Fuel cell systems with controlled anode exhaust
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IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01M-008/04
H01M-008/12
출원번호
US-0742757
(2000-12-20)
발명자
/ 주소
Singh, Prabhakar
Teimor, Mehrdad
Clark, Walter Franklin
출원인 / 주소
Visteon Global Technologies, Inc.
대리인 / 주소
Kajander, John
인용정보
피인용 횟수 :
3인용 특허 :
13
초록▼
An electrical storage device is coupled in parallel to a fuel cell contained within a fuel cell power generation system. The electrical storage device is either a battery pack, a plurality of capacitors, or a plurality of supercapacitors and is capable of electrochemically oxidizing a quantity of re
An electrical storage device is coupled in parallel to a fuel cell contained within a fuel cell power generation system. The electrical storage device is either a battery pack, a plurality of capacitors, or a plurality of supercapacitors and is capable of electrochemically oxidizing a quantity of reformer gas contained within an anode chamber of the fuel cell during transient load conditions by charging from a preset state of charge towards full capacity. The energy storage device thereby prevents large quantities of unoxidized reformer gas from entering a chamber of a combuster during transient load conditions, unoxidized reformer gas that generates a tremendous amount of heat when burned that can corrode or damage the combuster. The energy storage device discharges the excess charge when the fuel cell power generation system returns to normal load conditions or during transient load conditions when the amount of reformer gas entering the anode chamber has been reduced so that the amount of unoxidized reformer gas entering the combuster is maintained at a nearly constant level.
대표청구항▼
An electrical storage device is coupled in parallel to a fuel cell contained within a fuel cell power generation system. The electrical storage device is either a battery pack, a plurality of capacitors, or a plurality of supercapacitors and is capable of electrochemically oxidizing a quantity of re
An electrical storage device is coupled in parallel to a fuel cell contained within a fuel cell power generation system. The electrical storage device is either a battery pack, a plurality of capacitors, or a plurality of supercapacitors and is capable of electrochemically oxidizing a quantity of reformer gas contained within an anode chamber of the fuel cell during transient load conditions by charging from a preset state of charge towards full capacity. The energy storage device thereby prevents large quantities of unoxidized reformer gas from entering a chamber of a combuster during transient load conditions, unoxidized reformer gas that generates a tremendous amount of heat when burned that can corrode or damage the combuster. The energy storage device discharges the excess charge when the fuel cell power generation system returns to normal load conditions or during transient load conditions when the amount of reformer gas entering the anode chamber has been reduced so that the amount of unoxidized reformer gas entering the combuster is maintained at a nearly constant level. form a cyclic, bicylic or heterocyclic structure, which may be substituted by straight chain or branched alkyl groups of from 1 to about 6 carbon atoms, or straight chain branched alkenyl groups of 2 to about 6 carbon atoms; and (b) a curing agent component. 5. The composition according to claim 1, wherein the episulfide-containing aromatic compound is a member selected from the group consisting of: 6. The composition according to claim 1, wherein the epoxy- or episulfide-containing aromatic compound is selected from the group consisting of members within the following formula: 7. The composition according to claim 1, wherein the curing agent component is a member selected from the group consisting of anhydride compounds, aza compounds, amine compounds, amide compounds, imidazole compounds, and combinations thereof. 8. The composition according to claim 1, further comprising an inorganic filler component. 9. The composition according to claim 8, wherein the inorganic filler component is a member selected from the group consisting of materials constructed of or containing reinforcing silicas, aluminum oxide, silicon nitride, aluminum nitride, silica-coated aluminum nitride, boron nitride, and combinations thereof. 10. The composition according to claim 1, further comprising a flowability agent. 11. The composition according to claim 10, wherein the flowability agent is a member selected from the group consisting of silanes, titanates and combinations thereof. 12. The composition according to claim 10, wherein the flowability agent is selected from octyl trimethoxy silane, methacryloxy propyl trimethoxy silane, titanium IV tetrakis[2,2-bis[(2-propenyloxy)methyl]-1-butanolato-0][bis(ditridecylphosphito-0), dihydrogen]2,and combinations thereof. 13. The composition according to claim 1, further comprising an adhesion promtor. 14. The composition according to claim 13, wherein the adhesion promoter is a member selected from the group consisting of glycidyl trimethoxysilane, gamma-amino propyl triethoxysilane, and combinations thereof. 15. The composition according to claim 1, further comprising a cyanate ester. 16. The composition according to claim 15, wherein the cyanate ester is a member selected from the group consisting of dicyanatobenzenes, tricyanatobenzenes, dicyanatonaphthalenes, tricyanatonaphthalenes, dicyanatobiphenyl, bis(cyanatophenyl)methanes and alkyl derivatives thereof, bis(dihalocyanatophenyl)propanes, bis(cyanatophenyl)ethers, bis(cyanatophenyl)sulfides, bis(cyanatophenyl)propanes, tris(cyanatophenyl)phosphites, tris(cyanatophenyl)phosphates, bis(halocyanatophenyl)methanes, cyanated novolac, bis[cyanatophenyl(methylethylidene)]benzene, cyanated bisphenol-terminated thermoplastic oligomers, and combinations thereof. 17. The composition according to claim 7, wherein the anhydride compounds may be selected from the group consisting of hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride, 5-(2,5-dioxotetrahydrol)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, and combinations thereof. 18. The composition according to claim 7, wherein the aza compounds may be selected from the group consisting of 19. The composition according to claim 7, wherein the amine compounds may be selected from the group consisting of dicyandiamide, diethylenetriamine, triethylenetetramine, diethylaminopropylamine, m-xylenediamine, diaminodiphenylamine, isophoronediamine, menthenediamine, polyamides, and combinations thereof. 20. The composition according to claim 1, wherein the amide compounds may be dicyandiamide. 21. The composition according to claim 1, wherein the imidazole compounds may be selected from the group consisting of imidazole, isoimidazole, 2-methyl imidazole, 2-ethyl-4-methylimidazole, 2,4-dimethylimidazole, butylimidazole, 2-heptadecenyl-4-methylimidazole, 2-undecenylimidazole, 1-vinyl-2-methylimidazole, 2-n-heptadecylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-benzyl-2-meth ylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-guanaminoethyl-2-methylimidazole, addition products of an imidazole and trimellitic acid, addition products of an imidazole and 2-n-heptadecyl-4-methylimidazole, phenylimidazole, benzylimidazole, 2-methyl-4,5-diphenylimidazole, 2,3,5-triphenylimidazole, 2-styrylimidazole, 1-(dodecyl benzyl)-2-methylimidazole, 2-(2-hydroxyl-4-t-butylphenyl)-4,5-diphenylimidazole, 2-(2-methoxyphenyl)-4,5-diphenylimidazole, 2-(3-hydroxyphenyl)-4,5-diphenylimidazole, 2-(p-dimethylaminophenyl)-4,5-diphenylimidazole, 2-(2-hydroxyphenyl)-4,5-diphenylimidazole, di(4,5-diphenyl-2-imidazole)-benzene-1,4, 2-naphthyl-4,5-diphenylimidazole, 1-benzyl-2-methylimidazole, 2-p-methoxystyrylimidazole, and combinations thereof. 22. The composition according to claim 8, wherein the curable resin component is present in an amount within the range of about 10 to about 70 weight percent, based on the total weight of the composition, of which about 10 to about 75 weight percent thereof is comprised of an epoxy- or episulfide-containing aromatic compound according to claim 1; the curing agent component is present in an amount within the range of 3 to about 100 weight percent, based on the total weight of the epoxy resin component; the inorganic filler component is present in an amount up to about 70 weight percent, based on the total weight of the composition; and further comprising (d) a flowability agent, present in an amount up to about 0.5 weight percent, based on the total weight of the composition. 23. The composition according to claim 1, capable of sealing underfilling between a semiconductor device including a semiconductor chip mounted on a carrier substrate and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected. 24. Reaction products formed from the compositions according to claim 1. 25. An electronic device comprising a semiconductor device and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected, assembled using a thermosetting resin composition according to claim 1 as an underfill sealant between the semiconductor device and the circuit board or the semiconductor chip and the circuit board, respectively, wherein reaction products of the composition are capable of softening and losing their adhesiveness under exposure to temperature conditions in excess of those used to cure the composition. 26. A method of sealing underfilling between a semiconductor device including a semiconductor chip mounted on a carrier substrate and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected, the steps of which comprise: (a) dispensing into the underfilling between the semiconductor device and the circuit board or the semiconductor chip and the circuit board a composition in accordance with claim 1; and (b) exposing the composition as so dispensed to conditions appropriate to cause the composition to form a reaction product. 27. A method of reworking a reaction product of a composition in accordance with claim 1, a step of which comprises: (a) exposing the reaction product to conditions appropriate to cause the reaction product to soften and lose adhesiveness. 28. The method according to claim 27, wherein the reaction product seals the underfilling between a semiconductor device including a semiconductor chip mounted on a carrier substrate and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected further comprisi
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이 특허에 인용된 특허 (13)
Palmer Ian (Cumbria GBX) Seymour Clive M. (Cumbria GBX) Dams Robert A. J. (West Sussex GBX), Application of fuel cells to power generation systems.
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