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Heat-curable, thermally expandable moulded park 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08J-009/02
출원번호 US-0914555 (2001-08-31)
우선권정보 DE-0009270 (1999-03-03)
국제출원번호 PCT/EP00/01474 (2000-02-23)
국제공개번호 WO00/52086 (2000-09-08)
발명자 / 주소
  • Reitenbach, Dirk
  • Muenz, Xaver
출원인 / 주소
  • Henkel Teroson GmbH
대리인 / 주소
    Harper, Stephen D.
인용정보 피인용 횟수 : 101  인용 특허 : 37

초록

Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably cont

대표청구항

Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably cont

이 특허에 인용된 특허 (37)

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