초록 ▼

A horizontally oriented laundry washing machine which includes automatic balancers is operated at a speed below the stick speed for the laundry load to redistribute portions of the load in the wash basket. By monitoring a condition of the machine indicative of the level of balance of the load, and s

A horizontally oriented laundry washing machine which includes automatic balancers is operated at a speed below the stick speed for the laundry load to redistribute portions of the load in the wash basket. By monitoring a condition of the machine indicative of the level of balance of the load, and selectively accelerating and decelerating the wash basket about the stick speed, the load can be redistributed so that the load imbalance is sufficient low to speed up the wash basket through its natural resonant frequencies.

대표청구항 ▼

A horizontally oriented laundry washing machine which includes automatic balancers is operated at a speed below the stick speed for the laundry load to redistribute portions of the load in the wash basket. By monitoring a condition of the machine indicative of the level of balance of the load, and s

A horizontally oriented laundry washing machine which includes automatic balancers is operated at a speed below the stick speed for the laundry load to redistribute portions of the load in the wash basket. By monitoring a condition of the machine indicative of the level of balance of the load, and selectively accelerating and decelerating the wash basket about the stick speed, the load can be redistributed so that the load imbalance is sufficient low to speed up the wash basket through its natural resonant frequencies. pray arm is extendible and further comprising the steps of extending said spray arm prior to the step of dispensing said liquid product. 8. The process of claim 1 wherein said spray arm comprises a handle, a telescopingly extendible wand connected to said handle and at least one product dispensing nozzle in fluid communication with said pump, said dispensing nozzle being connected to said spray arm. 9. The process of claim 8 wherein said liquid product has a residuality index of less than about 40%. 10. The process of claim 1 further comprising the step of vacuuming said carpet or said large fabric coverings. 11. The process of claim 10 wherein at least 40% of said liquid product is left to dry onto said carpet or said large fabric coverings prior to the step of vacuuming said carpet or said large fabric coverings. ign of an integrated circuit, the nthdesign of the integrated circuit comprising an nthset of metal leads; calculating a mean time to failure for each metal lead in a first set of metal leads; wherein the mean time to failure is a function of the current density; calculating a reliability of each metal lead in the first set of metal leads; calculating a first reliability of the integrated circuit wherein the first set of metal leads are connected in series, wherein due to the series connection the failure of one metal lead of the nthset of metal leads causes the integrated circuit to fail, wherein calculating a first reliability of the integrated circuit is based on the mean time to failure for each set of metal leads and wherein calculating a first reliability of the integrated circuit is based on calculating a reliability of each metal lead in the first set of metal leads; and arranging the nthset of metal leads by reliability, wherein arranging the nthset of metal leads by reliability allows calculation of a number of metal leads to be redesigned. 2. The method of designing an integrated circuit as recited in claim 1, further comprising: calculating a minimum number of metal leads to repair to satisfy a predetermined reliability of the integrated circuit. 3. The method of designing an integrated circuit as recited in claim 1, further comprising: dividing the nthset of metal leads into a plurality of subsets, the plurality of subsets comprising: a first subset; and a second subset, wherein the lowest reliability of the metal leads contained in the second subset is greater than the highest reliability of the metal leads contained in the first subset. 4. The method of designing an integrated circuit as recited in claim 3, further comprising: providing an nth+1 design based on repairing a first metal lead in the first subset, wherein repairing a first metal lead in the first subset includes reducing the current density of a metal lead included in the first subset. 5. The method of designing an integrated circuit as recited in claim 3, further comprising: sorting the metal leads in the nthdesign, the metal leads in the nthdesign sorted by reliability; wherein ascending order places a first metal lead with a first reliability having a first index; a second metal lead with a second reliability having a second index wherein the first reliability is less than the second reliability and the first index is less than the second index, wherein the reliability of metal lead in the second subset is sufficient to meet a predetermined reliability of a system, wherein the reliability of a metal lead in the second subset is constant and wherein the reliability of the metal leads in the first subset is less than the reliability sufficient to meet a predetermined reliability of a system. 6. The method of designing an integrated circuit as recited in claim 5, further comprising: increasing incrementally the reliability of the first metal lead and the second metal lead in the first subset until the reliability of the integrated circuit is greater than or equal to a predetermined reliability, wherein a first metal lead and a second metal lead in the second subset have equal reliability. 7. The method of designing an integrated circuit as recited in claim 6, further comprising: calculating a mean time to failure of first subset of metal leads. 8. The method of designing an integrated circuit as recited in claim 7, further comprising: calculating the amount by which to widen the metal leads in the first subset to meet a predetermined reliability of the integrated circuit. 9. An integrated circuit designed by a method, the method comprising: calculating a current density for each metal lead in an nthdesign for the integrated circuit, wherein the nthdesign of the integrated circuit