초록 ▼

A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser med

A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase. This transition of the phase change material also provides a thermal buffer for laser components such that the phase change material absorbs the energy associated with fluctuations in ambient temperature before transferring it to the laser component. Also, the heat sink assembly can contain more than one type of phase change material, each having a different melting temperature.

대표청구항 ▼

A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser med

A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase. This transition of the phase change material also provides a thermal buffer for laser components such that the phase change material absorbs the energy associated with fluctuations in ambient temperature before transferring it to the laser component. Also, the heat sink assembly can contain more than one type of phase change material, each having a different melting temperature. m Technologies Corp., Published Prior to Applicants Invention. "Radish System Lets Phone Users Send Voice, Data Simultaneously", PC Week, 9 (19), p. 53, (May 11, 1992). "Speech Data Adaptive Multiplexer", IBM Technical Disclosure Bulletin, 27 (2), p. 969, (Jul. 1994). "TechTips--A Periodic Round-up of Technical Applications, Notes and Information on MultiTech's Data Communications Products", MultiTech Systems, 2 (2), (May 1992). "Telewriter Product Description", Optel Communications, Inc., (Published Prior to Applicant's Invention). "Telewriting Terminal Equipment", CCITT (Recommendation T. 150), pp. 228-277, (1988). "The Photophone", GTE Product Brochure, (Feb. 15, 1990). "Videowriter '91 Product Description", Optel Communications, Inc., (1991). "WE DSP16C Digital Signal processor/CODEC Preliminary Data Sheet", AT&T Microelectronics, 1-64, (May 1991). "Z84C01 Z80 CPU with Clock/Generator/Controller", Zilog Intelligent Peripheral Controllers, pp. 43-73, (1991). "Z84C90 CMOS Z80 KIO Serial/Parallel/counter/timer", Zilog Intelligent Peripheral Controllers, pp. 205-224, (1991). Akaiwa, Y., et al., "An Integrated Voice and Data Radio Access System", IEEE, pp. 255-258, (1992). Callens, P., et al., "Speech Data Adaptive Multiplexer", IBM Technical Disclosure Bull., 27, p. 969, (Jul. 1984). Casale, et al., "Statistical voice/high speed data multiplexing on a 64 kbit/s channel", Phoenix Conference on Computers and Communications, Scottsdale, AZ, pp. 459-464, (Mar. 27, 1991). Cuperman, V., et al., "Backward Adaptive Configurations For Low-Delay Vector Excitation Coding", Advances In Speech Coding, pp. 13-23, (Jan. 1, 1996). Erskine, C., et al., "VoicePump: voice-Over-Data Modem Technology Utilizing ASM CELP Speech Compression at 4800, 7200 and 9600 Bits Per Second", Proceedings of the International Conference on Signal Processing Applications and Technology, 2, pp. 1425-1429, (Sep. 28, 1993). Gulick, et al., "Interface the ISDN to your PC with a Voice/Data Board", Electronic Design, 35 (29), pp. 85-88, (Dec. 10, 1987). Kishimoto, et al., "Simultaneous Transmission of Voice and Handwriting Signals: Sketchphone System", IEEE Transaction on Communication, COM-29, 12, pp. 1982-1986, (Dec. 1981). Komiya, et al., "An approach to the multifunction graphic terminal for the ISDN environment", IEEE Global Telecommunications Conference and Exhibition, 1, Hollywood, FL, pp. 32-36, (Nov. 28, 1988). Laube, M., "Audiographic Terminal", Electrical Communication, 60