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Method and apparatus for cooling electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0118279 (2002-04-08)
발명자 / 주소
  • Pautsch, Gregory W.
출원인 / 주소
  • Cray Inc.
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 51  인용 특허 : 26

초록

A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic compon

대표청구항

A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic compon

이 특허에 인용된 특허 (26)

  1. Limper-Brenner Linda ; Schmidt Detlef W. ; McDunn Kevin J. ; Press Minoo D., Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic comp.
  2. McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.
  3. Daikoku Takahiro (Ushiku JPX) Inouye Hiroshi (Ibaraki JPX), Apparatus for cooling heat generating members.
  4. Kobrinetz Anthony ; Bullock Michael K., Circuit board apparatus and apparatus and method for spray-cooling an electronic component.
  5. Jose Javier Macias ; Rogelio Hernandez Silva, Computer enclosure cooling unit.
  6. Kadota Shigeru,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Yamada Kenji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  7. Daikoku Takahiro (Ushiku JPX) Takagi Ryuichi (Tokyo JPX), Cooling system and method for electronic circuit devices.
  8. Tilton Charles L. ; Smetana Bruce A, EMI shielding fluid control apparatus.
  9. Koizumi Shigeru (Hadano JPX) Zushi Shizuo (Hadano JPX) Komiya Mitsuo (Hadano JPX), Electronic apparatus and method of cooling the same.
  10. Przilas Mark B. ; Mimlitch ; III Robert H. ; Bruce Robert A., Environmentally isolated enclosure for electronic components.
  11. Cray Seymour R. (Colorado Springs CO) Sherwood Gregory J. (Colorado Springs CO), Gas-liquid forced turbulence cooling.
  12. Havey Mort L. ; Hitch William Robert, Heat spreader system for cooling heat generating components.
  13. Tilton Donald E. (Kent WA) Tilton Charles L. (Kent WA), High heat flux evaporative spray cooling.
  14. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  15. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
  16. Sherwood Gregory J. (Colorado Springs CO) Quaderer Chris M. (Colorado Springs CO), Logic module assembly for confining and directing the flow of cooling fluid.
  17. Cromwell S. Daniel ; Nobi Laszlo, Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management.
  18. Root Loren F. ; McDunn Kevin J., Method for spray-cooling a tunable semiconductor device.
  19. Edwards Michael Ray ; Morris Garron Koch ; Estes Kurt Arthur ; Pais Martin, Multi-mode, two-phase cooling module.
  20. Simmons Frederick J. (Neillsville WI) Chen Steve S. (Chippewa Falls WI) Pautsch Greg W. (Chippewa Falls WI) Rabska Michael H. (Eau Claire WI) Girling Dennis F. (Cadott WI) Paffel Douglas C. (Stanley , Packaging architecture for a highly parallel multiprocessor system.
  21. McDunn Kevin J. ; Limper-Brenner Linda, Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device.
  22. Tennant David T. ; McDunn Kevin J. ; Limper-Brenner Linda ; Bullock Michael K., Radio frequency filter and apparatus and method for cooling a heat source using a radio frequency filter.
  23. Tilton Donald E. ; Seaney Kevin D. ; Baddeley Ryan J ; Tilton Charles L, Spray cooled circuit card cage.
  24. Hileman Vince P., Spray cooled module with removable spray cooled sub-module.
  25. Chandrakant D. Patel ; Cullen E. Bash, Spray cooling system.
  26. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.

이 특허를 인용한 특허 (51)

  1. Soffer, Aviv, 3-dimensional multi-layered modular computer architecture.
  2. Soffer, Aviv, 3-dimensional multi-layered modular computer architecture.
  3. Pfeifer, David W.; Kasunich, John M.; Sheppard, Richard, Bus bar assembly for use with a compact power conversion assembly.
  4. Attlesey, Chad Daniel, Case and rack system for liquid submersion cooling of electronic devices connected in an array.
  5. Attlesey, Chad Daniel, Case and rack system for liquid submersion cooling of electronic devices connected in an array.
  6. Dede, Ercan Mehmet; Liu, Yan, Cold plate assemblies and power electronics modules.
  7. Pfeifer, David W.; Kasunich, John M.; Sheppard, Richard, Compact liquid converter assembly.
  8. Pfeifer,David W.; Kasunich,John; Sheppard,Richard, Compact liquid converter assembly.
  9. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths.
  10. Strobel, Kurt Richard; Morozov, Igor G., Cooling apparatus for electronics.
  11. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
  12. Dede, Ercan Mehmet; Liu, Yan, Cooling apparatuses and power electronics modules.
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
  14. Byers, Charles C.; Scofield, William H., Cooling manifold.
  15. Stefanoski,Zoran, Cooling system for computer hardware.
  16. Pfeifer, David W.; Kasunich, John M., Elongated heat sink for use in converter assemblies.
  17. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  18. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  19. Dede, Ercan Mehmet; Liu, Yan, Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same.
  20. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  21. Nori,Hitoshi; Wei,Jie, High efficiency cooling system and heat absorbing unit.
  22. Joshi, Shailesh N., Jet impingement cooling apparatuses having enhanced heat transfer assemblies.
  23. Dede, Ercan Mehmet, Jet impingement heat exchanger apparatuses and power electronics modules.
  24. Pfeifer, David W.; Kasunich, John M.; Sheppard, Richard, Laminated bus bar for use with a power conversion configuration.
  25. Leija,Javier; Lucero,Christopher D.; Gonzales,Christopher A., Liquid cooling system including hot-swappable components.
  26. Attlesey, Chad D., Liquid submersion cooled data storage or memory system.
  27. Attlesey, Chad D., Liquid submersion cooled electronic system.
  28. Attlesey, Chad D., Liquid submersion cooled network electronics.
  29. Attlesey, Chad D., Liquid submersion cooled power supply system.
  30. Lee,Tsung Lung; Wang,Dong; He,Li; Wang,ShengHua; Gu,Jian Hua; Liu,Zhi Gang, Liquid-cooled heat sink assembly.
  31. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  32. Hall,Shawn A.; Tian,Shurong; Coteus,Paul W.; Karidis,John P.; Colgan,Evan G.; Guernsey, Jr.,Robert W., Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling.
  33. Hall,Shawn A.; Tian,Shurong; Coteus,Paul W.; Karidis,John P.; Colgan,Evan G.; Guernsey, Jr.,Robert W., Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling.
  34. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  35. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  36. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
  37. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  38. Harvilchuck, Laurence A.; Worrall, Alex Carl, Modular cooling system.
  39. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
  40. Dede, Ercan Mehmet, Power electronics card assemblies, power electronics modules, and power electronics devices.
  41. Dede, Ercan Mehmet, Power electronics modules and power electronics module assemblies.
  42. Lin,Saul, Power regulator with a bypass and splice capability.
  43. Knudsen, Corey; McDaniel, Kent T.; Smith, Bradley J.; Pautsch, Gregory W.; Lakin, Eric D., Rack mounted electronics having connectors with heat cooling fingers.
  44. Attlesey, Chad D., Rack mounted liquid submersion cooled electronic system.
  45. Lucero,Christopher D.; Leija,Javier, Reconfigurable airflow director for modular blade chassis.
  46. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
  47. Smith, Larry D.; Hockanson, David, System and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor model.
  48. Crippen,Martin Joseph; Matteson,Jason Aaron; Piazza,William Joseph, System, method, and apparatus for providing a thermal bypass in electronic equipment.
  49. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
  50. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
  51. Rau, Matthew Joseph; Dede, Ercan Mehmet; Joshi, Shailesh N.; Garimella, Suresh V., Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features.
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