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An inverter generation apparatus comprising means to obtain a reference duty ratio of predetermined switch elements of an inverter on-off driven to each of switch timings so as to have a desired waveform of an AC voltage obtained across load connection terminals, means to obtain correction coefficie

An inverter generation apparatus comprising means to obtain a reference duty ratio of predetermined switch elements of an inverter on-off driven to each of switch timings so as to have a desired waveform of an AC voltage obtained across load connection terminals, means to obtain correction coefficient for the duty ratio relative to a value reflecting a variation in an output voltage of a DC power circuit, means to obtain a real duty ratio by multiplying the reference duty ratio by the correction coefficient whereby the switch elements of the inverter are on-off driven in the real duty ratio so that the desired value of the AC voltage across the load connection terminals.

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An inverter generation apparatus comprising means to obtain a reference duty ratio of predetermined switch elements of an inverter on-off driven to each of switch timings so as to have a desired waveform of an AC voltage obtained across load connection terminals, means to obtain correction coefficie

An inverter generation apparatus comprising means to obtain a reference duty ratio of predetermined switch elements of an inverter on-off driven to each of switch timings so as to have a desired waveform of an AC voltage obtained across load connection terminals, means to obtain correction coefficient for the duty ratio relative to a value reflecting a variation in an output voltage of a DC power circuit, means to obtain a real duty ratio by multiplying the reference duty ratio by the correction coefficient whereby the switch elements of the inverter are on-off driven in the real duty ratio so that the desired value of the AC voltage across the load connection terminals. irst and second substrates when the second substrate is positioned over the first substrate. 7. The module of claim 6 wherein: the active elements of the first and second substrates are write elements and the vertical alignment marks are referenced with respect to zero throat of the write elements. 8. The module of claim 6 wherein: the active elements of the first and second substrates are read elements and the vertical alignment marks are referenced with respect to zero stripe height of the read elements. 9. A module for a tape head assembly comprising: a first substrate having a row of spaced apart read elements; and a second substrate having a row of spaced apart read elements, wherein the second substrate is positioned over the first substrate; wherein the first and second substrates have front surfaces, wherein the read elements of the first and second substrates are located on the front surfaces of the first and second substrates, wherein the front surfaces of the first and second substrates face each other when the second substrate is positioned over the first substrate, wherein the read elements of the first substrate are aligned between the read elements of the second substrate when the second substrate is positioned over the first substrate; wherein the front surfaces of the first and second substrates each include a set of substrate pads and a plurality of conductive leads, each conductive lead connects a respective read element to a corresponding substrate pad, wherein the substrate pads connect the read elements to an external device and each set of substrate pads are positioned on one side of the substrates such that each set of substrate pads are offset with respect to one another when the second substrate is positioned over the first substrate.