초록 ▼

The column address strobe signal (CAS) which is changed in cycles as many as a plurality of times that of a clock signal cycle is input to the memory block (MBK0 to MBKn). A plurality of serial data readout from the memory cell array (10) and parallel/serial converted by a parallel/serial converter

The column address strobe signal (CAS) which is changed in cycles as many as a plurality of times that of a clock signal cycle is input to the memory block (MBK0 to MBKn). A plurality of serial data readout from the memory cell array (10) and parallel/serial converted by a parallel/serial converter circuit (21) in synchronism with a clock signal cycle are output for every cycle when the column address signal (CASADR) is changed. Parallel data input to the memory block and serial/parallel converted by a serial/parallel converter circuit (25) in synchronism with the clock signal cycle are written in the memory cell array. In this way, the access specification that the column address strobe signal is varied once per n cycles of the clock signal allows for a more rapid memory operation.

대표청구항 ▼

The column address strobe signal (CAS) which is changed in cycles as many as a plurality of times that of a clock signal cycle is input to the memory block (MBK0 to MBKn). A plurality of serial data readout from the memory cell array (10) and parallel/serial converted by a parallel/serial converter

The column address strobe signal (CAS) which is changed in cycles as many as a plurality of times that of a clock signal cycle is input to the memory block (MBK0 to MBKn). A plurality of serial data readout from the memory cell array (10) and parallel/serial converted by a parallel/serial converter circuit (21) in synchronism with a clock signal cycle are output for every cycle when the column address signal (CASADR) is changed. Parallel data input to the memory block and serial/parallel converted by a serial/parallel converter circuit (25) in synchronism with the clock signal cycle are written in the memory cell array. In this way, the access specification that the column address strobe signal is varied once per n cycles of the clock signal allows for a more rapid memory operation. other across a width of the base frame. 5. The securing means as described in claim 1, wherein the at least one pivot comprises at least one tab depending from the cover clip and forming a rolled portion at an end thereof. 6. The securing means as described in claim 1, wherein the cover clip is made from a single piece of wavelike sheet metal, and is resilient. 7. The securing means as described in claim 1, wherein an opening is defined in a middle of the cover clip. 8. The securing means as described in claim 1, wherein the locking means comprises a pair of resilient arms extending from the cover clip, and a pair of ears formed on the front columns of the retention module for engaging with the resilient arms. 9. The securing means as described in claim 8, wherein each of the resilient arms has a locking hole defined therein. 10. The securing means as described in claim 1, wherein the locking means comprises a latch extending from the cover clip, and the retention module further has a beam bridging the front columns for engaging with the latch. 11. An electronic device assembly, comprising: a central processing unit mounted on a circuit board; a heat sink; and a securing means attaching the heat sink to the central processing unit, the securing means comprising: a retention module comprising a base frame, and a pair of rear columns and a pair of front columns extending from four corners of the base frame respectively, each of the rear columns defines a recess therein; and a cover clip comprising at least one pivot engaging in the recesses of the rear columns, and locking means engaging with the front columns. 12. The electronic device assembly as described in claim 11, wherein the locking means comprises a pair of resilient arms extending from the cover clip, and a pair of ears formed on the front columns of the retention module engaging with the resilient arms. 13. The securing means as described in claim 12, wherein each of the resilient arms defines a locking hole therein. 14. The electronic device assembly as described in claim 11, wherein the locking means comprises a latch extending from the cover clip, and the retention module further has a beam bridging the front columns and engaging with the latch. 15. The electronic device assembly as described in claim 11, wherein the at least one pivot of the cover clip comprises at least one tab depending from the cover clip and forming a rolled portion at an end thereof. 16. The securing means as described in claim 11, wherein the recesses are defined opposite each other across a width of the base frame. 17. An electrical device assembly comprising: a printed circuit board; a CPU and an associated socket fixedly mounted upon the printed circuit board; a heat sink seated upon the CPU; a retention module securely mounted on the printed circuit board defining an inner space receiving said socket and said CPU therein, said inner space defining lengthwise and lateral dimensions perpendicular to each other, said retention module defining front and rear pairs of column portions upwardly extending beyond the socket with a significant distance; and a cover clip pivotally mounted on said column portions with means at thereof a distal free end to fasten to a portion of the retention module under a condition that the cover clip presses the heat sink against the CPU thereunder; wherein the front pair and the rear pair of the column portions are located within a range of the lateral dimension of said inner space, and the heat sink is dimensioned to be close to said inner space. 18. The assembly as described in claim 17, wherein said column portions substantially fully restrain the heat sink from horizontal movement. 19. The assembly as described in claim 17, wherein a height of the column portions is similar to a height of the heat sink. 20. The assembly as described in claim 17, wherein said cover clip does not fully restrain lateral movement of the heat sink.