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  11. Licari James J. (15711 Arbela Dr. Whittier CA 90803) Tanielian Aram (7013 Cherty Dr. Rancho Palos Verdes CA 92075), Moisture sensor for electronic modules.
  12. Goth Gary F. ; Loparco John J. ; Singh Prabjit, Sealed multi-chip module cooling system.
  13. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Spot cooling evaporator cooling system for integrated circuit chip modules.
  14. Ema Takayuki,JPX, Temperature control device of an optical semiconductor device.
  15. Burbidge Douglas Stephen,CAX ; Anderson Keith Douglas,CAX, Thermoelectric cooler control circuit.

이 특허를 인용한 특허 (21)

  1. Okuda, Noriyuki; Takenaka, Norihiro; Masui, Tomohiro, Air conditioner.
  2. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution.
  3. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having very agile wafer temperature control.
  4. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.
  5. Quesada Saborio, Carlos, Flexible refrigeration platform.
  6. Quesada Saborio, Carlos, Heat exchangers.
  7. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, Williams W.; Zubillaga, Glenn W.; Millian, Isaac, Method for agile workpiece temperature control in a plasma reactor using a thermal model.
  8. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  9. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  10. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of operating a capacitively coupled plasma reactor with dual temperature control loops.
  11. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using feed forward thermal control.
  12. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control.
  13. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  14. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  15. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  16. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  17. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops.
  18. Quesada Saborio, Carlos, Relocatable refrigeration system with pendulum within separator and accumulator chambers.
  19. Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Thermal control system and method.
  20. Cowans,Kenneth W.; Cowans,William W.; Zubillaga,Glenn W.; Millan,Isaac, Thermal control system and method.
  21. Quesada Saborio, Carlos, Tubing element with fins for a heat exchanger.
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