Carton and carton blank
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0068562
(2002-02-06)
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발명자
/ 주소 |
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출원인 / 주소 |
- Meadwestvaco Packaging Systems, LLC
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
7 인용 특허 :
7 |
초록
▼
An article carrier and a blank for an article carrier for holding an article, for example a tray, comprising a top wall, opposed side walls and a base wall hingedly connected together to form a tubular structure and wherein there further comprises an article retention structure hingedly connected to
An article carrier and a blank for an article carrier for holding an article, for example a tray, comprising a top wall, opposed side walls and a base wall hingedly connected together to form a tubular structure and wherein there further comprises an article retention structure hingedly connected to the top wall and the base panel. The article retention structure is formed by a pair of interconnected panels formed from adjacent carton walls and inwardly folded to retain the article within the carrier.
대표청구항
▼
An article carrier and a blank for an article carrier for holding an article, for example a tray, comprising a top wall, opposed side walls and a base wall hingedly connected together to form a tubular structure and wherein there further comprises an article retention structure hingedly connected to
An article carrier and a blank for an article carrier for holding an article, for example a tray, comprising a top wall, opposed side walls and a base wall hingedly connected together to form a tubular structure and wherein there further comprises an article retention structure hingedly connected to the top wall and the base panel. The article retention structure is formed by a pair of interconnected panels formed from adjacent carton walls and inwardly folded to retain the article within the carrier. bonded to a first contact surface in a first bonding process, the bond wire is bonded to a second contact surface in a second bonding process, and the bond wire is severed to leave a portion remaining between the first and second contact surfaces, the method comprising: (i) recalling from a memory at least one variable parameter associated with bond failure detection; (ii) before the first bonding process is carried out, establishing an electric circuit including the bond wire, generating an oscillating electric probe signal at a first point in the circuit, and measuring the voltage at a second point in the circuit; (iii) after the first bonding process is carried out, generating an oscillating electric probe signal at the first point in the circuit, and measuring the voltage at the second point in the circuit; (iv) after the second bonding process is carried out, generating an oscillating electric probe signal at the first point in the circuit and measuring the voltage at the second point in the circuit; (v) after the bond wire is severed, generating an oscillating electric probe signal at the first point in the circuit, and measuring the voltage at the second point in the circuit; and (vi) estimating from the measurements whether the bonding operation was satisfactory; at least one of steps (i) to (vi) employing at least one variable parameter recalled in step (i), which may be modified for optimizing the bond failure detection process. 14. A method according to claim 13 in which said first contact surfaces is a die pad, and said second surface is a substrate. 15. A method according to claim 14 in which said substrate is a lead frame. 16. A method according to claim 13 in which said first and second contact surfaces are both die pads. 17. A method for performing a plurality of bonding operations, each bonding operation comprising the steps of: (i) recalling from a memory at least one respective variable parameter associated with bond failure detection; (ii) establishing an electric circuit including the bond wire, generating an oscillating electric probe signal at a first point in the circuit, and measuring the voltage at a second point in the circuit; (iii) performing a respective first bonding process in which a bond wire is bonded to a first contact surface; (iv) generating an oscillating electric probe signal at the first point in the circuit, and measuring the voltage at the second point in the circuit; (v) performing a respective second bonding process in which the bond wire is bonded to a second contact surface; (vi) generating an oscillating electric probe signal at the first point in the circuit, and measuring the voltage at the second point in the circuit; (vii) a respective step of severing the bond wire to leave a portion remaining between the respective first and second contact surfaces; (viii) generating an oscillating electric probe signal at the first point in the circuit, and measuring the voltage at the second point in the circuit; and (ix) estimating from the measurements whether that bonding operation was satisfactory; wherein for each bonding operation at least one of steps (ii), (iv), (vi), (viii) and (ix) employs at least one variable parameter recalled in step (i), which may be modified for optimizing the bond failure detection process. 18. A method according to claim 17 in which the parameters recalled in step (i) are the same for at least two said bonding operations. 19. A method according to claim 17 in which the parameters recalled in step (i) are different for at least two said bonding operations. 20. An apparatus for monitoring a wire bonding process, the device including: a memory device for storing one or more variable parameters associated with bond failure detection to be monitored; measuring means for establishing an electric circuit including a bond wire; a variable voltage generator for generating an oscillating electric probe signal at a first point in the ci
이 특허에 인용된 특허 (7)
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Oliff James R. (Austell GA), Carton having end panels and for packaging primary articles of cubical shape.
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Haire James P. (Fallston MD) Attman Steven (Owings Mills MD), Concession tray.
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Steadman James M. (Phoeniz AZ), Container-retaining box.
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Domansky Philippe (Chteauroux FRX), Package incorporating flanged containers.
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Oliff James R. (Austell GA) Baugus Gary W. (Atlanta GA), Suspendible carton with end closure structure.
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Sutherland Robert L. (Kennesaw GA), Warp-around carrier with end panels.
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Cassidy Benjamin J. (Waldwick NJ) Justice Gerald F. (Washingtonville NY), Wrapper for a flanged tray.
이 특허를 인용한 특허 (7)
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Miller, David; Phillips, Matthew; Prancuk, Matthew, Circumferential sleeve for holding a food container upright.
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Sadlier,Claus E., Cup and lid holder and dispenser.
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Sadlier, Claus E., Insulating cup wrapper and insulated container formed with wrapper.
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Sadlier, Claus E., Multi-layered container having interrupted corrugated insulating liner.
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LeBras,Philippe, Wraparound carton with inclined beam structure and blank therefor.
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Pfotenhauer,Gundolf; Curtis,Jason, Wraparound package.
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Pfotenhauer, Gundolf; Curtis, Jason, Wraparound packaging.
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