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A multiple gang junction box assembly includes a main box and wire clamping devices.disposed in an interior chamber of and attached to the main box. Each wire clamping device includes a clamp housing structure attached to the main box so as to define a passage therethrough into its interior chamber

A multiple gang junction box assembly includes a main box and wire clamping devices.disposed in an interior chamber of and attached to the main box. Each wire clamping device includes a clamp housing structure attached to the main box so as to define a passage therethrough into its interior chamber and a clamp member disposed in the housing structure across the passage and flexably bendable at an upper end attached to the main box so as to enable the clamp member to undergo pivotal movement from a closed position toward an open position relative to the passage such that a lower end of the clamp member and a plurality of barbs on the housing structure can assume a locking condition relative to a wire pushed into the main box through passage that prevents the wire from being pulled back through the passage and from the main box.

대표청구항 ▼

A multiple gang junction box assembly includes a main box and wire clamping devices.disposed in an interior chamber of and attached to the main box. Each wire clamping device includes a clamp housing structure attached to the main box so as to define a passage therethrough into its interior chamber

A multiple gang junction box assembly includes a main box and wire clamping devices.disposed in an interior chamber of and attached to the main box. Each wire clamping device includes a clamp housing structure attached to the main box so as to define a passage therethrough into its interior chamber and a clamp member disposed in the housing structure across the passage and flexably bendable at an upper end attached to the main box so as to enable the clamp member to undergo pivotal movement from a closed position toward an open position relative to the passage such that a lower end of the clamp member and a plurality of barbs on the housing structure can assume a locking condition relative to a wire pushed into the main box through passage that prevents the wire from being pulled back through the passage and from the main box. r. Using the etching mask layer as a mask, an anisotropic slant etching is carried out to etch the conductive layer to a predefined depth so that an opening in the upper section of the floating gate is formed. The etching mask layer is then removed. An inter-gate dielectric layer and a control gate layer are sequentially formed over the upper section of the floating gate to form a complete gate structure. orming the opening and before forming the connection joint. 5. The method of claim 3, including attaching the conductive trace to the insulative base before attaching the chip to the conductive trace. 6. The method of claim 3, wherein forming the opening includes applying a wet chemical etch to the metal base and then applying a laser that ablates the insulative base and the adhesive. 7. The method of claim 1, including: providing a laminated structure that includes the metal base, the insulative base and the conductive trace; then mechanically attaching the laminated structure to the chip; then etching the metal base to remove a portion of the metal base that overlaps the pad; then removing a portion of the insulative base that overlaps the pad; then forming the connection joint; and then etching the metal base to remove the portion of the metal base that contacts the contact terminal. 8. The method of claim 1, including depositing an insulator into the opening and on the insulative base and the connection joint before removing the portion of the metal base. 9. The method of claim 1, wherein the metal base and the connection joint are copper. 10. The method of claim 1, wherein the connection joint is devoid of wire bonds, TAB leads and solder joints. 11. A method of connecting a conductive trace and an insulative base to a semiconductor chip, comprising: providing a semiconductor chip that includes a conductive pad; providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a contact terminal and a routing line, and the contact terminal extends through the insulative base and into the metal base; then disposing an insulative adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip; then forming an opening that extends through the metal base, the insulative base and the adhesive, exposes the routing line and the pad and is spaced from the contact terminal; then forming a connection joint that contacts and electrically connects the routing line and the pad; and then removing a portion of the metal base that contacts the contact terminal. 12. The method of claim 11, wherein the routing line overlaps only one peripheral edge of the pad. 13. The method of claim 11 wherein the routing line overlaps only two peripheral edges of the pad, and the two peripheral edges are opposite one another. 14. The method of claim 11, wherein the routing line overlaps at least one peripheral edge of the pad and overlaps a center of the pad but does not overlap each peripheral edge of the pad. 15. The method of claim 11, wherein forming the opening includes applying a wet chemical etch that removes a portion of the metal base. 16. The method of claim 11, wherein forming the opening includes applying a laser that ablates the insulative base and the adhesive. 17. The method of claim 11, wherein forming the opening includes applying a wet chemical etch that removes a portion of the metal base and then applying a laser that ablates the insulative base and the adhesive. 18. The method of claim 11, wherein the removing the portion of the metal base exposes a distal end of the contact terminal that faces away from the chip. 19. The method of claim 11, wherein the removing the portion of the metal base removes all remaining portions of the metal base. 20. The method of claim 11, wherein the connection joint contacts a surface of the routing line that is disposed above and overlaps and faces away from the pad. 21. The method of claim 11, wherein the connection joint contacts opposing peripheral sidewalls of the routing line that are disposed above and overlap and are orthogonal to the pad. 22. The method