초록 ▼

A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipa

A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipating greater amounts of heat and by substantially decreasing the cooling fluid flow to those racks dissipating lesser amounts of heat, the amount of energy required to operate the cooling system may be relatively reduced. Thus, instead of operating the devices, e.g., compressors, fans, etc., of the cooling system at substantially 100 percent of the anticipated heat dissipation from the racks, those devices may be operated according to the actual cooling needs. In addition, the racks may be positioned throughout the data center according to their anticipated heat loads to thereby enable computer room air conditioning (CRAC) units located at various positions throughout the data center to operate in a more efficient manner. In one respect, the positioning of the racks may be determined through implementation of numerical modeling and metrology of the cooling fluid flow throughout the data center. In addition, the numerical modeling may be implemented to control the volume flow rate and velocity of the cooling fluid flow through each of the vents.

대표청구항 ▼

A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipa

A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipating greater amounts of heat and by substantially decreasing the cooling fluid flow to those racks dissipating lesser amounts of heat, the amount of energy required to operate the cooling system may be relatively reduced. Thus, instead of operating the devices, e.g., compressors, fans, etc., of the cooling system at substantially 100 percent of the anticipated heat dissipation from the racks, those devices may be operated according to the actual cooling needs. In addition, the racks may be positioned throughout the data center according to their anticipated heat loads to thereby enable computer room air conditioning (CRAC) units located at various positions throughout the data center to operate in a more efficient manner. In one respect, the positioning of the racks may be determined through implementation of numerical modeling and metrology of the cooling fluid flow throughout the data center. In addition, the numerical modeling may be implemented to control the volume flow rate and velocity of the cooling fluid flow through each of the vents. erg et al., 360/245.3; US-5867347, 19990200, Knight et al., 360/294.5; US-5869354, 19990200, Leedy, 438/110; US-5896246, 19990400, Budde et al., 360/244.4; US-5898541, 19990400, Boutaghou et al., 360/294.4; US-5898544, 19990400, Krinke et al., 360/264.5; US-5910010, 19990600, Nishizawa et al., 438/015; US-5920441, 19990700, Cunningham et al., 360/078.05; US-5936805, 19990800, Imaino, 360/294.5; US-5938106, 19990800, Pierson, 228/246; US-5943155, 19990800, Goossen, 359/247; US-5946559, 19990800, Leedy, 438/157; US-5949571, 19990900, Goossen et al., 359/291; US-5955659, 19990900, Gupta et al., 073/054.01; US-5955817, 19990900, Dhuler et al., 310/307; US-5959376, 19990900, Allen, 310/040.MM; US-5959808, 19990900, Fan et al., 360/294.3; US-6038104, 20000300, Sato et al., 360/294.3; US-6157521, 20001200, Utsunomiya, 360/294.5; US-6198606, 20010300, Boutaghou et al., 360/294.3; US-6201667, 20010300, Yamamoto et al., 360/264.2; US-6295185, 20010900, Stefansky, 360/294.5